Adhesive-bonded substrates in a multi-chip module
First Claim
1. A multi-chip module (MCM), comprising:
- a first substrate having a first surface, wherein a first set of proximity connectors are disposed on the first surface;
a second substrate having a second surface that faces the first surface, wherein a second set of proximity connectors are disposed on the second surface, wherein the first set of proximity connectors and the second set of proximity connectors are separated by a spacing, wherein the second surface includes a channel that is defined by an opening in the second substrate along the second surface, wherein the channel comprises an inner surface that faces the first surface and is recessed in the second substrate away from the second surface, and wherein the channel extends to an edge of the second substrate that is perpendicular to the second surface; and
an adhesive, mechanically coupled to the first substrate and the inner surface, having a thickness that is larger than the spacing, thereby maintaining alignment and providing shear strength in the MCM, the adhesive configured so that at least the spacing between the first and second surfaces in an area where the first and second sets of proximity connectors are located is free of adhesive.
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Accused Products
Abstract
A multi-chip module (MCM) is described in which at least two substrates are mechanically coupled by an adhesive layer that maintains alignment and a zero (or near zero) spacing between proximity connectors on surfaces of the substrates, thereby facilitating high signal quality during proximity communication between the substrates. In order to provide sufficient shear strength, the adhesive layer has a thickness that is larger than the spacing. This may be accomplished using one or more positive and/or negative features on the substrates. For example, the adhesive may be bonded to: one of the surfaces and an inner surface of a channel that is recessed below the other surface; inner surfaces of channels that are recessed below both of the surfaces; or both of the surfaces. In this last case, the zero (or near zero) spacing may be achieved by disposing proximity connectors on a mesa that protrudes above at least one of the substrate surfaces.
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Citations
20 Claims
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1. A multi-chip module (MCM), comprising:
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a first substrate having a first surface, wherein a first set of proximity connectors are disposed on the first surface; a second substrate having a second surface that faces the first surface, wherein a second set of proximity connectors are disposed on the second surface, wherein the first set of proximity connectors and the second set of proximity connectors are separated by a spacing, wherein the second surface includes a channel that is defined by an opening in the second substrate along the second surface, wherein the channel comprises an inner surface that faces the first surface and is recessed in the second substrate away from the second surface, and wherein the channel extends to an edge of the second substrate that is perpendicular to the second surface; and an adhesive, mechanically coupled to the first substrate and the inner surface, having a thickness that is larger than the spacing, thereby maintaining alignment and providing shear strength in the MCM, the adhesive configured so that at least the spacing between the first and second surfaces in an area where the first and second sets of proximity connectors are located is free of adhesive. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. An MCM, comprising:
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a first substrate having a first surface, wherein a first set of proximity connectors are disposed on the first surface; a second substrate having a second surface that faces the first surface, wherein a mesa having a third surface protrudes above the second surface, wherein the mesa is between edges of the second substrate that are perpendicular to the second surface, wherein the mesa comprises at least one of a semiconductive and an electrically insulating material, wherein a second set of proximity connectors are disposed on the third surface, and wherein the first set of proximity connectors and the second set of proximity connectors are separated by a spacing; and an adhesive, mechanically coupled to the first surface and the second surface and bonded to the first surface and the second surface, having a thickness that is larger than the spacing, thereby maintaining alignment and providing shear strength in the MCM, the adhesive configured so that at least the spacing between the first and second surfaces in an area where the first and second sets of proximity connectors are located is free of adhesive, wherein the adhesive is not in contact with the mesa. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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16. A system, comprising an MCM, wherein the MCM includes:
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a first substrate having a first surface, wherein first proximity connectors are disposed on the first surface; a second substrate having a second surface that faces the first surface, wherein a second set of proximity connectors are disposed on the second surface, wherein the first set of proximity connectors and the second set of proximity connectors are separated by a spacing, wherein the second surface includes a channel that is defined by an opening in the second substrate along the second surface, wherein the channel comprises an inner surface that faces the first surface and is recessed in the second substrate away from the second surface, and wherein the channel extends to an edge of the second substrate that is perpendicular to the second surface; and an adhesive, mechanically coupled to the first substrate and the inner surface, having a thickness that is larger than the spacing, thereby maintaining alignment and providing shear strength in the MCM, the adhesive configured so that at least the spacing between the first and second surfaces in an area where the first and second sets of proximity connectors are located is free of adhesive. - View Dependent Claims (17, 18, 19, 20)
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Specification