Optoelectronic semiconductor component and display means

• US 8,698,385 B2
• Filed: 03/01/2010
• Issued: 04/15/2014
• Est. Priority Date: 03/27/2009
• Status: Active Grant

• Current Assignee: OSRAM OLED GMBH (Ams-Osram AG)
• Original Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Inventors: Brick, Peter, Wittmann, Michael, Weber-Rabsilber, Sven
• Primary Examiner(s): Hanley, Britt D
• Application Number:
  US13/202,252
• Publication Number:
  US 20120001208A1
• Time in Patent Office: 1,506 Days
• Field of Search: None
• US Class Current: 313/498
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/58 Optical field-shaping elements

Abstract

In at least one embodiment, an optoelectronic semiconductor component includes at least two optoelectronic semiconductor chips, which are designed to emit electromagnetic radiation in mutually different wavelength ranges when in operation. The semiconductor chips are mounted on a mounting surface of a common carrier. Furthermore, the optoelectronic semiconductor component contains at least two non-rotationally symmetrical lens bodies, which are designed to shape the radiation into mutually different emission angles in two mutually orthogonal directions parallel to the mounting surface. One of the lens bodies is here associated with or arranged downstream of each of the semiconductor chips in an emission direction.

Claims

1. An optoelectronic semiconductor component comprising:

a carrier;

at least two optoelectronic semiconductor chips which are designed to emit electromagnetic radiation in mutually different wavelength ranges when in operation and which are mounted on a mounting surface of the carrier; and

at least two non-rotationally symmetrical lens bodies which are designed to shape the radiation into mutually different emission angles in two mutually orthogonal directions parallel to the mounting surface,

wherein one of the lens bodies is arranged downstream of each of the semiconductor chips in an emission direction, and

wherein a surface shape of at least one or all of the lens bodies, within a z value deviation of at most 10% of a height of the respective lens body, obeys the following equation;

z(x,y)=−

0.33866x²−

0.93234y²−

0.54136x⁴−

1.25032x²y²+1.78606y⁴+0.50057x⁶+1.27170x⁴y²+0.06042x²y⁴−

4.44960y⁶−

0.10344x⁸+1.56205x⁶y²+6.38833x⁴y⁴+2.05268x²y⁶−

18.7818y⁸−

0.158501x¹⁰−

2.955774x⁸y²−

10.73336x⁶y⁴−

26.66134x⁴y⁶−

2.344646x²y⁸+0.127770y¹⁰.

2. The optoelectronic semiconductor component according to claim 1, wherein an aspect ratio of the lens bodies with regard to the mutually orthogonal directions lies between 0.3 and 0.9 inclusive.

3. The optoelectronic semiconductor component according to claim 1, wherein maximum extents of the lens bodies in the mutually orthogonal directions amount to at most nine times maximum dimensions of the semiconductor chips in corresponding directions.

4. The optoelectronic semiconductor component according to claim 1, wherein the height of the lens bodies is between 0.25 times and 0.95 times, inclusive, a maximum extent of the lens bodies in the mutually orthogonal directions.

5. The optoelectronic semiconductor component according to claim 1, wherein adjacent lens bodies are optically isolated from one another with regard to the radiation emitted by the semiconductor chips.

6. The optoelectronic semiconductor component according to claim 1, wherein a light collection angle of the lens bodies with regard to the radiation emitted by the semiconductor chips amount to at least 145°

in a horizontal direction and to at least 130°

in a vertical direction.

7. The optoelectronic semiconductor component according to claim 1, wherein each lens body has a different shape than the other lens bodies.

8. The optoelectronic semiconductor component according to claim 1, wherein the lens bodies, in plan view of the mounting surface, are arranged in a triangular arrangement.

9. The optoelectronic semiconductor component according to claim 1, further comprising a potting body located between the lens bodies and the semiconductor chips, wherein, when viewed in the emission direction, the lens bodies are located on the potting body.

10. The optoelectronic semiconductor component according to claim 9, wherein all the lens bodies or wherein all the lens bodies and the potting body are made in one piece and comprise the same material.

11. The optoelectronic semiconductor component according to claim 1, further comprising at least one shield against extraneous radiation.

12. A display device with a plurality of pixels, wherein

at least one of the pixels is formed by the optoelectronic semiconductor component according to claim 1, and

a distance between adjacent pixels amounts to between 4 mm and 75 mm inclusive.

13. The optoelectronic semiconductor component according to claim 1, wherein the lens bodies, in plan view of the mounting surface, are arranged in a quadrilateral arrangement.

14. The optoelectronic semiconductor component according to claim 1, wherein the lens bodies, in plan view of the mounting surface, are arranged in a quadrilateral arrangement in which the arrangement comprises a further central lens body.