Micro-channel-cooled high heat load light emitting device
First Claim
1. A lamp head module comprising:
- an optical macro-reflector including a window having an outer surface;
an array of light emitting diodes (LEDs) positioned within the optical reflector, the array having a high fill factor and a high aspect ratio operable to provide a high irradiance output beam pattern having a peak irradiance of greater than 25 W/cm2 at a work piece surface at least 1 mm away from the outer surface of the window of the optical reflector, wherein the peak irradiance does not require operation of the array at a pulsed emission duty cycle; and
a micro-channel cooler operable to maintain a substantially isothermal state among p-n junctions of the light emitting devices at a temperature of less than or equal to 80°
Celsius, the micro-channel cooler assembly also providing a substrate for the array, wherein a thermally efficient connection is formed between the array and the substrate by mounting the array to the micro-channel cooler wherein deep and long coolant flow channels in fluid communication with the micro-channel cooler serve to balance flow of coolant through the microchannel cooler.
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Accused Products
Abstract
Micro-channel-cooled UV curing systems and components thereof are provided. According to one embodiment, a lamp head module includes an optical macro-reflector, an array of LEDs and a micro-channel cooler assembly. The array is positioned within the reflector and has a high fill factor and a high aspect ratio. The array provides a high irradiance output beam pattern having a peak irradiance of greater than 25 W/cm2 at a work piece surface at least 1 mm away from an outer surface of a window of the reflector. The micro-channel cooler assembly maintains a substantially isothermal state among p-n junctions of the LEDs at less than or equal to 80° Celsius. The micro-channel cooler assembly also provides a common anode substrate for the array. A thermally efficient electrical connection is formed between the array and the common anode substrate by mounting the array to the micro-channel cooler assembly.
25 Citations
47 Claims
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1. A lamp head module comprising:
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an optical macro-reflector including a window having an outer surface; an array of light emitting diodes (LEDs) positioned within the optical reflector, the array having a high fill factor and a high aspect ratio operable to provide a high irradiance output beam pattern having a peak irradiance of greater than 25 W/cm2 at a work piece surface at least 1 mm away from the outer surface of the window of the optical reflector, wherein the peak irradiance does not require operation of the array at a pulsed emission duty cycle; and a micro-channel cooler operable to maintain a substantially isothermal state among p-n junctions of the light emitting devices at a temperature of less than or equal to 80°
Celsius, the micro-channel cooler assembly also providing a substrate for the array, wherein a thermally efficient connection is formed between the array and the substrate by mounting the array to the micro-channel cooler wherein deep and long coolant flow channels in fluid communication with the micro-channel cooler serve to balance flow of coolant through the microchannel cooler. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A lamp head module comprising:
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a high aspect ratio monolithically bonded foil micro-channel cooler substrate layer having a greater length than width wherein deep and long coolant flow channels in fluid communication with the micro-channel cooler serve to balance flow of coolant through the microchannel cooler; a high aspect ratio light emitting diode array layer having a greater length than width mounted to the micro-channel cooler substrate layer, the light emitting diode array layer having a high fill-factor and comprising a p-n junction layer, wherein the high aspect ratio monolithically bonded foil micro-channel cooler substrate layer has formed therein a plurality of microchannels and those of the plurality of microchannels that are closest to a bottom surface of the high aspect ratio light emitting diode array layer are in thermal parallel across the width of the high aspect ratio light emitting diode array layer; a flex-circuit layer, including a patterned cathode circuit material layer and a thin dielectric layer, mounted to the micro-channel cooler substrate layer, the cathode circuit material layer separated from the micro-channel cooler substrate layer by the thin dielectric layer, wherein the cathode circuit material layer and the thin dielectric layer combine in thickness to be less than 3×
a thickness of the light emitting diode array layer; andan optical reflector layer to direct photons emitted by said light emitting diode array layer, the optical reflector layer being at least 25×
a thickness of the light emitting diode array layer, wherein the thicknesses are measured in a direction substantially perpendicular to the p-n junction layer. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35)
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36. A lamp head module comprising:
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a package including; a high aspect ratio array of light emitting diode (LEDs), the high aspect ratio array having a greater length than width; a flex circuit having a segmented cathode layer to which bond pads of the high aspect ratio array are electrically coupled; and a high aspect ratio monolithically bonded foil micro-channel cooler having a length that is greater than a width and providing a substrate surface to which the high aspect ratio array is mounted; and a lamp body having formed therein an input coolant fluid channel and an output coolant fluid channel, wherein coolant fluid flows from the input coolant fluid channel through the micro-channel cooler and to the output coolant fluid channel to remove waste heat from the high aspect ratio array, wherein a length and a width of the input coolant fluid channel and the output coolant fluid channel is substantially similar to the length and the width of the high aspect ratio monolithically bonded foil micro-channel cooler, respectively, and a depth of the input coolant fluid channel and the output coolant fluid channel is at least one third the length of the high aspect ratio monolithically bonded foil micro-channel cooler and wherein the input and output coolant flow channels balance the flow of coolant through the microchannel cooler.
