Active cooling substrate support

• US 8,709,162 B2
• Filed: 08/16/2005
• Issued: 04/29/2014
• Est. Priority Date: 08/16/2005
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Leung, Samuel, Cho, Su Ho, Bagley, William Allan
• Primary Examiner(s): LUND, JEFFRIE ROBERT
• Application Number:
  US11/206,245
• Publication Number:
  US 20070039942A1
• Time in Patent Office: 3,178 Days
• Field of Search: 15634551-34555, 118724-725, 118/728, 219/443.1
• US Class Current: 118/728
• CPC Class Codes: C23C 16/458 characterised by the method used for supporting substrates in the reaction chamber
• CPC Class Codes: C23C 16/4582 Rigid and flat substrates, e.g. plates or discs C23C16/4581 takes precedence
• CPC Class Codes: C23C 16/4583 the substrate being supported substantially horizontally
• CPC Class Codes: C23C 16/4586 Elements in the interior of the support, e.g. electrodes, heating or cooling devices
• CPC Class Codes: C23C 16/46 characterised by the method used for heating the substrate C23C16/48, C23C16/50 take precedence
• CPC Class Codes: C23C 16/463 Cooling of the substrate
• CPC Class Codes: H01J 37/32715 Workpiece holder
• CPC Class Codes: H01J 37/32724 Temperature
• CPC Class Codes: H01L 21/67069 for drying etching
• CPC Class Codes: H01L 21/67103 mainly by conduction

Abstract

A substrate support assembly and method for controlling the temperature of a substrate within a process chamber with a temperature uniformity of +/−5° C. are provided. A substrate support assembly includes a thermally conductive body comprising an aluminum material, a substrate support surface on the surface of the thermally conductive body and adapted to support the large area glass substrate thereon, one or more heating elements embedded within the thermally conductive body, and one or more cooling channels embedded within the thermally conductive body and positioned around the one or more heating elements. A process chamber comprising the substrate support assembly of the invention is also provided.

Claims

1. A substrate support assembly adapted to support a large area substrate inside a process chamber, comprising:

a unitary, thermally conductive body comprising a metal or metal alloy, the thermally conductive body having one or more substrate support pin holes and one or more cooling channels within the thermally conductive body, wherein the one or more cooling channels are configured to form one or more inner cooling loops and one or more outer cooling loops, the inner and outer cooling loops being configured to flow cooling fluid in opposite flow directions, and wherein the inner cooling loops and the outer cooling loops are spaced apart from the one or more substrate support pin holes;

a substrate support surface on the surface of the thermally conductive body and adapted to support the large area substrate thereon; and

one or more heating elements embedded within the thermally conductive body, wherein one of the one or more inner cooling loops and one of the one or more outer cooling loops are disposed parallel to each other and parallel to one of the one or more heating elements.

2. The substrate support assembly of claim 1, wherein the one or more cooling channels comprises a double spiral configuration, wherein one spiral includes one or more in-flow loops and the other spiral includes one or more out-flow loops, and wherein the in-flow loops enter through a center portion of the thermally conductive body and the out-flow loops exit through a center portion of the thermally conductive body.

3. The substrate support assembly of claim 1, wherein the one or more cooling channels loop around the positions of the one or more heating elements.

4. The substrate support assembly of claim 1, wherein the one or more cooling channels are configured to form inner cooling loops and outer cooling loops as shown in FIG. 4B.

5. The substrate support assembly of claim 1, wherein the one or more cooling channels are configured in a spiral interlooping “

C”

configuration as shown in FIG. 4C.

6. The substrate support assembly of claim 1, wherein the one or more cooling channels are embedded within the thermally conductive body and comprise tubing made from a stainless steel material.

7. The substrate support assembly of claim 1, wherein the one or more cooling channels are above the one or more heating elements.

8. The substrate support assembly of claim 1, wherein the dimension of the substrate support surface is larger than the dimension of the large area substrate.

9. The substrate support assembly of claim 1, wherein the thermally conductive body comprises an aluminum material.

10. The substrate support assembly of claim 1, wherein the substrate support surface is adapted to be rectangular in shape and to support a large area substrate having a dimension of about 370 mm×

about 470 mm or larger.

11. A substrate support assembly adapted to support a large area glass substrate inside a process chamber, comprising:

a unitary, thermally conductive body comprising a metal or metal alloy, the thermally conductive body having one or more substrate support pin holes and one or more cooling channels within the thermally conductive body, wherein the one or more cooling channels are configured to form one or more inner cooling loops and one or more outer cooling loops, wherein the inner cooling loops and the outer cooling loops are configured to loop from a center portion of the conductive body out toward the perimeter of the conductive body and loop back to the center portion of the conductive body, the inner and outer cooling loops being configured to flow cooling fluid in opposite flow directions, and wherein the inner cooling loops and the outer cooling loops are spaced apart from the one or more substrate support pin holes;

a substrate support surface on the surface of the thermally conductive body and adapted to support the large area glass substrate thereon; and

one or more heating elements embedded within the thermally conductive body, wherein one of the one or more inner cooling loops and one of the one or more outer cooling loops are disposed parallel to each other and parallel to one of the one or more heating elements.

12. The substrate support assembly of claim 11, wherein the one or more cooling channels are configured to form inner cooling loops and outer cooling loops as shown in FIG. 4B.

13. The substrate support assembly of claim 11, wherein the substrate support assembly is configured to support one or more large area rectangular substrates for fabricating devices selected from the group consisting of flat panel display (FPD), flexible display, organic light emitting diode (OLED) displays, flexible organic light emitting diode (FOLED) display, polymer light emitting diode (PLED) display, liquid crystal displays (LCD), organic thin film transistor, active matrix, passive matrix, top emission device, bottom emission device, solar cell, solar panel, and combinations thereof.

14. The substrate support assembly of claim 11, wherein the one or more cooling channels are not coplanar with the one or more heating elements.

15. The substrate support assembly of claim 14, wherein the one or more cooling channels are embedded within the thermally conductive body above the one or more heating elements and comprise tubing made from a stainless steel material.

16. The substrate support assembly of claim 11, wherein the one or more cooling channels are configured in a spiral interlooping “

C”

configuration as shown in FIG. 4C.

17. The substrate support assembly of claim 11, wherein the inner cooling loops enter through a center portion of the thermally conductive body and the outer cooling loops exit through a center portion of the thermally conductive body.