Structure and manufacturing method for high resolution camera module

• US 8,703,519 B1
• Filed: 03/12/2013
• Issued: 04/22/2014
• Est. Priority Date: 10/09/2012
• Status: Active Grant

• Current Assignee: Tong Hsing Electronic Industries, Ltd.
• Original Assignee: Kingpak Technology Inc.
• Inventors: HUANG, Chun-Lung, Tu, Hsiu-Wen, Wu, Cheng-Chang, Yang, Chung-Yu, WANG, Rong-Chang, YANG, Jo-Wei
• Primary Examiner(s): NIKMANESH, SEAHVOSH J
• Application Number:
  US13/796,622
• Publication Number:
  US 20140098287A1
• Time in Patent Office: 406 Days
• Field of Search: None
• US Class Current: 438/64
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

The present invention discloses a structure and a manufacturing method for a high-resolution camera module, wherein the method includes the following steps: providing an image sensor wafer comprising multiple image sensor chips; performing inspection and defining if each image sensor chip is a good chip; disposing an optical cover on the image sensor chip defined as the good chip, wherein the optical cover faces a sensing area and does not cover conductive contacts; cutting the image sensor wafer to obtain the discrete image sensor chip covered with the optical cover; and disposing a first surface of the divided image sensor chip on a bottom surface of a ceramic substrate. The present invention can seal the high resolution camera module during early stage of the manufacturing process to improve the yield rate of the camera module, and downsize the camera module effectively.

Claims

1. A method for making a high-resolution camera module comprising the steps of:

providing an image sensor wafer, wherein the image sensor wafer comprises a plurality of image sensor chips, each image sensor chip includes a first surface, a second surface, and a plurality of conductive contacts, wherein the first surface has a sensing area surrounded by the plurality of conductive contacts;

performing an inspection to inspect and define if each image sensor chip is a good chip;

disposing an optical cover on the first surface of the image sensor chip defined as the good chip, wherein the optical cover faces the sensing area and does not cover the conductive contacts, and the surface of the optical cover is smaller than the surface of the image sensor chip;

cutting the image sensor wafer to obtain the discrete image sensor chip covered with the optical cover;

disposing the image sensor chip on a ceramic substrate, wherein the ceramic substrate has a hollow portion, a bottom surface, and a top surface, a horizontal area of the hollow portion is larger than the surface of the optical cover, the first surface of the divided image sensor chip is adhered and disposed to the bottom surface and faces the hollow portion, and the conductive contacts of the image sensor chip are electrically connected to the ceramic substrate; and

forming a packaging portion to cover a periphery of the image sensor chip and connection between the image sensor chip and the ceramic substrate.

2. The method of claim 1, wherein the step of disposing the optical cover comprises:

a substep of applying an adhesive on the image sensor chip, wherein the adhesive is applied on the first surface and on a region between the sensing area and the conductive contacts; and

a substep of disposing the optical cover onto the image sensor chip for bonding the optical cover on the image sensor chip with the adhesive.

3. The method of claim 2, wherein the adhesive is further mixed with ball spacers.

4. The method of claim 2, wherein the adhesive shows a closed loop pattern.

5. The method of claim 1, wherein the step of disposing the optical cover comprises:

a substep of providing a dam on the optical cover, wherein the dam is a closed loop structure and provided on a periphery of a third surface of the optical cover, and the third surface faces the image sensor chip; and

a substep of disposing the optical cover on the image sensor chip, wherein an adhesive is pre-applied on the first surface between the sensing area and the conductive contacts in a closed loop pattern, and the optical cover is bonded to the image sensor chip by the adhesive.

6. The method of claim 5, wherein the dam is made of glass, ceramic, liquid crystal polymer, molding compound, siloxane based polymer, photosensitive dry film, or solder mask.

7. The method of claim 5, wherein a frame flange is formed on an outer peripheral edge of an upper surface of the dam and combined with lateral side of the optical cover, a depression is formed on an inside of the dam, and an opening is formed between the optical cover and the frame flange;

and the method further comprises a step of sealing the opening for sealing the opening with a sealant.

8. The method of claim 7, wherein the dam is made of glass, ceramic, liquid crystal polymer, molding compound, siloxane based polymer, photosensitive dry film, or solder mask.

9. The method of claim 2, wherein the adhesive shows a C shape pattern with an opening;

and the method further comprises a step of sealing the opening for sealing the opening with a sealant.

10. The method of claim 2, wherein the adhesive shows two L shape patterns, and the L shape patterns are disposed correspondingly to form a square pattern with two openings in two diagonal corners;

and the method further comprises a step of sealing the opening for sealing the opening with a sealant.