External storage device and method of manufacturing external storage device
First Claim
Patent Images
1. An external storage device comprising:
- an interconnect substrate;
at least one semiconductor chip disposed over a first surface of said interconnect substrate;
a storage element provided in at least one of said at least one semiconductor chip;
an inductor which is provided in at least one of said at least one semiconductor chip and which communicates information stored in said storage element to an outside;
a driver circuit which is provided in at least one of said at least one semiconductor chip in order to drive said inductor;
a contact type external terminal provided in said interconnect substrate; and
a sealing resin layer which is formed over said first surface of said interconnect substrate and which seals said at least one semiconductor chip and does not cover said external terminal,wherein said inductor is formed at a surface of said semiconductor chip not facing said interconnect substrate, andwherein said sealing resin layer includes a recess in a region overlapping said inductor when seen in a plan view.
2 Assignments
0 Petitions
Accused Products
Abstract
A storage element is provided in a semiconductor chip, and an inductor and a driver circuit are provided in another semiconductor chip. An external terminal is a contact type terminal, and at least some external terminals are a power supply terminal and a ground terminal. A sealing resin layer is formed over a first surface of an interconnect substrate and seals the semiconductor chips but does not cover the external terminal. The inductor is formed at a surface of the semiconductor chip not facing the interconnect substrate.
-
Citations
19 Claims
-
1. An external storage device comprising:
-
an interconnect substrate; at least one semiconductor chip disposed over a first surface of said interconnect substrate; a storage element provided in at least one of said at least one semiconductor chip; an inductor which is provided in at least one of said at least one semiconductor chip and which communicates information stored in said storage element to an outside; a driver circuit which is provided in at least one of said at least one semiconductor chip in order to drive said inductor; a contact type external terminal provided in said interconnect substrate; and a sealing resin layer which is formed over said first surface of said interconnect substrate and which seals said at least one semiconductor chip and does not cover said external terminal, wherein said inductor is formed at a surface of said semiconductor chip not facing said interconnect substrate, and wherein said sealing resin layer includes a recess in a region overlapping said inductor when seen in a plan view. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
-
-
17. An external storage device comprising:
-
an interconnect substrate; a contact type external terminal provided in said interconnect substrate; and at least one semiconductor chip disposed over a first surface of said interconnect substrate, wherein; at least one said semiconductor chip includes a storage element, at least one said semiconductor chip includes an inductor for communicating information stored in said storage element to an external read device, said communicating occurring via an electromagnetic wave, at least one said semiconductor chip includes a driver circuit to drive said inductor, a sealing resin layer is formed over said first surface of said interconnect substrate and which seals said at least one semiconductor chip but does not cover said external terminal, and said contact type external terminal serving to connect said driver circuit to a power source of said external read device, wherein said inductor is formed at a surface of said semiconductor chip not facing said interconnect substrate, and wherein said sealing resin layer includes a recess in a region overlapping said inductor when seen in a plan view.
-
-
18. An external storage device comprising:
-
an interconnect substrate; at least one semiconductor chip disposed over a first surface of said interconnect substrate; a storage element provided in at least one of said at least one semiconductor chip; an inductor which is provided in at least one of said at least one semiconductor chip and which communicates information stored in said storage element to an outside; a driver circuit which is provided in at least one of said at least one semiconductor chip in order to drive said inductor; a contact type external terminal provided in said interconnect substrate; and a sealing resin layer which is formed over said first surface of said interconnect substrate and which seals said at least one semiconductor chip and does not cover said external terminal, wherein said inductor is formed at a surface of said semiconductor chip not facing said interconnect substrate, wherein said sealing resin layer includes a recessed portion for aiding said communication of said information, and wherein said recessed portion includes a region overlapping said inductor.
-
-
19. A method of manufacturing an external storage device, said method comprising:
-
disposing at least one semiconductor chip over a first surface of an interconnect substrate having a contact type external terminal; and forming a sealing resin layer over said first surface of said interconnect substrate such that at least said at least one semiconductor chip is sealed and said external terminal is not covered, wherein a storage element is provided in at least one of said at least one semiconductor chip, wherein an inductor which communicates information stored in said storage element to the outside is provided in at least one of said at least one semiconductor chip, wherein a driver circuit of said inductor is provided in at least one of said at least one semiconductor chip, wherein said inductor is formed at a surface of said semiconductor chip not facing said interconnect substrate, and wherein said sealing resin layer includes a recess in a region overlapping said inductor when seen in a plan view.
-
Specification