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Optical systems fabricated by printing-based assembly

  • US 8,722,458 B2
  • Filed: 05/04/2011
  • Issued: 05/13/2014
  • Est. Priority Date: 01/17/2007
  • Status: Active Grant
First Claim
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1. A method of making a semiconductor-based optical system, said method comprising the steps of:

  • providing a device substrate having a receiving surface;

    assembling a plurality of printable semiconductor elements on said receiving surface of said substrate via dry transfer contact printing;

    wherein each of said printable semiconductor elements comprises a semiconductor structure having a length selected from the range of 0.0001 millimeters to 1000 millimeters, a width selected from the range of 0.0001 millimeters to 1000 millimeters and a thickness selected from the range of 0.00001 millimeters to 3 millimeters; and

    providing an electrically conducting grid or mesh in electrical contact with at least a portion of said printable semiconductor elements, said grid or mesh providing one or more electrodes or electrical interconnection structures in said semiconductor-based optical system.

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