Substrate conveyance method and substrate conveyance system
First Claim
1. A wafer conveyance method, comprising:
- moving a holding surface of a conveyance robot having an electrode for electrostatic attraction to the vicinity of a wafer supported by a supporting surface of a support member;
raising at least a portion of the supporting surface to elevate the wafer above a stage of the support member; and
transferring the wafer from the raised supporting surface to the holding surface while applying a voltage to the electrode.
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Accused Products
Abstract
Disclosed are a substrate conveyance method and substrate conveyance system that are able to quickly transfer a substrate without losing positional accuracy. Using an electrostatic chuck mechanism in the holding of a wafer (W) by the holding surface (210) of a conveyance robot, the wafer (W) is transferred from a supporting surface (303) to the holding surface (210) in the state where an electrostatic attraction force is generated at the holding surface (210). As a result, since it is possible to hold the wafer by means of the electrostatic attraction force starting immediately after the wafer (W) has been transferred to the holding surface (210), it is possible to rapidly execute a wafer (W) conveying operation and thus it is possible to reduce the conveying time of the wafer between processing chambers.
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Citations
11 Claims
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1. A wafer conveyance method, comprising:
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moving a holding surface of a conveyance robot having an electrode for electrostatic attraction to the vicinity of a wafer supported by a supporting surface of a support member; raising at least a portion of the supporting surface to elevate the wafer above a stage of the support member; and transferring the wafer from the raised supporting surface to the holding surface while applying a voltage to the electrode. - View Dependent Claims (2, 3, 4, 5)
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6. A wafer conveyance system, comprising:
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a conveyance robot including a holding surface having an electrode for electrostatic attraction; a support member comprising a stage and a supporting surface for supporting a wafer; and a controller configured to carry out an operation control for moving the holding surface relative to the supporting surface, an operation control for raising at least a portion of the supporting surface to elevate the wafer above the stage of the support member, and an operation control for supplying a voltage to the electrode, and configured to cause the conveyance robot to transfer the wafer from the raised supporting surface to the holding surface while a voltage is applied to the electrode. - View Dependent Claims (7, 8, 9, 10, 11)
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Specification