Methods of creating probe structures from a plurality of planar layers

• US 8,717,054 B2
• Filed: 10/14/2011
• Issued: 05/06/2014
• Est. Priority Date: 02/04/2003
• Status: Active Grant

• Current Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Original Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Inventors: Chen, Richard T., Kruglick, Ezekiel J. J., Bang, Christopher A., Smalley, Dennis R., Lembrikov, Pavel B.
• Primary Examiner(s): TANG, MINH NHUT
• Application Number:
  US13/273,823
• Publication Number:
  US 20120064226A1
• Time in Patent Office: 935 Days
• Field of Search: None
• US Class Current: 324/755.05
• CPC Class Codes: C25D 5/02 Electroplating of selected surface areas
• CPC Class Codes: G01R 1/0483 Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips for IC's with connecting points around the edges only G01R1/0433
• CPC Class Codes: G01R 1/06711 Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
• CPC Class Codes: G01R 1/06716 Elastic
• CPC Class Codes: G01R 1/06727 Cantilever beams
• CPC Class Codes: G01R 1/06738 related to tip portion
• CPC Class Codes: G01R 1/06744 Microprobes, i.e. having dimensions as IC details
• CPC Class Codes: G01R 1/06755 Material aspects
• CPC Class Codes: G01R 1/07342 the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
• CPC Class Codes: G01R 1/07357 with flexible bodies, e.g. buckling beams
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06

Abstract

Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. Some embodiments are directed to various designs of cantilever-like probe structures while other embodiments are directed to methods for fabricating probe structures. In some embodiments, methods of forming probe structures include formation of a plurality of planar multi-material electrodeposited layers wherein each probe structure includes a contact tip and a compliant body, wherein the compliant body is formed from at least one material that is different from the contact tip material and wherein the compliant body provides for elastic compression of the probe in a plane of primary motion during use and wherein during formation of the layers a stacking direction of the plurality of layers is perpendicular to the plane of primary motion.

Claims

1. A method of creating a probe structure for contacting a first electronic components wherein the probe structure comprises a contact tip for contacting the first electronic component and a compliant body, the method comprising:

a) forming at least a portion of the compliant body and the contact tip from one or more multiple material layers of electrodeposited material, wherein during formation of each multiple material layer at least one of the multiple materials is at least one structural material and wherein at least another one of the multiple materials is at least one sacrificial material and wherein at least a plurality of the multiple materials are planarized to set a boundary level for each of the one or more multiple material layers; and

b) after forming the compliant body and the contact tip, releasing the at least one structural material from the at least one sacrificial material to reveal the probe structure formed from the at least one structural material, wherein the at least one structural material forming the compliant body comprises at least one material that is different from the at least one structural material forming the contact tip,

wherein each successive layer is formed on the simultaneously adhered to a previously formed layer; and

wherein the compliant body provides for elastic compression of the probe structure in a plane of primary motion when making contact with the first electronic component and wherein during formation of the probe structure, a stacking direction of layers forming the probe structure is perpendicular to the plane of primary motion.

2. The method of claim 1 wherein a material forming a contact portion of the contact tip is different from any material forming the compliant body.

3. The method of claim 1 wherein the probe structure comprises a cantilever probe structure and at least one feature selected from the group consisting of:

(1) a cantilever element consisting of a single cantilever beam;

(2) a cantilever element comprising a plurality of cantilever beams;

(3) an extended base portion that extends between a cantilever element and a surface of a second electronic component and allows for contacting a surface of the second electronic component;

(4) a configuration including a primary beam and at least one additional beam that joins the primary beam and connects to an elongated base via a support element that is different from a support element that connects the primary beam to the elongated base.

4. The method of claim 1 wherein the probe structure comprises a cantilever probe structure comprising a plurality of beam elements wherein at least part of each of the plurality of beam elements are formed within a single multiple material layer.

5. The method of claim 1 wherein the method of creating the probe structure simultaneously creates a plurality of probe structures in a batch process on a substrate over which a release layer is formed and onto which the multiple materials are deposited.

6. The method of claim 5 wherein a plurality of probes are attached to a second electronic component in a desired configuration and wherein the contact tips are made to at least temporarily contact the first electronic component to provide an electrical connection between the first and second electronic components.

7. The method of claim 1 wherein the one or more multiple material layers from which the compliant body is formed comprise a plurality of layers and wherein the one or more multiple material layers from which the contact tip is formed is or are the same as the multiple material layers from which the compliant body is formed.

