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Manufacturing method power semiconductor device

  • US 8,709,895 B2
  • Filed: 03/01/2011
  • Issued: 04/29/2014
  • Est. Priority Date: 11/04/2010
  • Status: Active Grant
First Claim
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1. A manufacturing method of a power semiconductor device, comprising:

  • providing a semiconductor substrate, the semiconductor substrate having at least one first trench and a second trench, and the semiconductor substrate having an active region and a termination region, the first trench being disposed in the active region, the second trench disposed in the termination region, wherein the semiconductor substrate has a first conductive type;

    forming a gate structure in the first trench, wherein the gate structure comprises a first insulating layer and a gate conductive layer;

    forming a second insulating layer to cover the semiconductor substrate, the first trench being filled up with the second insulating layer, and the second insulating layer being filled into the second trench;

    removing the first insulating layer and the second insulating layer outside the first trench and the second trench to expose a part of the semiconductor substrate;

    forming a doped body region and a doped source region in the exposed semiconductor substrate, wherein the doped body region has a second conductive type, and the doped source region is disposed in the doped body region and has the first conductive type;

    forming an interlayer dielectric layer to cover the semiconductor substrate;

    forming at least one first contact hole in the interlayer dielectric layer and the doped source region in the active region and forming a second contact hole in the interlayer dielectric layer and the doped source region in the termination region, wherein the second trench is disposed between the second contact hole and the first trench; and

    forming a source metal layer and a gate metal layer on the interlayer dielectric layer, so that the source metal layer is electrically connected to the doped source region, and the gate metal layer is electrically connected to the gate conductive layer.

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