Socket type MEMS device with stand-off portion

• US 8,710,638 B2
• Filed: 08/06/2009
• Issued: 04/29/2014
• Est. Priority Date: 07/15/2009
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Wu, Ting-Hua
• Primary Examiner(s): Gurley, Lynne
• Assistant Examiner(s): Webb, Vernon P
• Application Number:
  US12/537,047
• Publication Number:
  US 20110012247A1
• Time in Patent Office: 1,727 Days
• Field of Search: 257/414, 257/619, 257/678, 257/E23.18
• US Class Current: 257/678
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate
• CPC Class Codes: B81C 2201/019 Bonding or gluing multiple substrate layers
• CPC Class Codes: B81C 2203/0109 Bonding an individual cap on the substrate
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A method for fabricating an integrated circuit device is disclosed. The method includes providing a first substrate; bonding a second substrate to the first substrate, the second substrate including a microelectromechanical system (MEMS) device; and bonding a third substrate to the first substrate.

Claims

1. A device comprising:

a first substrate;

a second substrate distinct from the first substrate including a MEMS device bonded to the first substrate;

at least one cavity extending through the second substrate; and

a third substrate over and distinct from the second substrate, wherein a stand-off portion of the third substrate extends through the at least one cavity of the second substrate to bond a portion of the first substrate,

wherein an open space separates a sidewall of the second substrate from the stand-off portion of the third substrate.

2. The device of claim 1 wherein the second substrate is bonded to the first substrate or the stand-off portion of the third substrate bonds the portion of the first substrate by a fusion bond.

3. The device of claim 2 wherein the fusion bond comprises oxide/silicon bonding or silicon/silicon bonding.

4. The device of claim 1 wherein the second substrate is bonded to the first substrate or the stand-off portion of the third substrate bonds the portion of the first substrate by a eutectic bond.

5. The device of claim 4 wherein the eutectic bond comprises metal/metal bonding or metal/semiconductor bonding.

6. A device comprising:

a substrate;

one or more MEMS structures bonded to the substrate;

a capping structure over the one or more MEMS structures, wherein the capping structure is bonded to the substrate and encloses the one or more MEMS structures between the capping structure and the substrate, and

wherein the capping structure is bonded to the substrate by a stand-off portion of the capping structure extending through a cavity of the at least one of the one or more MEMS structures to contact the substrate, and

wherein a space separates sidewalls of the cavity of the one or more MEMS structures from the stand-off portion of the capping structure.

7. The device of claim 6 wherein each of the one or MEMS structures is bonded to the substrate by either a fusion bond or a eutectic bond.

8. The device of claim 6 wherein the capping structure is bonded to the substrate by either a fusion bond or a eutectic bond.

9. The device of claim 6 wherein the one or more MEMS structure comprise at least one lower MEMS structure, wherein the capping structure and some of the MEMS structures have a portion that extends through the lower MEMS structure to contact the substrate.

10. The device of claim 7 wherein the eutectic bond comprises metal/metal bonding or metal/semiconductor bonding.

11. The device of claim 7 wherein the fusion bond comprises oxide/silicon bonding or silicon/silicon bonding.

12. The device of claim 8 wherein the eutectic bond comprises metal/metal bonding or metal/semiconductor bonding.

13. The device of claim 8 wherein the fusion bond comprises oxide/silicon bonding or silicon/silicon bonding.

14. A device comprising:

a semiconductor substrate;

a semiconductor intermediate structure including a MEMS device, wherein the semiconductor intermediate structure is distinct from and over the semiconductor substrate;

a plurality of cavities extending through the semiconductor intermediate structure;

a capping structure distinct from and over the semiconductor intermediate structure; and

a stand-off structure that extends from the capping structure through one of the plurality of cavities to the semiconductor substrate.

15. The device of claim 14 further comprising a space between a wall of the plurality of cavities and a wall of the stand-off structure.

16. The device of claim 14 wherein the semiconductor intermediate structure is bonded to the substrate by either a fusion bond or a eutectic bond.

17. The device of claim 14 wherein the capping structure is bonded to the semiconductor substrate.

18. The device of claim 17 wherein the capping structure is bonded to the semiconductor substrate by either a fusion bond or a eutectic bond.

19. The device of claim 16 wherein the fusion bond comprises oxide/silicon bonding or silicon/silicon bonding and wherein the eutectic bond comprises metal/metal bonding or metal/semiconductor bonding.

20. The device of claim 18 wherein the fusion bond comprises oxide/silicon bonding or silicon/silicon bonding and wherein the eutectic bond comprises metal/metal bonding or metal/semiconductor bonding.