Semiconductor packages with thermal dissipation structures and EMI shielding
First Claim
1. A semiconductor package, comprising:
- a substrate having a grounding element;
a semiconductor chip disposed on the substrate, the semiconductor chip having a plurality of bond pads;
a package body encapsulating the semiconductor chip;
a recess in the package body that exposes at least a portion of an upper surface of the semiconductor chip;
a conductive connecting element disposed in the recess between at least two of the bond pads, wherein the conductive connecting element extends beyond a lateral edge of the semiconductor chip; and
a conductive layer disposed over an outer surface of the package body, wherein the conductive layer directly contacts the conductive connecting element and the grounding element;
wherein a combination of the conductive element and the conductive layer provides thermal dissipation and electromagnetic interference (EMI) shielding for the semiconductor package.
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Accused Products
Abstract
Semiconductor packages and related methods. The semiconductor package includes a substrate, a semiconductor chip, a package body, a recess and a conductive layer. The substrate includes a grounding element. The semiconductor chip is disposed on the substrate and has a lateral surface and an upper surface. The package body encapsulates the lateral surface of the semiconductor chip. The recess is formed in the package body and exposes the upper surface of the semiconductor chip. The conductive layer covers an outer surface of the package body, the grounding element and the upper surface of the semiconductor chip exposed by the recess to provide both thermal dissipation and EMI shielding for the semiconductor chip.
225 Citations
19 Claims
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1. A semiconductor package, comprising:
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a substrate having a grounding element; a semiconductor chip disposed on the substrate, the semiconductor chip having a plurality of bond pads; a package body encapsulating the semiconductor chip; a recess in the package body that exposes at least a portion of an upper surface of the semiconductor chip; a conductive connecting element disposed in the recess between at least two of the bond pads, wherein the conductive connecting element extends beyond a lateral edge of the semiconductor chip; and a conductive layer disposed over an outer surface of the package body, wherein the conductive layer directly contacts the conductive connecting element and the grounding element; wherein a combination of the conductive element and the conductive layer provides thermal dissipation and electromagnetic interference (EMI) shielding for the semiconductor package. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A semiconductor package, comprising:
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a substrate having a grounding element, wherein the grounding element comprises a partial via having a sidewall that is exposed from the substrate; a semiconductor chip disposed on the substrate, the semiconductor chip having a plurality of bond pads; a package body encapsulating the semiconductor chip; a recess in the package body that exposes at least a portion of the upper surface of the semiconductor chip; means coupled to the upper surfaces of the semiconductor chip and the package body for providing thermal dissipation and electromagnetic interference (EMI) shielding for the semiconductor package. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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17. A method of making a semiconductor package, the method comprising:
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disposing a semiconductor chip on a substrate, wherein the semiconductor chip has a lateral surface and an upper surface, and the substrate comprises a grounding element; forming a package body encapsulating the lateral surface of the semiconductor chip, wherein the package body defines a recess exposing the upper surface of the semiconductor chip; singulating the package body, the substrate, and the grounding element to expose a sidewall of the grounding element; and forming a conductive layer covering an outer surface of the package body and the upper surface of the semiconductor chip exposed by the recess, and contacting the exposed grounding element. - View Dependent Claims (18, 19)
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Specification