Methods of forming through silicon via openings
First Claim
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1. A method of forming a through-silicon-via (TSV) opening, the method comprising:
- forming a TSV opening through a substrate;
removing a recast of a material of the substrate on sidewalls of the TSV opening with a first chemical, wherein the first chemical comprises a halogen-containing chemical; and
cleaning the sidewalls of the TSV opening with a second chemical by substantially removing a residue of the first chemical, wherein the second chemical comprises a first component that is substantially inactive with the material of the substrate and a second component that is substantially active with the halogen component of the halogen-containing chemical, and wherein the first component is selected from a group consisting of helium, neon, argon, krypton, xenon and radon, and wherein the second component comprises, wherein the second chemical comprises xenon dihydride (XeH2).
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Abstract
A method of forming a through-silicon-via (TSV) opening includes forming a TSV opening through a substrate. A recast of a material of the substrate on sidewalls of the TSV opening is removed with a first chemical. The sidewalls of the TSV opening are cleaned with a second chemical by substantially removing a residue of the first chemical.
38 Citations
9 Claims
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1. A method of forming a through-silicon-via (TSV) opening, the method comprising:
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forming a TSV opening through a substrate; removing a recast of a material of the substrate on sidewalls of the TSV opening with a first chemical, wherein the first chemical comprises a halogen-containing chemical; and cleaning the sidewalls of the TSV opening with a second chemical by substantially removing a residue of the first chemical, wherein the second chemical comprises a first component that is substantially inactive with the material of the substrate and a second component that is substantially active with the halogen component of the halogen-containing chemical, and wherein the first component is selected from a group consisting of helium, neon, argon, krypton, xenon and radon, and wherein the second component comprises, wherein the second chemical comprises xenon dihydride (XeH2). - View Dependent Claims (2, 3, 4, 5)
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6. A method of forming a through-silicon-via (TSV) opening, the method comprising:
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laser drilling a substrate to form a TSV opening through the substrate, wherein the laser drilling process generates a recast of a material of the substrate on the sidewalls of the TSV opening; removing the recast on sidewalk of the TSV opening with a first chemical, wherein the first chemical comprises a halogen-containing chemical; and cleaning the sidewalls of the TSV opening with a second chemical by substantially removing a residual of the first chemical, wherein the second chemical comprises a first component that is substantially inactive with the material of the substrate and a second component that is substantially active with the halogen component of the halogen-containing chemical, and wherein the first component is selected from a group consisting of helium, neon, argon, krypton, xenon and radon, and wherein the second component comprises, wherein the second chemical comprises xenon dihydride (XeH2). - View Dependent Claims (7, 8, 9)
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Specification