Electrical interconnects in an electronic contact lens

• US 8,721,074 B2
• Filed: 05/29/2012
• Issued: 05/13/2014
• Est. Priority Date: 11/30/2011
• Status: Active Grant

• Current Assignee: Johnson & Johnson Vision Care Incorporated (Johnson & Johnson)
• Original Assignee: Johnson & Johnson Vision Care Incorporated (Johnson & Johnson)
• Inventors: Pugh, Randall Braxton, Toner, Adam, Pandojirao-S, Praveen, Riall, James Daniel, Otts, Daniel B., Kernick, Edward
• Primary Examiner(s): Lester, Evelyn A
• Assistant Examiner(s): ALEXANDER, WILLIAM R
• Application Number:
  US13/482,094
• Publication Number:
  US 20130135578A1
• Time in Patent Office: 714 Days
• Field of Search: 351/159.03, 351/159.39, 359/315
• US Class Current: 351/159.39
• CPC Class Codes: G02C 7/04 Contact lenses for the eyes disinfection or sterilisation of contact lenses A61L12/00
• CPC Class Codes: G02C 7/083 Electrooptic lenses
• CPC Class Codes: G02C 7/101 having an electro-optical light valve electro-optical elements per se G02F
• CPC Class Codes: H05K 1/0274 Optical details, e.g. printed circuits comprising integral optical means H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/09045 Locally raised area or protrusion of insulating substrate
• CPC Class Codes: H05K 2201/09118 Moulded substrate
• CPC Class Codes: H05K 2201/10121 Optical component, e.g. opto-electronic component
• CPC Class Codes: H05K 2201/10568 Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
• CPC Class Codes: H05K 2201/10727 Leadless chip carrier [LCC], e.g. chip-modules for cards
• CPC Class Codes: H05K 2201/10916 Terminals having auxiliary metallic piece, e.g. for soldering
• CPC Class Codes: H05K 2201/10984 Component carrying a connection agent, e.g. solder, adhesive
• CPC Class Codes: H05K 3/301 by means of a mounting structure H05K3/325 takes precedence

Abstract

Ophthalmic lenses, including contact lenses may be enhanced through the incorporation of both active and passive electrical components. Electrical interconnects and die attachment configurations are required to ensure electrical connectivity between the components and the optic portion of the lens as well as providing a means for mounting planar devices on spherical surfaces. Electrical interconnects and die attachment for powered ophthalmic devices, including contact lenses includes realizing conductive traces on optical plastic, attaching planar dies to spherical surfaces and underfilling, overmolding and light blocking to complete the lens.

Claims

1. An ophthalmic lens assembly comprising:

a non-planar substrate;

a lens section formed in the non-planar substrate; and

one or more electronic components cooperatively associated with the lens section and mounted on the non-planar substrate, wherein one of the non-planar substrate and the one or more electronic components comprise mechanical mounting structures, configured to facilitate mounting planar structures to non-planar surfaces, and electrical interconnect structures for mounting the one or more electronic components to the non-planar substrate.

2. The ophthalmic lens assembly according to claim 1, wherein the non-planar substrate comprises an optical grade plastic.

3. The ophthalmic lens assembly according to claim 1, wherein the mechanical mounting structures comprise one or more stand-offs formed on the non-planar substrate, the one or more stand-offs being variably sized to create a planar mounting substrate for the one or more electronic components.

4. The ophthalmic lens assembly according to claim 3, wherein at least one of the one or more stand-offs are at least partially coated with a conductive material.

5. The ophthalmic lens assembly according to claim 1, wherein the mechanical mounting structures comprise one or more stand-offs formed on the one or more electronic components, the one or more stand-offs being variably sized to create a non-planar mounting surface for mounting the one or more electronic components to the non-planar substrate.

6. The ophthalmic lens assembly according to claim 5, wherein at least one of the one or more stand-offs are at least partially coated with a conductive material.

7. The ophthalmic lens assembly according to claim 1, wherein the mechanical mounting structures comprise one or more raised structures formed on the non-planar substrate, the one or more raised structures being variably sized to create a planar mounting substrate for the one or more electronic components.

8. The ophthalmic lens assembly according to claim 7, wherein at least one of the one or more raised structures are at least partially coated with a conductive material.

9. The ophthalmic lens assembly according to claim 1, wherein the mechanical mounting structures comprise one or more raised structures formed on the one or more electronic components, the one or more raised structures being variably sized to create a non-planar mounting surface for mounting the one or more electronic components to the non-planar substrate.

10. The ophthalmic lens assembly according to claim 9, wherein at least one of the one or more raised structures are at least partially coated with a conductive material.

11. The ophthalmic lens assembly according to claim 1, wherein the mechanical mounting structures comprise one or more planar reliefs formed in the non-planar substrate, the one or more planar reliefs being variably sized to create a planar mounting substrate for the one or more electronic components.

12. The ophthalmic lens assembly according to claim 11, wherein at least one of the one or more planar reliefs are at least partially coated with conductive materials.

13. The ophthalmic lens assembly according to claim 1, wherein the electrical interconnect structures comprise traces affixed to the non-planar

substrate, the traces being formed from a conductive material.