8. A method of creating a probe structure for contacting a first electronic component wherein the probe structure comprises a contact tip for contacting the first electronic component and a compliant body, the method comprising:

a. forming at least part of the compliant body;

b. forming the contact tip;

wherein the forming of each of the compliant body and the contact tip comprise forming one or more multiple material layers of electrodeposited material, wherein at least one of the multiple materials is at least one structural material and wherein at least another one of the multiple materials is at least one sacrificial material and wherein at least a plurality of the multiple materials are planarized to set a boundary level for each layer, wherein the compliant body and the contact tip are each formed from at least one structural material deposited during the formation of their respective layer or layers, and

c. after forming the compliant body and the contact tip, releasing the at least one structural material from the at least one sacrificial material to reveal the probe structure formed from the at least one structural material;

wherein successive layers are successively formed on adhered to previously formed layers;

wherein the at least one structural material forming the compliant body portion of the probe comprises at least one material that is different from at least one structural material forming the contact tip;

wherein the compliant body provides for elastic compression of the probe structure in a plane of primary motion when making contact with the first electronic component and wherein during formation of the probe structure, a stacking direction of layers forming the probe structure is perpendicular to the plane of primary motion.

9. The method of claim 8 wherein a material forming a contact portion of the contact tip is different from any material forming the the compliant body.

10. The method of claim 9 wherein the probe structure comprises a cantilever probe structure comprising at least one feature selected from the group consisting of:

(1) a cantilever element consisting of a single cantilever beam;

(2) a cantilever element comprising a plurality of cantilever beams;

(3) an extended base portion that extends between a cantilever element and a surface of a second electronic component and allows for contacting a surface of the second component;

(4) a configuration including a primary beam and at least one additional beam that joins the primary beam and connects to an elongated base via a support element that is different from a support element that connects the primary beam to the elongated base.

11. The method of claim 10 wherein the method of creating probe structure simultaneously creates a plurality of probe structures in a batch process on a substrate over which a release layer is formed and onto which the multiple materials are deposited.

12. The method of claim 11 wherein a plurality of probe structures are attached to a second electronic component in a desired configuration and wherein the contact tips are made to at least temporarily contact a the first electronic components to provide an electrical connection between the first and the second electronic components.

13. A method of creating a probe structure for contacting a first electronic components wherein the probe structure comprises a contact tip for contacting the first electronic component and a compliant body the method comprising:

a) forming a first part of the compliant body;

b) forming the contact tip;

wherein the formation of each of the compliant body and the contact tip comprise forming one or more multiple material layers of deposited material, wherein at least one of the multiple materials is at least one structural material and wherein at least another one of the multiple materials is at least one sacrificial material and wherein at least a plurality of the multiple materials are planarized to set a boundary level for each layer, and

c) after forming the compliant and the contact tip, releasing the at least one structural material from the at least one sacrificial material to reveal the probe structure formed from the at least one structural material;

wherein successive layers are successively formed on and adhered to previously formed layers,

wherein the at least one structural material forming the compliant body portion of the probe structure comprises at least one material that is different from the at least one structural material forming the contact tip; and

wherein the compliant body provides for elastic compression of the probe structure in a plane of primary motion when making contact with the first electronic component and wherein during formation of the probe structure, a stacking direction of the one or more layers forming the probe structure is perpendicular to the plane of primary motion.

14. The method of claim 13 wherein a material forming a contact portion of the contact tip is different from any material forming the compliant body.

15. The method of claim 14 wherein the probe structure comprises a cantilever probe comprising at least one feature selected from the group consisting of:

a cantilever element consisting of a single cantilever beam;

(2) a cantilever element comprising a plurality of cantilever beams;

(3) an extended base portion that extends between a cantilever element and a surface of a second electronic component and allows for contacting a surface of the second electronic component;

(4) a configuration including a primary beam and at least one additional beam that joins the primary beam and connects to an elongated base via a support element that is different from a support element that connects the primary beam to the elongated base.

16. The method of claim 13 wherein the method of creating the probe structure simultaneously creates a plurality of probe structures in a batch process on a substrate over which a release layer is formed and onto which the multiple materials are deposited.

17. The method of claim 16 wherein a plurality of probe structures are attached to a second electronic component in a desired configuration and wherein the contact tips are made to at least temporarily contact the first electronic components to provide an electrical connection between the first and the second electronic components.

18. The method of claim 13 wherein the deposited material is deposited via a process selected from the group consisting of (1) electroplating;

(2) electroless plating;

(3) PVD, (4) CVD, (5) sputtering, and (6) spray metal deposition.