Semiconductor die mount by conformal die coating

• US 8,704,379 B2
• Filed: 08/27/2008
• Issued: 04/22/2014
• Est. Priority Date: 09/10/2007
• Status: Active Grant

• Current Assignee: Invensas Corporation
• Original Assignee: Invensas Corporation
• Inventors: Crane, Scott Jay, McElrea, Simon J. S., McGrath, Scott, Pan, Weiping, Melcher, DeAnn Eileen, Robinson, Marc E.
• Primary Examiner(s): SUN, YU-HSI DAVID
• Application Number:
  US12/199,080
• Publication Number:
  US 20090065916A1
• Time in Patent Office: 2,064 Days
• Field of Search: 257/777, 257/686
• US Class Current: 257/777
• CPC Class Codes: H01L 2224/24145 the bodies being stacked
• CPC Class Codes: H01L 2224/24146 the HDI interconnect connecting to the same level of the lower semiconductor or solid-state body at which the upper semiconductor or solid-state body is mounted
• CPC Class Codes: H01L 2224/27452 Chemical vapour deposition [CVD], e.g. laser CVD
• CPC Class Codes: H01L 2224/29005 Structure
• CPC Class Codes: H01L 2224/29006 Layer connector larger than the underlying bonding area
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83191 wherein the layer connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/8385 using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
• CPC Class Codes: H01L 2224/92247 the second connecting process involving a wire connector
• CPC Class Codes: H01L 2225/0651 Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06524 Electrical connections formed on device or on substrate, e.g. a deposited or grown layer
• CPC Class Codes: H01L 2225/06551 Conductive connections on the side of the device
• CPC Class Codes: H01L 23/293 Organic, e.g. plastic
• CPC Class Codes: H01L 23/3171 the coating being directly applied to the semiconductor body, e.g. passivation layer H01L23/3178 takes precedence
• CPC Class Codes: H01L 23/3185 : the coating covering also the sidewalls of the semiconductor body
• CPC Class Codes: H01L 24/24 : of an individual high density interconnect connector
• CPC Class Codes: H01L 24/27 : Manufacturing methods
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01038 : Strontium [Sr]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits

Abstract

A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the die during assembly, and serves to electrically insulate the die from electrically conductive parts that the die may contact. The conformal coating may be an organic polymer, such as a parylene, for example. Also, a method for adhering a die onto a support, which may optionally be another die, includes providing a conformal coating between the die and the support, and heating the coating between the die and the support. The conformal coating may be provided on either or both a die attach area of a surface of the die, or a die mount region of a surface of the support; and the conformal coating may be provided following placement of the die on the support.

Claims

1. An assembly comprising first and second stacked die, the first die having a first conformal coating on an area of at least one side selected from a front side or a backside thereof and extending onto at least one sidewall thereof, the second die having a second conformal coating on an area of at least one side selected from a front side or a backside thereof and extending onto at least one sidewall thereof, the first and second conformal coatings adhering directly to one another, wherein a material of the first conformal coating includes a polyxylylene polymer and the material of the first conformal coating is the same as a material of the second conformal coating, wherein the first and second conformal coatings have interconnect terminals exposed at the at least one sidewall of the first and second die respectively.

2. The assembly of claim 1 wherein the first conformal coating is formed on at least a die mount area of the at least one side of the first die.

3. The assembly of claim 2 wherein the die mount area comprises an area of the backside of the first die.

4. The assembly of claim 3 wherein the first conformal coating is additionally formed on at least an area of the front side of the first die.

5. The assembly of claim 2 wherein the die mount area comprises an area of the front side of the first die.

6. The assembly of claim 5 wherein the first conformal coating is additionally formed on at least an area of the backside of the first die.

7. The assembly of claim 2 wherein the at least one sidewall of the first die is an interconnect sidewall.

8. The assembly of claim 1 wherein the first conformal coating substantially covers the backside of the first die, the at least one sidewall of the first die, and the front side of the first die.

9. The assembly of claim 1 wherein the second conformal coating is formed on at least a die mount region of the second die.

10. The assembly of claim 1 wherein the first conformal coating is formed on at least a die mount area of the first die and the second conformal coating is formed on at least a die mount region of the second die.

11. The assembly of claim 1 where the material of the first conformal coating includes polymer of p-xylene or a derivative thereof.

12. The assembly of claim 1 where the material of the first conformal coating includes a parylene selected from the group consisting of a parylene C, a parylene N, a parylene A, a parylene SR.