Compact optical proximity sensor with ball grid array and windowed substrate
First Claim
1. An optical proximity sensor, comprising:
- a printed circuit board (“
PCB”
) substrate comprising an upper surface, a lower surface having electrical contacts disposed thereon, and an aperture extending through the substrate from the upper surface to the lower surface;
a light emitter and a light detector mounted on the upper surface of the substrate;
an integrated circuit located at least partially within the aperture, a molding compound being disposed between portions of the integrated circuit and substrate, the integrated circuit having an upper surface and a lower surface, the upper surface of the integrated circuit being substantially flush with the upper surface of the substrate such that the upper surface of the integrated circuit is substantially flush with a bonding region configured to have a lower surface of the light emitter mounted thereto and a bonding region configured to have a lower surface of the light detector mounted thereto, the lower surface of the integrated circuit being configured to be wire bonded to the electrical contacts on the lower surface of the substrate, the molding compound being further configured to protect wire bonds between the lower surface of the integrated circuit and the electrical contacts on the lower surface of the substrate;
an ambient light detector mounted on the upper surface of the integrated circuit;
first and second molded light pass components disposed over and covering the light emitter and the light detector, respectively; and
a molded light cut component disposed between and over portions of the first and second light pass components.
9 Assignments
0 Petitions
Accused Products
Abstract
Various embodiments of a compact optical proximity sensor with a ball grid array and windowed or apertured substrate are disclosed. In one embodiment, the optical proximity sensor comprises a printed circuit board (“PCB”) substrate comprising an aperture and a lower surface having electrical contacts disposed thereon, an infrared light emitter and an infrared light detector mounted on an upper surface of the substrate, an integrated circuit located at least partially within the aperture, a molding compound being disposed between portions of the integrated circuit and substrate, an ambient light detector mounted on an upper surface of the integrated circuit, first and second molded infrared light pass components disposed over and covering the infrared light emitter and the infrared light detector, respectively, and a molded infrared light cut component disposed between and over portions of the first and second infrared light pass components.
113 Citations
26 Claims
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1. An optical proximity sensor, comprising:
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a printed circuit board (“
PCB”
) substrate comprising an upper surface, a lower surface having electrical contacts disposed thereon, and an aperture extending through the substrate from the upper surface to the lower surface;a light emitter and a light detector mounted on the upper surface of the substrate; an integrated circuit located at least partially within the aperture, a molding compound being disposed between portions of the integrated circuit and substrate, the integrated circuit having an upper surface and a lower surface, the upper surface of the integrated circuit being substantially flush with the upper surface of the substrate such that the upper surface of the integrated circuit is substantially flush with a bonding region configured to have a lower surface of the light emitter mounted thereto and a bonding region configured to have a lower surface of the light detector mounted thereto, the lower surface of the integrated circuit being configured to be wire bonded to the electrical contacts on the lower surface of the substrate, the molding compound being further configured to protect wire bonds between the lower surface of the integrated circuit and the electrical contacts on the lower surface of the substrate; an ambient light detector mounted on the upper surface of the integrated circuit; first and second molded light pass components disposed over and covering the light emitter and the light detector, respectively; and a molded light cut component disposed between and over portions of the first and second light pass components. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A method of making an optical proximity sensor, comprising:
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providing a printed circuit board (“
PCB”
) substrate comprising an upper surface, a lower surface having electrical contacts disposed thereon, and an aperture extending through the substrate from the upper surface to the lower surface;mounting a light emitter and a light detector on the upper surface of the substrate; positioning an integrated circuit at least partially within the aperture such that an upper surface of the integrated circuit is substantially flush with the upper surface of the substrate as well as a lower surface of the light emitter and a lower surface of the light detector; bonding one or more wires between a lower surface of the integrated circuit and the electrical contacts on the lower surface of the substrate; placing a molding compound between portions of the integrated circuit and substrate, the molding compound also physically protecting the one or more wires that have been bonded between the lower surface of the integrated circuit and the electrical contacts on the lower surface of the substrate; mounting an ambient light detector on the upper surface of the integrated circuit; molding first and second light pass components over and covering the light emitter and the light detector, respectively; and molding a light cut component between and over portions of the first and second light pass components. - View Dependent Claims (21, 22, 23, 24, 25, 26)
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Specification