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Micromachined devices and fabricating the same

  • US 8,710,599 B2
  • Filed: 08/03/2010
  • Issued: 04/29/2014
  • Est. Priority Date: 08/04/2009
  • Status: Active Grant
First Claim
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1. A device, comprising:

  • a first wafer having at least one via; and

    a second wafer bonded to the first wafer and having a micro-electromechanical-systems (MEMS) layer,wherein the via forms a closed loop when viewed in a direction normal to a top surface of the first wafer to thereby define a first conductive region of the first wafer electrically isolated from the remainder of the first wafer.

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