Lead frame, light emitting diode having the lead frame, and backlight unit having the light emitting diode

• US 8,723,200 B2
• Filed: 07/01/2010
• Issued: 05/13/2014
• Est. Priority Date: 12/03/2008
• Status: Active Grant

• Current Assignee: Seoul Semiconductor Co., Ltd.
• Original Assignee: Seoul Semiconductor Co., Ltd.
• Inventors: Cho, Jae-Ho, Yoon, Sean-Jhin, Kim, Tae-Kwang, Kim, Kyung-Nam
• Primary Examiner(s): Jahan, Bilkis
• Application Number:
  US12/828,633
• Publication Number:
  US 20100315835A1
• Time in Patent Office: 1,412 Days
• Field of Search: 257/678, 257/736, 257/734, 257/762, 257/781, 257/666, 257/98, 257/99
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/46 Reflective coating, e.g. dielectric Bragg reflector
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

An LED includes a light-emitting chip, a metal member, and a housing. The light-emitting chip generates light. The light-emitting chip is arranged on the metal member. The housing is combined with the metal member to fix the metal member. The housing has an opening portion exposing at least a portion of the light-emitting chip and the metal member. The metal member includes a base metal layer, a light-reflecting layer arranged on the base metal layer, and a protection layer arranged on the light-reflecting layer and including a metal.

Claims

1. A lead frame, comprising:

a first lead terminal and a second lead terminal spaced apart from each other, each of the first lead terminal and the second lead terminal comprising;

a base metal layer;

a light-reflecting layer arranged directly on the base metal layer; and

a protection layer arranged directly on the light-reflecting layer and comprising a metal,

wherein the protection layer is the outermost layer of the lead frame, and

wherein the first lead terminal and the second lead terminal are configured to apply electric power to a light emitting chip.

2. The lead frame of claim 1, wherein the light-reflecting layer comprises silver (Ag) or aluminum (Al).

3. The lead frame of claim 1, wherein the protection layer comprises gold (Au), nickel (Ni), or titanium (Ti).

4. The lead frame of claim 3, wherein the protection layer comprises gold (Au) and is 0.1 nm to 600 nm thick.

5. The lead frame of claim 3, wherein the protection layer comprises nickel (Ni) or titanium (Ti) and is 0.1 nm to 20 nm thick.

6. The lead frame of claim 1, further comprising a nickel layer arranged between the base metal layer and the light-reflecting layer.

7. The lead frame of claim 6, wherein the nickel layer is arranged directly on the base metal layer, the light-reflecting layer is arranged directly on the nickel layer, and the protection layer is arranged directly on the light-reflecting layer.

8. The lead frame of claim 1, wherein the base metal layer comprises Cu.

9. The lead frame of claim 1, wherein the thickness of the base metal layer is about 0.1 mm to 1.0 mm.

10. A backlight unit, comprising:

a light guide plate; and

at least one light emitting diode (LED) to provide the light guide plate with light, wherein the at least one LED comprises;

a lead frame comprising a base metal layer, a light-reflecting layer arranged directly on the base metal layer, and a protection layer arranged directly on the light-reflecting layer and comprising a metal; and

a light-emitting chip arranged on the lead frame,

wherein the protection layer is the outermost layer of the lead frame.

11. The backlight unit of claim 10, wherein the light-reflecting layer comprises silver (Ag) or aluminum (Al).

12. The backlight unit of claim 10, wherein the protection layer comprises gold (Au), nickel (Ni), or titanium (Ti).

13. The backlight unit of claim 10, wherein the base metal layer comprises Cu.

14. The backlight unit of claim 10, wherein the thickness of the base metal layer is about 0.1 mm to 1.0 mm.

15. A lead frame, comprising:

a base metal layer;

a light-reflecting layer arranged on the base metal layer; and

a protection layer arranged on the light-reflecting layer and comprising a metal,

wherein the light-reflecting layer and the protection layer are arranged on a first side of the base metal layer and a second side of the base metal layer opposite to the first side, and

wherein the protection layer is the outermost layer of the lead frame.

16. A lead frame, comprising:

a first lead terminal and a second lead terminal spaced apart from each other, each of the first lead terminal and the second lead terminal comprising;

a base metal layer;

a light-reflecting layer arranged on the base metal layer; and

a protection layer arranged on the light-reflecting layer and comprising a metal,

wherein the light-reflecting layer and the protection layer are arranged on the entire length of the base metal layer, and

wherein the protection layer is the outermost layer of the lead frame, and

wherein the first lead terminal and the second lead terminal are configured to apply electric power to a light emitting chip.

17. A backlight unit, comprising:

a light guide plate; and

at least one light emitting diode (LED) to provide the light guide plate with light, wherein the at least one LED comprises;

a lead frame comprising a base metal layer, a light-reflecting layer arranged on the base metal layer, and a protection layer arranged on the light-reflecting layer and comprising a metal, wherein the light-reflecting layer and the protection layer are arranged on a first side of the base metal layer and a second side of the base metal layer opposite to the first side; and

a light-emitting chip arranged on the lead frame,

wherein the protection layer is the outermost layer of the lead frame.

18. A backlight unit, comprising:

a light guide plate; and

at least one light emitting diode (LED) to provide the light guide plate with light, wherein the at least one LED comprises;

a lead frame comprising a base metal layer, a light-reflecting layer arranged on the base metal layer, and a protection layer arranged on the light-reflecting layer and comprising a metal,

wherein the light-reflecting layer and the protection layer are arranged on the entire length of the base metal layer,

wherein a light-emitting chip is arranged on the lead frame, and

wherein the protection layer is the outermost layer of the lead frame.