Electrical components and method of manufacture

• US 8,715,839 B2
• Filed: 06/30/2006
• Issued: 05/06/2014
• Est. Priority Date: 06/30/2005
• Status: Active Grant

• Current Assignee: L. Pierre De Rochemont
• Original Assignee: L. Pierre De Rochemont
• Inventors: de Rochemont, L. Pierre
• Primary Examiner(s): LANGMAN, JONATHAN C
• Application Number:
  US11/479,159
• Publication Number:
  US 20070003781A1
• Time in Patent Office: 2,867 Days
• Field of Search: 257/296, 334/65, 336/200, 320/166, 428/697, 428/699, 428/701, 428/702, 338/115
• US Class Current: 428/701
• CPC Class Codes: B82Y 30/00 Nanotechnology for materials or surface science, e.g. nanocomposites
• CPC Class Codes: C04B 2235/768 Perovskite structure ABO3
• CPC Class Codes: C04B 2235/781 Nanograined materials, i.e. having grain sizes below 100 nm
• CPC Class Codes: H01C 17/003 using lithography, e.g. photolithography lithographic compositions and processing in general G03F
• CPC Class Codes: H01C 17/06533 composed of oxides
• CPC Class Codes: H01C 7/003 Thick film resistors
• CPC Class Codes: H01G 4/10 Metal-oxide dielectrics H01G4/085 takes precedence
• CPC Class Codes: H01G 4/1209 characterised by the ceramic dielectric material H01G4/1272, H01G4/1281 take precedence
• CPC Class Codes: H01G 4/33 Thin- or thick-film capacitors thin- or thick-film circuits H01L27/00; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor H01L28/40
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/642 Capacitive arrangements H01L23/49589, H01L23/645, H01L23/647, H01L23/66 take precedence; capacitive effects between wiring layers on the semiconductor body H01L23/5222
• CPC Class Codes: H01L 23/647 Resistive arrangements H01L23/66, H01L23/62 take precedence
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/0102 Calcium [Ca]
• CPC Class Codes: H01L 2924/01021 Scandium [Sc]
• CPC Class Codes: H01L 2924/01025 Manganese [Mn]
• CPC Class Codes: H01L 2924/01037 Rubidium [Rb]
• CPC Class Codes: H01L 2924/01057 Lanthanum [La]
• CPC Class Codes: H01L 2924/01067 : Holmium [Ho]
• CPC Class Codes: H01L 2924/01068 : Erbium [Er]
• CPC Class Codes: H01L 2924/01077 : Iridium [Ir]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01087 : Francium [Fr]
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01Q 1/2283 : mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 1/38 : formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 15/0086 : said selective devices having materials with a synthesized negative refractive index, e.g. metamaterials or left-handed materials
• CPC Class Codes: H01Q 9/0414 : in a stacked or folded configuration
• CPC Class Codes: H05K 1/0298 : Multilayer circuits
• CPC Class Codes: H05K 1/092 : Dispersed materials, e.g. conductive pastes or inks
• CPC Class Codes: H05K 1/16 : incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 1/162 : incorporating printed capacitors
• CPC Class Codes: H05K 1/165 : incorporating printed inductors
• CPC Class Codes: H05K 1/167 : incorporating printed resistors
• CPC Class Codes: H05K 2201/017 : Glass ceramic coating, e.g. formed on inorganic substrate
• CPC Class Codes: H05K 2201/0175 : Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
• CPC Class Codes: H05K 2201/09763 : Printed component having superposed conductors, but integrated in one circuit layer
• CPC Class Codes: H05K 2203/016 : Temporary inorganic, non-metallic carrier, e.g. for processing or transferring
• CPC Class Codes: H05K 2203/0338 : Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
• CPC Class Codes: H05K 2203/121 : Metallo-organic compounds
• CPC Class Codes: H05K 3/207 : using a prefabricated paste pattern, ink pattern or powder pattern
• CPC Class Codes: Y10T 428/12493 : Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]

Abstract

An electrical component provides a ceramic element located on or in a dielectric substrate between and in contact with a pair of electrical conductors, wherein the ceramic element includes one or more metal oxides having fluctuations in metal-oxide compositional uniformity less than or equal to 1.5 mol % throughout the ceramic element. A method of fabricating an electrical component, provides or forming a ceramic element between and in contact with a pair of electrical conductors on a substrate including depositing a mixture of metalorganic precursors and causing simultaneous decomposition of the metal oxide precursors to form the ceramic element including one or more metal oxides.

