Electrochemical fabrication method including elastic joining of structures

• US 8,702,955 B2
• Filed: 11/02/2011
• Issued: 04/22/2014
• Est. Priority Date: 05/07/2002
• Status: Active Grant

• Current Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Original Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Inventors: Cohen, Adam L., Arat, Vacit, Lockard, Michael S., Smalley, Dennis R.
• Primary Examiner(s): Hendricks, Keith
• Assistant Examiner(s): Sherrill, Stefanie
• Application Number:
  US13/287,437
• Publication Number:
  US 20120137497A1
• Time in Patent Office: 902 Days
• Field of Search: 205/118
• US Class Current: 205/118
• CPC Class Codes: B29C 65/56 using mechanical means or mechanical connections, e.g. form-fits
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: C25D 5/02 Electroplating of selected surface areas
• CPC Class Codes: Y10T 29/49885 with coating before or during assembling

Abstract

Embodiments are directed to methods for forming multi-layer three-dimensional structures involving the joining of at least two structural elements, at least one of which is formed as a multi-layer three-dimensional structure, wherein the joining occurs via one of: (1) elastic deformation and elastic recovery and subsequent retention of elements relative to each other, (2) relative deformation of an initial portion of at least one element relative to another portion of the at least one element until the at least two elements are in a desired retention position after which the deformation is reduced or eliminated and a portion of at least one element is brought into position which in turn locks the at least two elements together via contact with one another including contact with the initial portion of at least one element, or (3) moving a retention region of one element into the retention region of the other element, without deformation of either element, along a path including a loading region of the other element and wherein during normal use the first and second elements are configured relative to one another so that the loading region of the second elements is not accessible to the retention region of the first element.

Claims

1. A method for forming a multi-element three-dimensional structure, comprising:

(A) forming a first element of the multi-element three-dimensional structure from a plurality of successively formed layers, wherein each successive layer comprises at least two materials and is formed on and adhered to a previously formed layer, one of the at least two materials is a structural material and the other of the at least two materials is a sacrificial material, and wherein each successive layer defines a successive cross-section of the first element of the three-dimensional structure, and wherein the forming of each of the plurality of successive layers comprises;

(i) depositing a first of the at least two materials;

(ii) depositing a second of the at least two materials;

(iii) planarizing the first and second materials; and

(B) after the forming of the plurality of successive layers, separating at least a portion of the sacrificial material from multiple layers of the structural material to reveal the first element of the multi-element three-dimensional structure;

(C) supplying at least one second element of the multi-element three-dimensional structure;

(D) supplying a third element of the multi-element three-dimensional structure; and

(E) bringing the first and at least one second elements into contact with one another and elastically deforming at least an initial deformation portion of at least one of the first and at least one second elements relative to the other of the first and the at least one second elements to bring the first and the at least one second elements into a desired retention configuration which is maintained at least in part by the structural strength of the first and the at least one second elements and the at least partial reformation of the deformation portion as the elements move into the retention configuration;

(F) bringing the at least one second and third elements into contact with one another and elastically deforming at least an initial deformation portion of at least one of the at least one second and third elements relative to the other of the at least one second and third elements to bring the at least one second and third elements into a desired retention configuration which is maintained at least in part by the structural strength of the at least one second and third elements and the at least partial reformation of the deformation portion as the second and third elements move into the retention configuration,

wherein the first, second, and third elements are held in a retention configuration relative to one another, and wherein the depositing at least one of the two materials is by electroplating.

2. The method of claim 1 wherein only one of the first element, at least one second element, and third elements is formed from a plurality of adhered layers.

3. The method of claim 1 wherein at least two of the first element, at least one second element, and third elements are formed from a plurality of adhered layers.

4. The method of claim 1 wherein only one of the first element and the at least one second element and one of the at least one second element and third element are deformed during the elastic deforming by an amount which is greater than a tolerance used in forming the physical dimensions of the respective elements.

5. The method of claim 1 wherein the first and third elements remain movable relative to each other after moving into their respective retention configurations relative to the at least one second element.

6. The method of claim 1 wherein the first and third elements become fixed relative to each other after moving into their respective retention configurations relative to the at least one second element.

7. The method of claim 1 wherein the first and third elements are linked to one another prior to joining via a linkage that undergoes plastic deformation as the first and third elements are brought into their respective retention configurations relative to the at least one second element.

8. The method of claim 1 wherein the first and third elements are not connected to one another prior to bringing them into their respective retention configurations relative to the at least one second element.

9. The method of claim 1 wherein the first element is also separated from a substrate on which it was formed.

17. The method of claim 1 wherein the at least one second element comprises a dielectric.

18. The method of claim 17 additionally comprising locating a filler material in a spacing between the first and third elements.

10. A method for forming a multi-element three-dimensional structure, comprising:

(A) forming a first element of the multi-element three-dimensional structure from a plurality of successively formed layers, wherein each successive layer comprises at least two materials and is formed on and adhered to a previously formed layer, wherein one of the at least two materials is a structural material and the other of the least two materials is a sacrificial material, and wherein each successive layer defines a successive cross-section of the first element of the three-dimensional structure, and wherein the forming of each of the plurality of successive layers comprises;

(i) depositing a first of the at least two materials;

(ii) depositing a second of the at least two materials;

(iii) planarizing the first and second materials; and

(B) after the forming of the plurality of successive layers, separating at least a portion of the sacrificial material from multiple layers of the structural material to reveal the first element of the multi-element three-dimensional structure;

(C) supplying at least one second element of the multi-element three-dimensional structure;

(D) supplying a third element of the multi-element three-dimensional structure;

(E) deforming at least a deformation portion of at least one of the first, second, and third elements and bringing the first, second, and third elements into a desired retention position;

(F) reducing or eliminating the deformation as or after the first element and the at least one second element, the at least one second element and the third element, or all of the first, at least one second, and third elements are brought into their respective retention positions such that the first element is directly coupled to the at least one second element and the at least one second element is directly coupled to the third element;

(G) moving at least one locking element into position to strengthen the deformation portion of the at least one of the first element, the at least one second element, and third element after the first element and the at least one second element, the at least one second element and third element, or all of the first, second, and third elements are brought into their respective retention positions so that at least one of the first element and at least one second element or at least one second element and third element are more strongly locked together in their respective retention positions than they otherwise would be in the absence of the locking element, and wherein the depositing at least one of the two materials is by electroplating.

11. The method of claim 10 wherein only one of the first element, at least one second element, and third element are formed from a plurality of adhered layers.

12. The method of claim 10 wherein at least two of the first element, at least one second elements, and third element are formed from a plurality of adhered layers.

13. The method of claim 10 wherein only one of the first element, at least one second element, and third element are deformed during the elastic deforming by an amount which is greater than a tolerance used in forming the physical dimensions of the respective element.

14. The method of claim 10 wherein at least two of the first element, the at least one second element, and the third element are deformed during the elastic deforming by amounts greater than a tolerance used in forming the physical dimensions of the respective elements.

15. The method of claim 10 wherein the first and third elements remain movable relative to each other after moving into their respective retention positions.

16. The method of claim 10 wherein the first and third elements become fixed relative to each other after moving into their respective retention positions.

19. The method of claim 10 wherein the at least one second element comprises a dielectric.

20. The method of claim 19 additionally comprising locating a filler material in a spacing between the first and third elements.