Microelectromechanical systems (MEMS) resonators and related apparatus and methods

• US 8,698,376 B2
• Filed: 11/20/2012
• Issued: 04/15/2014
• Est. Priority Date: 04/29/2008
• Status: Active Grant

• Current Assignee: Analog Devices, Inc.
• Original Assignee: Sand 9, Inc. (Analog Devices, Inc.)
• Inventors: Chen, David M., Kuypers, Jan H., Mohanty, Pritiraj, Schoepf, Klaus Juergen, Zolfagharkhani, Guiti, Goodelle, Jason, Rebel, Reimund
• Primary Examiner(s): DOUGHERTY, THOMAS M
• Application Number:
  US13/681,904
• Publication Number:
  US 20130140944A1
• Time in Patent Office: 511 Days
• Field of Search: 310/309, 310/328, 310/340, 310/344, 310/338
• US Class Current: 310/328
• CPC Class Codes: B81B 3/0018 Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
• CPC Class Codes: H01L 2224/11 Manufacturing methods
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H02N 1/006 of the gap-closing type H02N1/004 takes precedence
• CPC Class Codes: H03H 2009/241 Bulk-mode MEMS resonators
• CPC Class Codes: H03H 3/007 for the manufacture of electromechanical resonators or networks
• CPC Class Codes: H03H 9/02007 of bulk acoustic wave devices
• CPC Class Codes: H03H 9/02244 of microelectro-mechanical resonators
• CPC Class Codes: H03H 9/02535 of surface acoustic wave devices
• CPC Class Codes: H10N 30/88 Mounts; Supports; Enclosures; Casings

Abstract

Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

Claims

1. An apparatus, comprising:

a first microelectromechanical systems (MEMS) wafer comprising a first MEMS device; and

a second MEMS wafer comprising a second MEMS device,

wherein the second MEMS wafer is configured to cap the first MEMS wafer, and

wherein the first and second MEMS wafers are bonded together in a face-to-face configuration.

2. The apparatus of claim 1, wherein the first MEMS device is a MEMS resonator and wherein the second MEMS device is a MEMS gyroscope.

3. The apparatus of claim 1, wherein the first and second MEMS wafers are bonded together by a eutectic bond.

4. The apparatus of claim 1, wherein the first MEMS device is configured to be actuated via electrostatic actuation.

5. The apparatus of claim 1, wherein the first MEMS device is a MEMS microphone.

6. The apparatus of claim 1, wherein the second MEMS wafer includes one or more access holes.