Claims

1. An electrical component, comprising a ceramic element located on or in a dielectric substrate between and in contact with a pair of electrical conductors, wherein said ceramic element includes three or more metal oxides having fluctuations in metal-oxide compositional uniformity less than or equal to 1.5 mol % throughout said ceramic element, wherein said ceramic element has a substantially uniform grain sizes measured along a major axis and further wherein the grain sizes are less than 1.5 times and greater than 0.5 times an average grain size contained in the ceramic element.

2. The electrical component of claim 1, wherein the grain size is determined by controlling heat treatment during fabrication.

3. The electrical component of claim 1, wherein said ceramic element has an electrical characteristic determined by said three or more metal oxides.

4. The electrical component of claim 3, wherein said electrical characteristic is determined by average grain size.

5. The electrical component of claim 4, wherein the electrical characteristic of said ceramic element exhibits a substantially constant value which varies ≦

1% over an operating temperature range of 40°

C. to 120°

C.

6. The electrical component of claim 1, wherein said ceramic element is fabricated by causing simultaneous decomposition of metalorganic precursors.

7. The electrical component of claim 6, wherein the simultaneous decomposition is achieved by using rapid thermal annealing on deposited said metalorganic precursors.

8. The electrical component of claim 7, wherein the precursors of are deposited as a wax compound.

9. The electrical component of claim 6, wherein said ceramic element is fabricated by depositing carboxylate salt precursors prior to the simultaneous decomposition.

10. The electrical component of claim 9, wherein radiant energy is applied to the deposited precursors to cause the simultaneous decomposition.

11. The electrical component of claim 1, wherein said three or more metal oxides have a rutile, pyrochlore, perovskite, body-centered cubic, rhombic dodecahedron, rhombic trapezohedron crystalline phase, or mixtures thereof, that includes amounts of one or more of copper oxide (CuO), nickel oxide (NiO), ruthenium oxide (RuO₂), iridium oxide (IrO₂), rhodium oxide (Rh₂O₃), osmium oxide (OsO₂), antimony oxide (Sb₂O₃), titanium oxide (TiO2), zirconium oxide (ZrO), hafnium oxide (HfO), tantalum oxide (Ta₂O₅), niobium oxide (Nb₂O₅), iron oxide (FeO₂O₃), and silicon oxide (SiO₄).

12. The electrical component of claim 1, wherein said ceramic element includes a resistive metal oxide material having an intrinsic sheet resistivity greater than 25 μ

Ω

-cm.

13. The electrical component of claim 12, wherein said ceramic element also includes a conductive metal oxide and further wherein said electrical component is a resistor.

14. The electrical component of claim 12, wherein said three or more metal oxides have a rutile, pyrochlore, or perovskite crystalline phase that includes amounts of one or more of copper oxide (CuO), nickel oxide (NiO), ruthenium oxide (RuO₂), iridium oxide (IrO₂), rhodium oxide (Rh₂O₃), osmium oxide (OsO₂), antimony oxide (Sb₂O₃), and indium-tin oxide.

15. The electrical component of claim 12, wherein said three or more metal oxides is from the group consisting of bismuth oxide (Bi₂O₃), lanthanum oxide (La₂O₃), cerium oxide (Ce₂O₃), lead oxide (PbO) and neodymium oxide (Nd₂O₃).

16. The electrical component of claim 12, wherein said three or more metal oxides include alkaline earth metal oxides drawn from the group consisting of magnesium oxide (MgO), calcium oxide (CaO), strontium oxide (SrO), barium oxide (BaO), scandium oxide (Sc₂O₃), titanium oxide, (Ti₂O₃), vanadium oxide (V₂O₃), chromium oxide (Cr₂O₃), manganese oxide (Mn₂O₃), and iron oxide (Fe₂O₃).

17. The electrical component of claim 16, wherein said ceramic element has a resistivity or resistance value which varies ≦

1% over an operating temperature range of −

40°

C. to 125°

C.

