Techniques for pitch densification
First Claim
1. A method comprising:
- inserting a material to be densified into a mold, wherein the mold is part of an apparatus including;
a ram configured to apply a ram pressure sufficient to force a pitch into the mold to densify the material,a gas source configured to apply a gas pressure sufficient to force the pitch into the mold to densify the material, anda vacuum source operable to create a vacuum pressure in the mold at least prior to application of either the ram pressure or the gas pressure; and
densifying the material in the mold via pitch using a selectable one of the ram, the gas source, the ram and the vacuum source, or the gas source and the vacuum source.
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Abstract
In some examples, a method for densifying a material via pitch comprises inserting the material to be densified into a mold, wherein the mold is part of an apparatus. The apparatus may include a ram configured to apply a ram pressure sufficient to force a pitch into the mold to densify the material, a gas source configured to apply a gas pressure sufficient to force the pitch into the mold to densify the material, and a vacuum source operable to create a vacuum pressure in the mold at least prior to application of either the ram pressure or the gas pressure. The method may further comprise densifying the material in the mold via pitch using a selectable one of the ram, the gas source, the ram and the vacuum source, or the gas source and the vacuum source.
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Citations
20 Claims
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1. A method comprising:
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inserting a material to be densified into a mold, wherein the mold is part of an apparatus including; a ram configured to apply a ram pressure sufficient to force a pitch into the mold to densify the material, a gas source configured to apply a gas pressure sufficient to force the pitch into the mold to densify the material, and a vacuum source operable to create a vacuum pressure in the mold at least prior to application of either the ram pressure or the gas pressure; and densifying the material in the mold via pitch using a selectable one of the ram, the gas source, the ram and the vacuum source, or the gas source and the vacuum source. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method comprising:
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inserting a material to be densified into a mold, wherein the mold is part of an apparatus including; a ram configured to apply a ram pressure to force a melted pitch into the mold to densify the material during at least one of a resin transfer molding cycle or a vacuum-assisted resin transfer molding cycle, an inert gas source configured to apply a gas pressure to force the melted pitch into the mold to densify the material during a vacuum pressure infiltration cycle, and a vacuum source configured to create a vacuum pressure in the mold during at least one of the vacuum-assisted resin transfer molding cycle or the vacuum pressure infiltration cycle; and densifying the material in the mold via pitch using a selectable one of the resin transfer molding cycle, the vacuum-assisted resin transfer molding cycle, or the vacuum pressure infiltration cycle. - View Dependent Claims (13, 14, 15, 16)
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17. A method comprising:
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inserting a material to be densified into a mold, wherein the mold is part of an apparatus configured to densify the material using a selectable one of a resin transfer molding cycle, a vacuum-assisted resin transfer molding cycle, or a vacuum pressure infiltration cycle; selecting one of the resin transfer molding cycle, the vacuum-assisted resin transfer molding cycle, or the vacuum pressure infiltration cycle to densify the material in the mold; and densifying the material in the mold using the selected one of the resin transfer molding cycle, the vacuum-assisted resin transfer molding cycle, or the vacuum pressure infiltration cycle to densify the material to be densified. - View Dependent Claims (18, 19, 20)
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Specification