LED light source and method of manufacturing the same

• US 8,704,245 B2
• Filed: 03/28/2012
• Issued: 04/22/2014
• Est. Priority Date: 09/20/2005
• Status: Active Grant

• Current Assignee: Renesas Electronics Corporation
• Original Assignee: Renesas Electronics Corporation
• Inventors: Isobe, Hiroyuki
• Primary Examiner(s): Tran, Long K
• Assistant Examiner(s): KLEIN, JORDAN M
• Application Number:
  US13/432,943
• Publication Number:
  US 20120187429A1
• Time in Patent Office: 755 Days
• Field of Search: 257/88, 257/E33.065, 257/E33.066, 257/89, 257/92
• US Class Current: 257/88
• CPC Class Codes: F21K 9/90 Methods of manufacture
• CPC Class Codes: F21Y 2103/10 comprising a linear array of point-like light-generating elements
• CPC Class Codes: F21Y 2113/13 comprising an assembly of point-like light sources
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G02F 1/133603 with LEDs
• CPC Class Codes: G02F 1/133621 providing coloured light G02F1/133617, G02F1/133533 take precedence
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 33/08 with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body H01L27/15 takes precedence
• CPC Class Codes: H01L 33/36 characterised by the electrodes

Abstract

After the LEDs 2 (red LEDs (R), green LEDs (G) and blue LEDs (B), or white LEDs (W)) are mounted on the frame 3, without dicing the frame 3 for dividing the LEDs 2 into pieces, the tie bar is punched off to form an electric circuit. Thus, the RGB three primary color LED light source 1A or the white LED light source 1B that emits light in the state of the frame 3 can be manufactured.

Claims

1. A LED light source comprising:

a first LED chip having a first electrode surface and a second electrode surface opposite to the first electrode surface;

a second LED chip having a third electrode surface and a fourth electrode surface opposite to the third electrode surface;

a first die bonding area of a first electrode electrically connected to the first electrode surface of the first LED chip;

a second die bonding area of the first electrode electrically connected to the third electrode surface of the second LED chip;

a first wire bonding area opposite to the first die bonding area electrically connected to the second electrode surface of the first LED chip;

a second wire bonding area opposite to the second die bonding area electrically connected to the fourth electrode surface of the second LED chip;

a first sealed resin comprising the first LED chip, the first die bonding area, and the first wire bonding area; and

a second sealed resin comprising the second LED chip, the second die bonding area, and the second wire bonding area,

wherein the first electrode surface and the third electrode surface have a first polarity characteristic,

wherein the second electrode surface and the fourth electrode surface have a second polarity characteristic,

wherein the first wire bonding area, the first die bonding area, the second wire bonding area, and the second die bonding area are aligned in a first direction, and

wherein the first sealed resin and the second sealed resin are separated a gap.

2. The LED light source according to claim 1,

wherein the first electrode has a first side and a second side opposite to the first side,

wherein a plurality of said first LED chips is arranged along the first side of the first electrode, and

wherein a plurality of said second LED chips is arranged along the second side of the first electrode.

3. The LED light source according to claim 1,

wherein the second electrode surface of the first LED chip and the fourth electrode surface of the second LED chip are connected to a second electrode,

wherein the first electrode surface of the first LED chip and the third electrode surface of the second LED chip are cathodes,

wherein the second electrode surface of the first LED chip and the fourth electrode surface of the second LED chip are anodes,

wherein the first electrode is adapted to receive a ground voltage or a negative voltage, and

wherein the second electrode is adapted to receive a positive voltage.

4. The LED light source according to claim 1,

wherein the second electrode surface of the first LED chip and the fourth electrode surface of the second LED chip are connected to a second electrode,

wherein the first electrode surface of the first LED chip and the third electrode surface of the second LED chip are anodes,

wherein the second electrode surface of the first LED chip and the fourth electrode surface of the second LED chip are cathodes,

wherein the second electrode is adapted to receive a ground voltage or a negative voltage, and

wherein the first electrode is adapted to receive a positive voltage.

5. The LED light source according to claim 1,

wherein the first LED chip is a first color LED chip, a second color LED chip, or a third color LED chip, and

wherein the second LED chip is the second color LED chip or the third color LED chip.

6. The LED light source according to claim 1,

wherein the second electrode surface of the first LED chip is connected to the first wire bonding area via a first bonding wire.

7. The LED light source according to claim 1,

wherein first bonding wire is in the first sealed resin.

8. The LED light source according to claim 1,

wherein the fourth electrode surface of the second LED chip is connected to the second wire bonding area via a second bonding wire.

9. The LED light source according to claim 8,

wherein second bonding wire is in the second sealed resin.

10. The LED light source according to claim 1,

wherein the first wire bonding area, the first die bonding area, the second wire bonding area, and the second die bonding area are arranged in a straight line.

11. A LED light source comprising:

a first LED chip having a first electrode surface and a second electrode surface opposite to the first electrode surface;

a second LED chip having a third electrode surface and a fourth electrode surface opposite to the third electrode surface;

a first die bonding area of a first electrode electrically connected to the first electrode surface of the first LED chip;

a second die bonding area of the first electrode electrically connected to the third electrode surface of the second LED chip;

a first wire bonding area opposite to the first die bonding area electrically connected to the second electrode surface of the first LED chip;

a second wire bonding area opposite to the second die bonding area electrically connected to the fourth electrode surface of the second LED chip;

a first sealed resin comprising the first LED chip, the first die bonding area, and the first wire bonding area; and

a second sealed resin comprising the second LED chip, the second die bonding area, and the second wire bonding area,

wherein the first electrode surface and the third electrode surface have a first polarity characteristic,

wherein the second electrode surface and the fourth electrode surface have a second polarity characteristic, and

wherein the first wire bonding area, the first die bonding area, the second wire bonding area, and the second die bonding area are arranged in a straight line.

12. The LED light source according to claim 11, wherein the second electrode surface of the first LED chip is connected to the first wire bonding area via a first bonding wire.

13. The LED light source according to claim 12, wherein the first bonding wire is in the first sealed resin.

14. The LED light source according to claim 13, wherein the fourth electrode surface of the second LED chip is connected to the second wire bonding area via a second bonding wire.

15. The LED light source according to claim 14, wherein the second bonding wire is in the second sealed resin.

16. The LED light source according to claim 15,

wherein the first electrode has a first side and a second side opposite to the first side,

wherein a plurality of said first LED chips is arranged along the first side of the first electrode, and

wherein a plurality of said second LED chips is arranged along the second side of the first electrode.

17. The LED light source according to claim 11, wherein the first sealed resin and the second sealed resin are separated by a gap.