Probe devices formed from multiple planar layers of structural material with tip regions formed from one or more intermediate planar layers
First Claim
1. A probe device for contacting an electronic component comprising:
- a multi-layer body comprising at least three stair stepped planar layers of structural material with each layer adhered to at least one adjacent layers, comprising;
at least one mounting region for fixedly mounting the probe to a substrate,a tip region for making temporary contact with the electronic component; and
a middle region configured to provide a spring force for providing compliant contact between the tip region and the electronic componentwherein the tip region is formed from one or more intermediate layers located between a first layer and a last layer, and wherein the tip region formed from the one or more intermediate layers extends beyond structural material of the first and last layer.
1 Assignment
0 Petitions
Accused Products
Abstract
Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, methods are used to form probe structures from a plurality of planar multi-material layers wherein the probe structures include a contact tip and a compliant body with the compliant body formed from at least one material that is different from the tip material and wherein compliant body provides for elastic compression of the probe in a plane of primary motion during use and wherein during formation a stacking direction of the plurality of layers is perpendicular to the plane of primary motion.
-
Citations
4 Claims
-
1. A probe device for contacting an electronic component comprising:
-
a multi-layer body comprising at least three stair stepped planar layers of structural material with each layer adhered to at least one adjacent layers, comprising; at least one mounting region for fixedly mounting the probe to a substrate, a tip region for making temporary contact with the electronic component; and a middle region configured to provide a spring force for providing compliant contact between the tip region and the electronic component wherein the tip region is formed from one or more intermediate layers located between a first layer and a last layer, and wherein the tip region formed from the one or more intermediate layers extends beyond structural material of the first and last layer. - View Dependent Claims (2, 3, 4)
-
Specification