Probe devices formed from multiple planar layers of structural material with tip regions formed from one or more intermediate planar layers

• US 8,717,055 B2
• Filed: 10/03/2011
• Issued: 05/06/2014
• Est. Priority Date: 02/04/2003
• Status: Active Grant

• Current Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Original Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Inventors: Chen, Richard T., Kruglick, Ezekiel J. J., Bang, Christopher A., Smalley, Dennis R., Lembrikov, Pavel B.
• Primary Examiner(s): TANG, MINH NHUT
• Application Number:
  US13/251,789
• Publication Number:
  US 20120062260A1
• Time in Patent Office: 946 Days
• Field of Search: None
• US Class Current: 324/755.07
• CPC Class Codes: C25D 5/02 Electroplating of selected surface areas
• CPC Class Codes: G01R 1/0483 Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips for IC's with connecting points around the edges only G01R1/0433
• CPC Class Codes: G01R 1/06711 Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
• CPC Class Codes: G01R 1/06716 Elastic
• CPC Class Codes: G01R 1/06727 Cantilever beams
• CPC Class Codes: G01R 1/06738 related to tip portion
• CPC Class Codes: G01R 1/06744 Microprobes, i.e. having dimensions as IC details
• CPC Class Codes: G01R 1/06755 Material aspects
• CPC Class Codes: G01R 1/07342 the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
• CPC Class Codes: G01R 1/07357 with flexible bodies, e.g. buckling beams
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06

Abstract

Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, methods are used to form probe structures from a plurality of planar multi-material layers wherein the probe structures include a contact tip and a compliant body with the compliant body formed from at least one material that is different from the tip material and wherein compliant body provides for elastic compression of the probe in a plane of primary motion during use and wherein during formation a stacking direction of the plurality of layers is perpendicular to the plane of primary motion.

Claims

1. A probe device for contacting an electronic component comprising:

a multi-layer body comprising at least three stair stepped planar layers of structural material with each layer adhered to at least one adjacent layers, comprising;

at least one mounting region for fixedly mounting the probe to a substrate,

a tip region for making temporary contact with the electronic component; and

a middle region configured to provide a spring force for providing compliant contact between the tip region and the electronic component

wherein the tip region is formed from one or more intermediate layers located between a first layer and a last layer, and wherein the tip region formed from the one or more intermediate layers extends beyond structural material of the first and last layer.

2. The probe device of claim 1, wherein the middle region comprises at least one post and at least one cantilever beam, the mounting region comprises an elongated base element that connects to the post, and the tip region comprises an extension element that extends from a distal end of the at least one cantilever beam.

3. The probe of device of claim 1 wherein the middle region comprises at least one cantilever beam having a distal and proximal end wherein the proximal end is connected to a post having a portion which forms the at least one mounting region and wherein the distal end of the at least one cantilever joins an extension that forms the tip region.

4. The probe of claim 1 wherein the middle region and the at least one mounting region are each formed of a different material than at least part of the tip region.