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Method for manufacturing light emitting diodes

  • US 8,709,835 B2
  • Filed: 06/12/2006
  • Issued: 04/29/2014
  • Est. Priority Date: 06/16/2005
  • Status: Active Grant
First Claim
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1. A method for manufacturing light emitting diodes comprising:

  • forming a semiconductor structure on a substrate, the semiconductor structure comprising a first layer having a first polarity, an active layer, and a second layer having an opposite polarity to that of the first layer, wherein a surface of the substrate has patterns, the surface contacts the semiconductor structure;

    forming a first electrode on the semiconductor structure, the first electrode comprising a contact of the second polarity to the second layer;

    forming a UBM (Under Bump Metallization) layer on the first electrode, the UBM layer having at least two metal layers, wherein the UBM layer comprises a laminated structure of Ti/Pt/Au, Ti/Au or Pt/Au;

    bonding a support on the UMB layer using a bonding material such that the bonding material forms a bonding layer between the UBM layer and the support;

    performing a lift-off process such that the substrate is separated from the first layer; and

    forming a second electrode on the first layer,wherein the UBM layer is located between the first electrode and the bonding layer, and wherein the first electrode is located between the semiconductor structure and the UBM layer,wherein while forming the semiconductor structure on the substrate, patterns are formed on a surface of the first layer along patterns which are a part of the substrate and comprised of the same material as the substrate, andwherein the second electrode contacts the patterns on the surface of the first layer and an air gap is disposed between the second electrode and the patterns on the surface of the first layer.

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