Liquid composite compositions using non-volatile liquids and nanoparticles and uses thereof

• US 8,709,531 B2
• Filed: 08/16/2013
• Issued: 04/29/2014
• Est. Priority Date: 02/07/2007
• Status: Expired due to Fees

• Current Assignee: eSionic Corp. (MKS Instruments Incorporated)
• Original Assignee: eSionic ES, Inc. (MKS Instruments Incorporated)
• Inventors: Miller, Seth A.
• Primary Examiner(s): MC GINTY, DOUGLAS J
• Application Number:
  US13/969,421
• Publication Number:
  US 20130337189A1
• Time in Patent Office: 256 Days
• Field of Search: 427/74, 427/446, 427/447, 427/384, 427/372.2, 252/500, 252/502, 252/510
• US Class Current: 427/74
• CPC Class Codes: B01D 53/326 in electrochemical cells
• CPC Class Codes: B01D 69/148 Organic/inorganic mixed matrix membranes
• CPC Class Codes: B05D 1/06 Applying particulate materials
• CPC Class Codes: B05D 1/10 Applying particulate materials
• CPC Class Codes: B05D 1/12 Applying particulate materials B05D1/06, B05D1/10 take precedence
• CPC Class Codes: B05D 1/18 performed by dipping
• CPC Class Codes: B05D 1/24 Applying particulate materials
• CPC Class Codes: B05D 5/12 to obtain a coating with specific electrical properties
• CPC Class Codes: B05D 7/24 for applying particular liquids or other fluent materials
• CPC Class Codes: C09K 3/00 Materials not provided for elsewhere
• CPC Class Codes: G11C 13/0009 RRAM elements whose operation depends upon chemical change
• CPC Class Codes: G11C 13/02 using elements whose operation depends upon chemical change G11C13/0009 takes precedence
• CPC Class Codes: G11C 25/00 Digital stores characterised by the use of flowing media; Storage elements therefor
• CPC Class Codes: H01B 1/00 Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
• CPC Class Codes: H01G 11/56 Solid electrolytes, e.g. gels; Additives therein
• CPC Class Codes: H01G 11/58 Liquid electrolytes
• CPC Class Codes: H01G 11/60 characterised by the solvent
• CPC Class Codes: H01G 11/64 characterised by additives
• CPC Class Codes: H01M 10/052 Li-accumulators
• CPC Class Codes: H01M 10/0565 Polymeric materials, e.g. gel-type or solid-type
• CPC Class Codes: H01M 14/005 : Photoelectrochemical storage cells light sensitive devices H01G9/20, semiconductors sensitive to light H01L31/00
• CPC Class Codes: H01M 2300/0085 : Immobilising or gelification of electrolyte
• CPC Class Codes: H01M 2300/0091 : in the form of mixtures
• CPC Class Codes: H01M 2300/0094 : in the form of layered products, e.g. coatings
• CPC Class Codes: H01M 4/00 : Electrodes
• CPC Class Codes: Y02E 60/10 : Energy storage using batteries
• CPC Class Codes: Y02E 60/13 : Energy storage using capacitors
• CPC Class Codes: Y10T 428/25 : Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles

Abstract

A solvent composition comprising an organic solvent; dispersed nanoparticles; and a non-volatile electrolyte is provided. A method of forming a liquid composite composition is provided.

Claims

1. A method of forming a liquid composite composition comprising the steps of:

applying a solvent composition to a substrate, the solvent composition comprising;

i) an organic solvent;

ii) nanoparticles, the nanoparticles each having at least one dimension less than 25 nm and being dispersed individually in the solvent composition; and

iii) a non-volatile liquid;

wherein the solvent composition contains at least 20 wt. % of the dispersed nanoparticles; and

removing the organic solvent to form said liquid composite composition.

2. The method according to claim 1 wherein said removing step is done simultaneously with said applying step.

3. The method according to claim 1 wherein said removing step is done after said applying step.

4. The method according to claim 1 wherein said applying step is done by a method selected from the group consisting of:

dip coating, spray coating, casting, spin coating, ink-jet printing, embossing, screen printing, and matrix-assisted pulsed laser evaporation.

5. The method according to claim 1 wherein the step of applying the solvent composition to the substrate acts to remove the organic solvent.

6. The method according to claim 1 where the step of removing the organic solvent is done by evaporation.

7. The method according to claim 1 wherein the step of removing the organic solvent comprises heating.

8. The method according to claim 1 wherein the liquid composite composition is formed on the substrate and the substrate is subsequently removed to form a free-standing liquid composite composition.

9. The method according to claim 1 wherein the liquid composite composition formed after the step of removing the organic solvent is subsequently cured by heating or UV radiation.

10. A method of forming a liquid composite composition comprising the steps of:

applying a solvent composition to a substrate, the solvent composition comprising;

i) an organic solvent;

ii) nanoparticles, the nanoparticles each having at least one dimension less than 25 nm and being dispersed individually in the solvent composition; and

iii) a non-volatile electrolyte;

wherein the non-volatile electrolyte comprises an ionic liquid, and the solvent composition contains at least 20 wt. % of the dispersed nanoparticles; and

removing the organic solvent to form said liquid composite composition.

11. The method according to claim 10 wherein said removing step is done simultaneously with said applying step.

12. The method according to claim 10 wherein said removing step is done after said applying step.

13. The method according to claim 10 wherein said applying step is done by a method selected from the group consisting of:

dip coating, spray coating, casting, spin coating, ink-jet printing, embossing, screen printing, and matrix-assisted pulsed laser evaporation.

14. The method according to claim 10 wherein the step of applying the solvent composition to the substrate acts to remove the organic solvent.

15. The method according to claim 10 where the step of removing the organic solvent is done by evaporation.

16. The method according to claim 10 wherein the step of removing the organic solvent comprises heating.

17. The method according to claim 10 wherein the liquid composite composition is formed on the substrate and the substrate is subsequently removed to form a free-standing liquid composite composition.

18. The method according to claim 10 wherein the liquid composite composition formed after the step of removing the organic solvent is subsequently cured by heating or UV radiation.