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37. An ultraviolet (UV) light emitting diode (LED) curing system comprising:
a plurality of end-to-end serially connected UV LED lamp head modules each including; an optical macro-reflector including a window having an outer surface; a LED array positioned within the optical reflector, the array having a high fill factor and a high aspect ratio operable to provide a substantially uniform high irradiance output beam pattern having a peak irradiance of greater than 25 W/cm2 at a work piece surface at least 1 mm away from the outer surface of the window of the optical reflector, wherein the peak irradiance does not require operation of the LED array at a pulsed emission duty cycle; and a micro-channel cooler assembly operable to maintain a substantially isothermal state among p-n junctions of LED in the LED array at a temperature of less than or equal to 80°
Celsius, the microchannel cooler assembly also providing a substrate for the LED array, wherein a thermally efficient electrical connection is formed between the LED array and the substrate by mounting the LED array to the micro-channel cooler assembly wherein deep and long coolant flow channels in fluid communication with the micro-channel cooler serve to balance flow of coolant through the microchannel cooler.
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38. A lamp head module comprising:
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an array of light emitting diodes (LEDs) having a high fill factor and a high aspect ratio operable to provide a substantially uniform high irradiance output beam along a long-axis of the array, wherein the LEDs include one or more ultraviolet emitting LEDs; a high-aspect ratio micro-channel cooler assembly, including a micro-channel cooler portion and outer capping layer portions, operable to maintain a substantially isothermal state among p-n junctions of the LEDS, the high-aspect ratio micro-channel cooler assembly also providing a substrate for the array, wherein a thermally efficient electrical connection is formed between the array and the substrate by mounting the array to the high-aspect ratio micro-channel cooler assembly; wherein a thickness of a heat spreader layer of the micro-channel cooler portion is less than approximately 200 microns; wherein a width of the micro-channel cooler portion is approximately 1.1 to 1.7 times a width of the array in a shortest dimension of the array and wherein deep and long coolant flow channels in fluid communication with the micro-channel cooler serve to balance flow of coolant through the microchannel cooler. - View Dependent Claims (39, 40, 41, 42, 43, 44, 45)
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46. A lamp head module comprising:
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a package including; a high aspect ratio array of light emitting diodes, wherein the high aspect ratio array has a greater length than width; a flex circuit having a segmented cathode layer to which bond pads of the high aspect ratio array are electrically coupled; and a high aspect ratio monolithically bonded foil micro-channel cooler having a length that is greater than a width and providing a substrate surface to which the high aspect ratio array is mounted; a lamp body having formed therein an input coolant fluid channel and an output coolant fluid channel, wherein coolant fluid flows from the input coolant fluid channel through the micro-channel cooler and to the output coolant fluid channel to remove waste heat from the high aspect ratio array, wherein a length and a width of the input coolant fluid channel and the output coolant fluid channel is substantially similar to the length and the width of the high aspect ratio monolithically bonded foil micro-channel cooler, respectively, and a depth of the input coolant fluid channel and the output coolant fluid channel is at least one third the length of the high aspect ratio monolithically bonded foil micro-channel cooler and wherein the input and output coolant flow channels balance the flow of coolant through the microchannel cooler; and wherein the package is affixed to the lamp body. - View Dependent Claims (47)
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Specification