Top port surface mount silicon condenser microphone package
First Claim
1. A solder reflow surface mount microelectromechanical system (MEMS) microphone device comprising:
- a substrate having a planar upper surface and a planar lower surface, the upper surface having an interior region and a peripheral region that completely surrounds the interior region, each substrate further comprising;
a first plurality of metal pads formed on the upper surface of the substrate;
a second plurality of metal pads formed on the lower surface of the substrate and arranged within a perimeter of the lower surface of the substrate, wherein the second plurality of metal pads are configured to mechanically attach and electrically couple the surface mount MEMS microphone device to pads on a surface of an external printed circuit board; and
one or more electrical pathways formed completely within the substrate, wherein the pathways electrically couple one or more of the first plurality of metal pads on the upper surface of the substrate to one or more of the second plurality of metal pads on the lower surface of the substrate;
a MEMS microphone die mounted to the upper surface of the substrate and electrically coupled to at least one of the first plurality of metal pads on the upper surface of the substrate; and
a single-piece cover that has a top region with an acoustic port that passes completely through the cover, and a sidewall region, the sidewall region adjoining the top region at a substantially perpendicular angle and having a predetermined height, an exterior surface, an interior surface, and a bottom surface,wherein the bottom surface of the sidewall region is aligned with and attached to the peripheral region of the upper surface of the substrate, thereby forming a protective enclosure for the MEMS microphone die that reduces electromagnetic interference, andwherein the predetermined height and interior surface of the sidewall region and interior surface of the top region, in cooperation with the interior region of the upper surface of the substrate, defines an acoustic chamber for the MEMS microphone die.
1 Assignment
0 Petitions
Accused Products
Abstract
The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device'"'"'s printed circuit board and for making electrical connections between package and the device'"'"'s printed circuit board.
-
Citations
30 Claims
-
1. A solder reflow surface mount microelectromechanical system (MEMS) microphone device comprising:
-
a substrate having a planar upper surface and a planar lower surface, the upper surface having an interior region and a peripheral region that completely surrounds the interior region, each substrate further comprising; a first plurality of metal pads formed on the upper surface of the substrate; a second plurality of metal pads formed on the lower surface of the substrate and arranged within a perimeter of the lower surface of the substrate, wherein the second plurality of metal pads are configured to mechanically attach and electrically couple the surface mount MEMS microphone device to pads on a surface of an external printed circuit board; and one or more electrical pathways formed completely within the substrate, wherein the pathways electrically couple one or more of the first plurality of metal pads on the upper surface of the substrate to one or more of the second plurality of metal pads on the lower surface of the substrate; a MEMS microphone die mounted to the upper surface of the substrate and electrically coupled to at least one of the first plurality of metal pads on the upper surface of the substrate; and a single-piece cover that has a top region with an acoustic port that passes completely through the cover, and a sidewall region, the sidewall region adjoining the top region at a substantially perpendicular angle and having a predetermined height, an exterior surface, an interior surface, and a bottom surface, wherein the bottom surface of the sidewall region is aligned with and attached to the peripheral region of the upper surface of the substrate, thereby forming a protective enclosure for the MEMS microphone die that reduces electromagnetic interference, and wherein the predetermined height and interior surface of the sidewall region and interior surface of the top region, in cooperation with the interior region of the upper surface of the substrate, defines an acoustic chamber for the MEMS microphone die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
-
9. A surface mount microelectromechanical system (MEMS) microphone device comprising:
-
a printed circuit board comprising multiple layers of non-conductive material and having a planar upper surface and a planar lower surface, the upper surface having an interior region and a peripheral region that completely surrounds the interior region, the printed circuit board comprising; a first plurality of metal pads formed on the upper surface of the printed circuit board; a second plurality of metal pads formed on the lower surface of the printed circuit board and arranged within a perimeter of the lower surface of the printed circuit board, wherein the second plurality of metal pads are configured to mechanically attach and electrically couple the surface mount MEMS microphone device to pads on a surface of an external printed circuit board; and one or more electrical pathways formed completely within the printed circuit board, wherein the pathways electrically couple one or more of the first plurality of metal pads on the upper surface of the printed circuit board to one or more of the second plurality of metal pads on the lower surface of the printed circuit board; a MEMS microphone die mounted to the upper surface of the printed circuit board and electrically coupled to at least one of the first plurality of metal pads on the upper surface of the printed circuit