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Modular sensor node and communications system

  • US 8,700,924 B2
  • Filed: 05/20/2009
  • Issued: 04/15/2014
  • Est. Priority Date: 05/21/2008
  • Status: Active Grant
First Claim
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1. A sensor node comprising:

  • a core component configured to enable modular manufacture of the sensor node, the core component including;

    a power interface configured to selectively physically connect the core component to any one of a plurality of types of power components when assembling the sensor node, wherein the plurality of types of power components include at least one direct current power component and at least one alternating current power component;

    a sensor interface configured to selectively physically connect the core component to any one of a plurality of types of sensor components when assembling the sensor node;

    a microprocessor configured to process sensor data; and

    a wireless transceiver configured to communicate data;

    a sensor component connected to the sensor interface, the sensor component including at least one sensor for acquiring the sensor data; and

    a power component connected to the power interface, wherein the power component is configured to supply at least one of;

    direct current power or alternating current power to the sensor node.

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