Method for fabricating miniature structures or devices such as RF and microwave components
First Claim
1. A method of forming a three-dimensional structure, comprising:
- (A) forming a plurality of successively formed layers, wherein each successive layer comprises at least two materials and is formed on and adhered to a previously formed layer, one of the at least two materials is a structural material and the other of the at least two materials is a sacrificial material, and wherein each successive layer defines a successive cross-section of the three-dimensional structure, and wherein the forming of each of the plurality of successive layers comprises;
(i) depositing a first of the at least two materials;
(ii) depositing a second of the at least two materials;
(iii) planarizing the at least two materials to set an upper boundary level for the layer; and
(B) after the forming of the plurality of successive layers, separating at least a portion of the sacrificial material from multiple layers of the structural material to reveal the three-dimensional structure,wherein during formation of at least one given layer, the at least two materials comprise at least three materials, and the process comprises depositing a third of the at least three materials, and wherein the planarizing of the at least two materials comprises planarizing the at least three materials to set an upper boundary level for the layer, and wherein a prior planarization step is performed before the depositing of the third material wherein the prior planarization step sets a planarized height to a level that is above the upper boundary level for the given layer.
1 Assignment
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Accused Products
Abstract
Multi-layer, multi-material fabrication methods include depositing at least one structural material and at least one sacrificial material during the formation of each of a plurality of layers wherein deposited materials for each layer are planarized to set a boundary level for the respective layer and wherein during formation of at least one layer at least three materials are deposited with a planarization operation occurring before deposition of the last material to set a planarization level above the layer boundary level and wherein a planarization occurs after deposition of the last material whereby the boundary level for the layer is set. Some formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).
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Citations
10 Claims
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1. A method of forming a three-dimensional structure, comprising:
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(A) forming a plurality of successively formed layers, wherein each successive layer comprises at least two materials and is formed on and adhered to a previously formed layer, one of the at least two materials is a structural material and the other of the at least two materials is a sacrificial material, and wherein each successive layer defines a successive cross-section of the three-dimensional structure, and wherein the forming of each of the plurality of successive layers comprises; (i) depositing a first of the at least two materials; (ii) depositing a second of the at least two materials; (iii) planarizing the at least two materials to set an upper boundary level for the layer; and (B) after the forming of the plurality of successive layers, separating at least a portion of the sacrificial material from multiple layers of the structural material to reveal the three-dimensional structure, wherein during formation of at least one given layer, the at least two materials comprise at least three materials, and the process comprises depositing a third of the at least three materials, and wherein the planarizing of the at least two materials comprises planarizing the at least three materials to set an upper boundary level for the layer, and wherein a prior planarization step is performed before the depositing of the third material wherein the prior planarization step sets a planarized height to a level that is above the upper boundary level for the given layer. - View Dependent Claims (2, 3, 4, 5)
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6. A method for forming a three-dimensional structure, comprising:
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(A) forming a plurality of successively formed layers, wherein each successive layer comprises at least two materials and is formed on and adhered to a previously formed layer, one of the at least two materials is a structural material and the other of the at least two materials is a sacrificial material, and wherein each successive layer defines a successive cross-section of the three-dimensional structure, and wherein the forming of each of the plurality of successive layers comprises; (i) depositing a first of the at least two materials; (ii) depositing a second of the at least two materials; (iii) planarizing the at least two materials to set an upper boundary level for the layer; and (B) after the forming of the plurality of successive layers, separating at least a portion of the sacrificial material from multiple layers of the structural material to reveal the three-dimensional structure, wherein during formation of at least one given layer, the at least two materials comprise at least three materials, and the process comprises depositing a third of the at least three materials, and wherein the planarizing of the at least two materials comprises planarizing the at least three materials to set an upper boundary level for the layer, and wherein an additional planarization is performed before depositing the third material but after depositing the second material wherein the additional planarization sets a planarization level that is above the upper boundary level of the at least one given layer. - View Dependent Claims (7, 8, 9, 10)
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Specification