board; and a single-piece cover that has a top region with an acoustic port that passes completely through the cover, and a sidewall region, the sidewall region adjoining the top region at a substantially perpendicular angle and having a predetermined height, an exterior surface, an interior surface, and a bottom surface, wherein the bottom surface of the sidewall region is aligned with and mechanically attached to the peripheral region of the upper surface of the printed circuit board, thereby forming a protective enclosure for the MEMS microphone die that reduces electromagnetic interference, and wherein the predetermined height and interior surface of the sidewall region, in cooperation with the interior surface of the top region, defines an acoustic chamber for the MEMS microphone die; wherein the cover has a first length and a first width, and the printed circuit board has a second length and a second width; and wherein the first length of the cover and second length of the printed circuit board are substantially equal, and the first width of the cover and second width of the printed circuit board are substantially equal. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
-
-
17. A surface mount microelectromechanical system (MEMS) microphone device comprising:
-
a substrate comprising multiple layers of non-conductive material and having a planar upper surface and a planar lower surface, the upper surface having an interior region and a peripheral region that completely surrounds the interior region, the substrate further comprising; a first plurality of metal pads formed on the upper surface of the substrate; a second plurality of metal pads formed on the lower surface of the substrate and arranged within a perimeter of the lower surface of the substrate, wherein the second plurality of metal pads are configured to mechanically couple and electrically couple the surface mount MEMS microphone device to pads on a surface of an external printed circuit board; and one or more electrical pathways formed completely within the substrate, wherein the pathways electrically couple one or more of the first plurality of metal pads on the upper surface of the substrate to one or more of the second plurality of metal pads on the lower surface of the substrate; a MEMS microphone die physically coupled to the upper surface of the substrate and electrically coupled to at least one of the first plurality of metal pads on the upper surface of the substrate; and a single-piece cover that has a top region with an acoustic port that passes completely through the cover, and a sidewall region, the sidewall region adjoining the top region at a substantially perpendicular angle and having a predetermined height, an exterior surface, an interior surface, and a bottom surface, wherein the bottom surface of the sidewall region is aligned with and physically coupled to the peripheral region of the upper surface of the substrate, thereby forming a protective enclosure for the MEMS microphone die that reduces electromagnetic interference, and wherein the interior of the protective enclosure is an acoustic chamber having a volume defined by the predetermined height of sidewall region, and the width and length of the top region of the cover. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25, 26, 27)
-
-
28. A surface mount microelectromechanical system (MEMS) microphone device comprising:
-
a printed circuit board having a multi-layer core of conductive and non-conductive materials, wherein the printed circuit board has a planar upper surface and a planar lower surface, the upper surface having an interior region and a peripheral region that completely surrounds the interior region, the printed circuit board further comprising; a first metal layer formed on the upper surface of the printed circuit board and patterned into a first plurality of metal pads, wherein at least one pad of the first plurality of metal pads is formed in the peripheral region of the upper surface of the printed circuit board; a second metal layer formed on the lower surface of the printed circuit board and patterned into a second plurality of metal pads, the second plurality of metal pads arranged within a perimeter of the lower surface of the printed circuit board, wherein the second plurality of metal pads are configured to mechanically couple and electrically couple the surface mount MEMS microphone device to pads on a surface of an external printed circuit board; and one or more electrical pathways formed completely within the printed circuit board, wherein the pathways electrically couple one or more of the first plurality of metal pads on the upper surface of the printed circuit board to one or more of the second plurality of metal pads on the lower surface of the printed circuit board; a MEMS microphone die physically coupled to the upper surface of the multi-layer printed circuit board and electrically coupled to at least one of the first plurality of patterned metal pads; and a single-piece cover that has a top region with an acoustic port that passes completely through the cover, and a sidewall region, the sidewall region adjoining the top region at a substantially perpendicular angle and having a predetermined height, an exterior sidewall surface, an interior sidewall surface, and a bottom surface, wherein the bottom surface of the sidewall region is aligned with and physically coupled to the peripheral region of the upper surface of the printed circuit board, thereby forming a protective enclosure for the MEMS microphone die that reduces electromagnetic interference, and wherein the interior of the protective enclosure is an acoustic chamber having a volume defined by the predetermined height of sidewall region, and the width and length of the top region of the cover. - View Dependent Claims (29, 30)
-
Specification