Light-emitting diode devices
First Claim
1. A light-emitting diode device, comprising:
- a die carrier having a die mounting surface and a plurality of electrical connection regions electrically insulated from one another;
a light-emitting diode (LED) die mounted on the die mounting surface of the die carrier, wherein the LED die comprises a substrate, a first type semiconductor layer disposed atop the substrate, a second type semiconductor layer disposed atop the first type semiconductor layer, an another first type semiconductor layer disposed atop the second type semiconductor layer, at least three through holes each extending through the substrate to a corresponding one of the semiconductor layers, an insulative layer formed on inner walls of the through holes, and electrically conductive linkers mounted within the respective through holes, andwherein each of the electrically conductive linkers has an end electrically connected to a corresponding one of the semiconductor layers and an opposite end protruding outwardly from the corresponding through hole and adapted for electrical connection to a corresponding one of the electrical connection regions of the die carrier; and
a light transmissible protective layer formed on the die mounting surface of the die carrier in a manner covering the LED die.
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Accused Products
Abstract
An LED device includes a die carrier having a die mounting surface and electrical connection regions. An LED die is mounted on the die mounting surface of the die carrier. The LED die includes a substrate, a first type semiconductor layer disposed atop the substrate, a second type semiconductor layer disposed atop the first type semiconductor layer, an another first type semiconductor layer disposed atop the second type semiconductor layer, at least three through holes each extending from the substrate to a corresponding semiconductor layer, an insulative layer formed on inner walls of the through holes, and electrically conductive linkers mounted within the through holes. Each electrically conductive linker has an end electrically connected to a corresponding semiconductor layer and an opposite end protruding outwardly from the corresponding through hole for electrical connection to a corresponding electrical connection region. A light transmissible protective layer covers the LED die.
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Citations
22 Claims
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1. A light-emitting diode device, comprising:
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a die carrier having a die mounting surface and a plurality of electrical connection regions electrically insulated from one another; a light-emitting diode (LED) die mounted on the die mounting surface of the die carrier, wherein the LED die comprises a substrate, a first type semiconductor layer disposed atop the substrate, a second type semiconductor layer disposed atop the first type semiconductor layer, an another first type semiconductor layer disposed atop the second type semiconductor layer, at least three through holes each extending through the substrate to a corresponding one of the semiconductor layers, an insulative layer formed on inner walls of the through holes, and electrically conductive linkers mounted within the respective through holes, and wherein each of the electrically conductive linkers has an end electrically connected to a corresponding one of the semiconductor layers and an opposite end protruding outwardly from the corresponding through hole and adapted for electrical connection to a corresponding one of the electrical connection regions of the die carrier; and a light transmissible protective layer formed on the die mounting surface of the die carrier in a manner covering the LED die. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A light-emitting diode device, comprising:
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a die carrier having a die mounting surface and a plurality of electrical connection regions electrically insulated from one another; a light-emitting diode (LED) die mounted on the die mounting surface of the die carrier, wherein the LED die comprises a substrate, a first type semiconductor layer disposed under the substrate and provided with a conductive island, a second type semiconductor layer disposed under the first type semiconductor layer without shielding the conductive island of the first type semiconductor layer and provided with a conductive island, and an another first type semiconductor layer disposed under the second type semiconductor layer without shielding the conductive island of the second type semiconductor layer and provided with a conductive island; a reflective layer disposed under the semiconductor layers and formed with a plurality of through holes to expose the conductive islands; an insulative layer disposed under the reflective layer and formed with a plurality of via holes registered with the corresponding through holes; a plurality of electrically conductive linkers, each extending from a corresponding one of the conductive islands along a corresponding one of the through holes and the via hole registered with the corresponding through hole and protruding outwardly from the insulative layer for electrical connection to a corresponding one of the electrical connection regions of the die carrier; and
a light transmissible protective layer formed on the die mounting surface of the die carrier in a manner covering the LED die. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A light-emitting diode device, comprising:
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a the die carrier comprising a first surface, a second surface opposite to the first surface, a plurality of vias connecting the first surface to the second surface, and a plurality of anchor seats formed on the second surface of the die carrier along peripheries of the respective vias; a light-emitting diode (LED) die comprising a substrate, a first type semiconductor layer disposed under the substrate and provided with a conductive island at a predetermined position, a second type semiconductor layer disposed under the first type semiconductor layer without shielding the conductive island of the first type semiconductor layer and provided with a conductive island at a predetermined position; a reflective layer disposed under surfaces of the semiconductor layers and formed with a plurality of through holes to expose the conductive islands; an adhesive insulative layer disposed on the reflective layer and formed with a plurality of via holes registered with the corresponding through holes; a plurality of electrically conductive linkers, each extending from a corresponding one of the conductive islands to a corresponding one of the anchor seats along a corresponding one of the through holes, a corresponding one of the via holes and a corresponding one of the vias; and a light transmissible protective layer formed on the first surface of the die carrier in a manner covering the LED die. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22)
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Specification