Fingerprint sensor package and method

• US 8,717,775 B1
• Filed: 08/02/2010
• Issued: 05/06/2014
• Est. Priority Date: 08/02/2010
• Status: Active Grant

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Bolognia, David, Kelly, Mike, Adlam, Ted
• Primary Examiner(s): Norris, Jeremy C
• Assistant Examiner(s): Willis, Tremesha S
• Application Number:
  US12/848,833
• Time in Patent Office: 1,373 Days
• Field of Search: 361/803, 361/56, 361/112, 361/220, 361/230, 361/719, 361/720, 361/761, 361/764, 361/767, 361/768, 361/780, 174/255
• US Class Current: 361/803
• CPC Class Codes: G06V 40/1329 Protecting the fingerprint sensor against damage caused by the finger
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 23/13 characterised by the shape
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 24/06 of a plurality of bonding areas
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/181 Encapsulation

Abstract

A fingerprint sensor package includes a flat surface having a dielectric protective coating protecting a sensing element of a fingerprint sensor and an electrically conductive bezel that discharges electrostatic discharge (ESD). Both the protective coating and the bezel can be colored to have desired colors. Accordingly, the flat surface can be colored as desired enhancing the attractiveness for consumer applications. Further, light emitting diodes are integrated into the fingerprint sensor package providing a visual feedback to the user that the user'"'"'s fingerprint has been successfully sensed. Further, the fingerprint sensor package is formed using a high volume low cost assembly technique.

Claims

1. An electronic component package comprising:

a fingerprint sensor comprising an active surface comprising a sensing element for directly sensing fingerprints; and

a substrate comprising a fingerprint sensor cavity, a first surface and a second surface, the first surface and the second surface corresponding respectively to a lower limit and an upper limit of a volume of the fingerprint sensor cavity, wherein the fingerprint sensor including the sensing element is located within the volume of the fingerprint sensor cavity and the active surface of the fingerprint sensor is parallel to and coplanar with the first surface of the substrate, wherein the substrate further comprises traces on the first surface coupled to bond pads on the active surface of the fingerprint sensor.

2. The electronic component package of claim 1 further comprising bond wires coupling the bond pads to the traces.

3. The electronic component package of claim 1 further comprising polymer thick film (PTF) conductors coupling the bond pads to the traces.

4. The electronic component package of claim 1 further comprising a protective coating covering the active surface, the traces, and the first surface of the substrate.

5. The electronic component package of claim 1 further comprising terminals on a second surface of the substrate, the terminals being coupled to the traces.

6. The electronic component package of claim 1 wherein the electronic component package is selected from the group consisting of a Ball Grid Array (BGA) and a Land Grid Array (LGA).

7. The electronic component package of claim 1 further comprising a package body in the fingerprint sensor cavity.

8. The electronic component package of claim 7 wherein the package body mounts the fingerprint sensor in the fingerprint sensor cavity.

9. The electronic component package of claim 7 wherein the package body comprises a surface parallel to and coplanar with the active surface of the fingerprint sensor and the first surface of the substrate.

10. The electronic component package of claim 1 further comprising a bezel adjacent the fingerprint sensor.

11. The electronic component package of claim 10 wherein the bezel comprises a conductive ink coupled to the first surface of the substrate.

12. The electronic component package of claim 1 further comprising a diode having a light emitting face parallel to and coplanar with the first surface of the substrate.

13. An electronic component package comprising:

a primary substrate comprising a first surface comprising traces thereon;

a fingerprint sensor mounted to terminals of the traces;

a package body directly contacting and enclosing an inactive surface and sides of the fingerprint sensor; and

electrically conductive vias extending entirely through the package body between a first surface of the package body and a second surface of the package body, the vias being coupled to the traces.

14. The electronic component package of claim 13 further comprising a second substrate comprising a fingerprint sensor cavity in which the fingerprint sensor is located.

15. An electronic component package comprising:

a flexible substrate;

a fingerprint sensing element coupled to the flexible substrate;

traces coupled to the flexible substrate, the traces comprising electronic component terminals;

an electronic component coupled to the electronic component terminals;

a substrate comprising a fingerprint sensor cavity in which the electronic component is located; and

a package body in the fingerprint sensor cavity and directly contacting and enclosing the electronic component.

16. The electronic component package of claim 15 further comprising a sensing element on flex fingerprint sensor comprising the flexible substrate, the fingerprint sensing element, and the traces.

17. The electronic component package of claim 15 further comprising an adhesive between the flexible substrate and the substrate.

18. An electronic component package comprising:

an electronic component comprising an active surface comprising bond pads;

redistribution layer (RDL) traces coupled to the bond pads;

a package body directly contacting and encapsulating an inactive surface opposite the active surface and sides of the electronic component; and

electrically conductive vias in the package body, wherein the RDL traces form an interconnect between the bond pads and the vias and also form a fingerprint sensing element.