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Controlling defects in thin wafer handling

  • US 8,722,540 B2
  • Filed: 07/22/2010
  • Issued: 05/13/2014
  • Est. Priority Date: 07/22/2010
  • Status: Expired due to Fees
First Claim
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1. A method comprising:

  • bonding a wafer on a carrier through an adhesive;

    after the step of bonding the wafer, performing a thinning process on the wafer; and

    after the step of performing the thinning process, removing a portion of the adhesive not covered by the wafer, wherein a portion of the adhesive covered by the wafer is not removed, wherein any plasma processes performed after the step of performing the thinning process is also performed after the removing the portion of the adhesive, and wherein the removing the portion of the adhesive comprises rotating the wafer.

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