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Method and apparatus for multi-planar edge-extended wafer translator

  • US 8,704,544 B2
  • Filed: 03/10/2011
  • Issued: 04/22/2014
  • Est. Priority Date: 06/09/2006
  • Status: Active Grant
First Claim
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1. An apparatus, comprising;

  • a generally circular body having a first surface facing a first direction and a second surface facing a second direction opposite from the first direction, the body having a substantially circular central portion, and a plurality of bendable arms attached to the central portion in a circular arrangement and extending radially outwardly from the central portion, each bendable arm having a connector tab disposed at a distal end thereof;

    a plurality of first contact terminals carried by the central portion of the body and facing the second direction, the first plurality of contact terminals arranged in a pattern to match a layout of a first plurality of pads across a wafer to be contacted, and operable to simultaneously provide electrical connection to the corresponding first plurality of pads;

    a plurality of second contact terminals facing the first direction,with individual second contact terminals carried by individual connector tabs;

    a plurality of electrically conductive pathways carried by the body to electrically connect corresponding first and second contact terminals on the first surface of the connector tabs; and

    wherein the substantially circular central portion of the body is removably attachable to the wafer;

    wherein the substantially circular central portion of the body has an area that substantially matches the area of the wafer; and

    wherein the plurality of bendable arms extending radially outwardly from the central portion provide electrical pathways that extend beyond- a circumferential edge of the wafer.

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