Ingestible circuitry
First Claim
Patent Images
1. An ingestible device comprising:
- a support comprising a planar surface;
a first conductive material having a first surface and a second surface, wherein the first surface of the first conductive material is positioned on the planar surface of the support;
an electronic component comprising a digestible second conductive material positioned on the second surface of the first conductive material, wherein the first conductive material is positioned between the second conductive material and the support, wherein the first conductive material is configured to receive an integrated circuit upon the second surface, adjacent to the second conductive material, and provide an electrical interconnect between the second conductive material and the integrated circuit; and
a cover comprising an electrically insulative material deposited over the electronic component, wherein the electrically insulative material comprises a digestible material.
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Abstract
The present invention provides for safe and reliable electronic circuitry that can be employed in ingestible compositions. The ingestible circuitry of the invention includes a solid support; a conductive element; and an electronic component. Each of the support, conductive element and electronic component are fabricated from an ingestible material. The ingestible circuitry finds use in a variety of different applications, including as components of ingestible identifiers, such as may be found in ingestible event markers, e.g., pharma-informatics enabled pharmaceutical compositions.
726 Citations
10 Claims
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1. An ingestible device comprising:
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a support comprising a planar surface; a first conductive material having a first surface and a second surface, wherein the first surface of the first conductive material is positioned on the planar surface of the support; an electronic component comprising a digestible second conductive material positioned on the second surface of the first conductive material, wherein the first conductive material is positioned between the second conductive material and the support, wherein the first conductive material is configured to receive an integrated circuit upon the second surface, adjacent to the second conductive material, and provide an electrical interconnect between the second conductive material and the integrated circuit; and a cover comprising an electrically insulative material deposited over the electronic component, wherein the electrically insulative material comprises a digestible material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of assembling an ingestible device comprising:
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positioning a first conductive material on a planar surface of a support; positioning an electronic component comprising a digestible second conductive material on a surface of the first conductive material such that the first conductive material is positioned between the support and the electronic component; positioning an integrated circuit on the surface of the first conductive material, adjacent to the electric component, such that the first conductive material provides an electrical interconnect between the second conductive material and the integrated circuit; and depositing an electrically insulative digestible material on the electronic component.
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Specification