18. The electrical component of claim 12, wherein said three or more metal oxides substantially consist of grains having a substantially uniform grain size.

19. The electrical component of claim 12, wherein said ceramic element has a resistivity or resistance value which varies ≦

5% over an operating temperature range of −

40°

C. to 125°

C.

20. The electrical component of claim 19, wherein said ceramic element has a resistance value anywhere between 1 ohm and 500 mega-ohms.

21. The electrical component of claim 12, wherein said ceramic element has a resistance value anywhere between 10 ohms and 50 mega-ohms.

22. The electrical component of claim 1, wherein said electrical component is a capacitor with said pair of electrical conductors forming opposing electrodes and said ceramic element forming a dielectric thereof.

23. The electrical component of claim 22, wherein said ceramic element substantially consists of grains having a substantially uniform grain size.

24. The electrical component of claim 22, wherein said capacitor has a capacitance value anywhere between 0.01 pF to 900 μ

F.

25. The electrical component of claim 22, wherein each of said pair of electrical conductors includes a separate enlarged area having an opposed orientation to each other with said ceramic element located there between.

26. The electrical component of claim 25, wherein said electrical conductors and said ceramic element form a sheet capacitor having a capacitance>

20 nF/inch².

27. The electrical component of claim 22, wherein said pair of electrical conductors are in the form of circuit board traces and create a multiplicity of closely spaced, interdigitated fingers for said opposing electrodes.

28. The electrical component of claim 27, wherein said ceramic element is located in a meandering gap formed between the interdigitated fingers, and further wherein the meandering gap maintains a substantially constant spacing and even in curved or corner areas of the meandering gap.

29. The electrical component of claim 22, wherein said ceramic element has a relative permittivity ∈

_R≧

10.

30. The electrical component of claim 29, wherein said ceramic element has a relative permittivity ∈

_R≧

100.

31. The electrical component of claim 22, wherein said ceramic element has a dielectric constant value which varies ≦

5% over an operating temperature range of 40°

C. to 120°

C.

32. The electrical component of claim 31, wherein said three or more metal oxides substantially consist of grains having a substantially uniform grain size which averages less than 70 nanometers.

33. The electrical component of claim 31, wherein said ceramic element has a dielectric constant value which varies ≦

1% over an operating temperature range of 40°

C. to 120°

C.

34. The electrical component of claim 33, wherein said ceramic element substantially consists of grains having a substantially uniform grain size which averages less than 50 nanometers.

35. The electrical component of claim 22, wherein said ceramic element has high permittivity, and further wherein said ceramic element has perovskite crystal structures and will generally have the chemical formula M⁽¹⁾M⁽²⁾O₃, with metals from group M⁽¹⁾ and M⁽²⁾ included in 1:

1 molar ratios.

36. The electrical component of claim 35, wherein each group M⁽¹⁾, M⁽²⁾ may include a plurality of metals with the combined molarity for each group being the same.

37. The electrical component of claim 36, wherein two metals, M^(1a), M^(b), are selected from group M⁽¹⁾ and two other metals are selected from group M⁽²⁾, and said crystal structures have the chemical formula M^(1a)_(1-x)M^(1b)_(x)M^(2a)_(1-y)M^(2b)_(y)O₃.

38. The electrical component of claim 35, wherein one or more metal oxides of group M(1) include:

alkaline earth metal oxides selected from magnesium oxide (MgO), calcium oxide (CaO), strontium oxide (SrO), and barium oxide (BaO);

alkali metal oxides selected from lithium oxide (Li₂O), sodium oxide (Na₂O), potassium oxide (K₂O), and rubidium oxide (Rb₂O); and

heavy-metal oxides selected from the group including lanthanum oxide (La₂O₃), cerium oxide (Ce₂O₃), lead oxide (PbO) and neodymium oxide (Nd₂O₃).

39. The electrical component of claim 35, wherein one or more metal oxides of group M(2) include titanium oxide (TiO2), zirconium oxide (ZrO), hafnium oxide (HfO), tantalum oxide (Ta₂O₅), and niobium oxide (Nb₂O₅).

40. The electrical component of claim 1, wherein said pair of electrical conductors are connected by one or more additional electrical conductors, and further wherein said one or more additional electrical conductors encircle said ceramic element to form an inductor.

