Laser assisted machining apparatus with distributed lasers

• US 8,698,041 B2
• Filed: 09/08/2011
• Issued: 04/15/2014
• Est. Priority Date: 09/07/2005
• Status: Expired due to Fees

• Current Assignee: Purdue Research Foundation (The Trustees of Purdue University (d/b/a Purdue University))
• Original Assignee: Purdue Research Foundation (The Trustees of Purdue University (d/b/a Purdue University))
• Inventors: Shin, Yung
• Primary Examiner(s): Evans, Geoffrey S
• Application Number:
  US13/227,920
• Publication Number:
  US 20120024827A1
• Time in Patent Office: 950 Days
• Field of Search: 219/121.76, 219/121.67, 219/121.72, 219/121.62, 219/121.83, 219/121.68, 219/121.69, 219/121.85, 409/132, 409/137, 409/216
• US Class Current: 219/121.76
• CPC Class Codes: B23K 26/0823 Devices involving rotation of the workpiece
• CPC Class Codes: B23P 25/006 Heating the workpiece by laser during machining

Abstract

Laser assisted machining process and machine utilizing multiple distributed laser units that are strategically distributed around the workpiece being machined to simultaneously heat the workpiece, creating a desired temperature distribution for laser assisted machining. Sequential incremental heating from different directions and positions are used, resulting in longer tool life and shorter machining time.

Claims

1. A laser assisted machining apparatus, comprising:

a lathe having a workpiece holder that spins about a rotational axis and a cutting tool holder that moves along a path parallel to the rotational axis of the workpiece holder;

a first laser unit that translates with the cutting tool holder along the path so as to emit a first laser beam at a power output and impinging upon a workpiece in the workpiece holder at a circumferential position about the rotational axis that is substantially ahead of a circumferential position of a cutting tool in the cutting tool holder; and

a second laser unit that translates with the cutting tool holder along the path so as to emit a second laser beam at a power output and impinging upon the workpiece from an axial position behind the cutting tool relative to its travel direction along the path, and at a circumferential position close to and ahead of the circumferential position of the cutting tool and substantially behind the circumferential position of the first laser beam on the workpiece;

wherein the power outputs of the first and second laser beams are independently controlled relative to each other.

2. The laser assisted machining apparatus of claim 1, wherein the second laser unit is arranged such that the second laser beam impinges substantially perpendicularly upon a chamfer formed on the workpiece by the cutting tool.

3. The laser assisted machining apparatus of claim 1, wherein the first laser beam impinges upon the workpiece at an axial position which is axially ahead of the cutting tool relative to a travel direction thereof along the path.

4. The laser assisted machining apparatus of claim 1, wherein the circumferential position of the first laser beam is greater than 45 degrees circumferentially ahead of the cutting tool, and the circumferential position of the second laser beam is less than 15 degrees circumferentially ahead of the cutting tool.

5. A laser assisted machining apparatus utilizing multiple distributed lasers to assist a cutting tool in machining a rotating workpiece, the apparatus comprising:

a cutting tool configured to cut material from the rotating workpiece, thereby creating a circumferential chamfer on the rotating workpiece; and

first and second laser units configured to sequentially, incrementally heat a radially outer portion of the rotating workpiece prior to the cutting tool beginning to remove the radially outer portion, the radially outer portion including part of a surface of the circumferential chamfer, the first laser unit being configured to preheat the radially outer portion by directing a first laser beam onto the surface of the circumferential chamfer at a circumferential position about the rotational axis of the rotating workpiece that is substantially ahead of a circumferential position of the cutting tool about the rotational axis of the rotating workpiece, the second laser unit being configured to further heat the radially outer portion by directing a second laser beam onto the surface of the circumferential chamfer at an angle thereto at a circumferential position in close proximity to the circumferential position of the cutting tool.

6. The laser assisted machining apparatus of claim 5, wherein the apparatus is configured to independently control power outputs of the first and second laser units and control temperature gradients within the workpiece.

7. A laser assisted machining apparatus utilizing multiple distributed lasers to assist a cutting tool in machining a rotating workpiece, the apparatus comprising:

a first laser unit configured to heat the rotating workpiece with a first laser beam directed onto the workpiece at a first point axially ahead of the cutting tool relative to a travel direction thereof on the rotating workpiece, and substantially circumferentially ahead of the cutting tool; and

a second laser unit configured to heat the rotating workpiece with a second laser beam directed onto the workpiece at a second point axially even with the cutting tool and on a chamfer of the workpiece, and circumferentially ahead of the cutting tool and substantially behind the first point;

whereby material on the rotating workpiece is sequentially heated by the first and second laser beams and then cut by the cutting tool;

wherein power outputs of the first and second laser units are independently controlled to control temperature gradients within the workpiece.

8. A laser assisted machining apparatus utilizing multiple distributed lasers to assist a cutting tool in machining a rotating workpiece, the apparatus comprising:

a cutting tool configured to cut material from the rotating workpiece tool, thereby creating a chamfer on the rotating workpiece;

a first laser unit configured to heat the workpiece at a first point circumferentially ahead of the cutting tool; and

a second laser unit configured to heat the chamfer at a second point, circumferentially behind the first point and ahead of the cutting tool, thereby sequentially incrementally heating the rotating workpiece;

wherein the first laser unit comprises a higher-power laser than the second laser unit.

9. The laser assisted machining apparatus of claim 8, wherein the apparatus is configured to independently control power outputs of the first and second laser units and control temperature gradients within the workpiece.