Power surface mount light emitting die package
First Claim
Patent Images
1. A light emitting die package, comprising:
- a substrate having a first surface, a second surface opposite the first surface and at least one side edge adjacent the first surface;
a via hole through the substrate, wherein a surface of the via hole is at least partially coated with an insulating film;
a conductive lead extending from the first surface to the second surface through the via hole; and
a conductive trace on the top surface of the substrate, the conductive trace comprising electrically conductive material and configured to electrically connect to an LED, the conductive trace extending to the side edge of the substrate; and
a reflector attached to the top surface of the substrate, the reflector leaving portions of the top surface of the substrate and portions of the conductive trace that extend to the side edge of the substrate exposed.
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Abstract
A light emitting die package is provided which includes a metal substrate having a first surface and a first conductive lead on the first surface. The first conductive lead is insulated from the substrate by an insulating film. The first conductive lead forms a mounting pad for mounting a light emitting device. The package includes a metal lead electrically connected to the first conductive lead and extending away from the first surface.
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Citations
30 Claims
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1. A light emitting die package, comprising:
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a substrate having a first surface, a second surface opposite the first surface and at least one side edge adjacent the first surface; a via hole through the substrate, wherein a surface of the via hole is at least partially coated with an insulating film; a conductive lead extending from the first surface to the second surface through the via hole; and a conductive trace on the top surface of the substrate, the conductive trace comprising electrically conductive material and configured to electrically connect to an LED, the conductive trace extending to the side edge of the substrate; and a reflector attached to the top surface of the substrate, the reflector leaving portions of the top surface of the substrate and portions of the conductive trace that extend to the side edge of the substrate exposed. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A light emitting die package, comprising:
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a substrate having a first surface, a second surface opposite the first surface and at least one side edge adjacent the first surface; a first conductive trace and a second conductive trace disposed on the first surface, which are insulated from the substrate by a first insulating film, the first conductive trace forming a mounting pad for mounting a light emitting device and extending from the mounting pad to the side edge of the substrate; a light emitting diode (LED) mounted on the substrate and connected to the first and second conductive traces, wherein the LED is encapsulated within optically clear polymer; a thermal contact pad disposed on the second surface of the substrate opposing the first conductive trace; and at least one via hole formed through the substrate, wherein the via hole is spaced apart from the thermal contact pad. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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22. A light emitting die package, comprising:
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a substrate having a first surface, a second surface opposite the first surface and at least one side edge adjacent the first surface; a first conductive trace on the first surface that is insulated from the substrate by a ceramic polymer film, the first conductive trace forming a mounting pad for mounting a light emitting device and extending from the mounting pad to the side edge of the substrate; and a reflector attached to the first surface of the substrate, the reflector leaving portions of the first conductive trace that extend to the side edge of the substrate exposed. - View Dependent Claims (23, 24, 25, 26)
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27. A light emitting die package, comprising:
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a substrate having a first surface, a second surface opposite the first surface and at least one side edge adjacent the first surface; a first conductive trace on the first surface that is insulated from the substrate by a ceramic polymer film, the first conductive trace forming a mounting pad for mounting a light emitting device and extending from the mounting pad to the side edge of the substrate; and a reflective surface disposed on the first surface of the substrate at least partially on top of the first conductive trace, the reflective surface leaving portions of the first conductive trace that extend to the side edge of the substrate exposed. - View Dependent Claims (28, 29, 30)
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Specification