41. The electrical component of claim 40, wherein said inductor exhibits an inductance anywhere over the range of 0.1 pH to 500 nH.

42. The electrical component of claim 41, wherein the inductor maintains its inductance value within ±

1% over an operating temperature range of 40°

C. to 120°

C.

43. The electrical component of claim 40, wherein said ceramic element has a body-centered cubic crystalline phase, that includes iron oxide (Fe₂O₃) and amounts of one or more of cobalt monoxide (CoO), nickel oxide (NiO), zinc oxide (ZnO), manganese oxide (MnO), copper oxide (CuO), vanadium oxide (VO), magnesium oxide (MgO) and lithium oxide (Li₂O).

44. The electrical component of claim 40, wherein said one or more additional electrical conductors form a coil around said ceramic element.

45. The electrical component of claim 40, wherein said one or more additional electrical conductors include a multiplicity of additional conductors, including one or more second electrical conductors formed as circuit board traces and located beneath said ceramic element.

46. The electrical component of claim 45, wherein each of said one or more second electrical conductors are elongated and have contact pads located at opposing ends thereof, and further wherein said multiplicity of additional conductors includes a plurality of electrical contact posts located on said contact pads and adjacent said ceramic element.

47. The electrical component of claim 45, wherein said multiplicity of additional conductors includes one or more wire bonds located over said ceramic element and connecting said electrical conductor posts.

48. The electrical component of claim 40, wherein one metal oxide of said three or more metal oxides is silicon oxide (SiO₄) and said ceramic element adopts a rhombic dodecahedron or rhombic trapezohedron crystalline phase, and another metal oxide includes amounts of one or more of aluminum oxide (Al₂O₃), iron oxide (Fe₂O₃), chromium oxide (Cr₂O₃), vanadium oxide (V₂O₃), zirconium oxide (ZrO₂), titanium oxide (TiO₂), silicon oxide (SiO₂), yttrium oxide (Y₂O₃), cobalt oxide (Co₃O₄), gadolinium oxide (Gd₂O₃) neodymium oxide (Nd₂O₃) and holmium oxide (Ho₂O₃).

49. The electrical component of claim 1, wherein said ceramic element includes a plurality of ceramic elements embedded in said dielectric substrate and operatively interconnected.

50. The electrical component of claim 49, wherein said plurality of ceramic elements includes first and second ceramic elements which each form a different type of passive component.

51. The electrical component of claim 50, wherein said first and second ceramic elements form a capacitor and an inductor, respectively.

52. The electrical component of claim 49, wherein said plurality of ceramic elements form an electronic filter.

53. The electrical component of claim 1, further comprising an integrated circuit mounted on said dielectric substrate and operatively connected to one of said pair of electrical conductors.

54. The electrical component of claim 53, wherein said ceramic element includes a plurality of ceramic elements embedded in said dielectric substrate, and further wherein said plurality of ceramic elements form an electronic filter.

55. The electrical component of claim 54, further comprising an antenna element operatively connected to the electronic filter.

56. The electrical component of claim 1, wherein the dielectric substrate is one of a plurality of layers in a multilayer circuit board.

57. The electrical component of claim 56, wherein one or more of said electrical conductors includes a contact pad, and further comprising an electrical conductor post positioned on the contact pad for providing electrical connection through said dielectric substrate to an adjacent layer in the circuit board.

58. The electrical component of claim 56, wherein one or more other layers in the multilayer circuit board include embedded electrical components.

59. The electrical component of claim 56, further comprising an integrated circuit mounted on one layer of the multilayer circuit board, and operatively connected to one of said pair of electrical conductors.

60. The electrical component of claim 1, wherein said dielectric substrate is formed around said ceramic element.

61. The electrical component of claim 60, wherein one or more of said electrical conductors and said ceramic element are first formed on a base substrate.

62. The electrical component of claim 61, wherein said base substrate is removed before combining said dielectric substrate with other dielectric substrates to thrill a multilayer circuit board.

63. The electrical component of claim 62, wherein one or more additional electrical components are formed on top of said dielectric substrate at the level of a second layer of said multilayer circuit board, and further wherein a second dielectric layer is formed around said one or more additional electrical components to form said multilayer circuit board.