Embedded electronic device and method for manufacturing an embedded electronic device
First Claim
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1. An embedded electronic device comprising:
- a printed circuit board, having a top surface and a bottom surface;
a plurality of circuit components attached to the top surface of the printed circuit board such that the plurality of circuit components are in direct electrical contact with the top surface of the printed circuit board;
a bottom overlay directly and uniformly attached to the bottom surface of the printed circuit board over their entire common surfaces;
a top overlay positioned above the top surface of the printed circuit board; and
a core layer comprised of thermosetting polymeric material positioned between the top surface of the printed circuit board and the top overlay, which thermosetting polymeric material is in physical contact with the plurality of circuit components.
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Abstract
An embedded electronic device and a method for manufacturing the same wherein the embedded electronic device is composed of a printed circuit board, having a top surface and a bottom surface, a plurality of circuit components attached to the top surface of the printed circuit board having a plurality of standoffs on the bottom surface of the printed circuit board, a bottom overlay attached to the bottom surface of the printed circuit board, a top overlay positioned above the top surface of the printed circuit board and a core layer positioned between the top surface of the printed circuit board and the top overlay.
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Citations
19 Claims
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1. An embedded electronic device comprising:
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a printed circuit board, having a top surface and a bottom surface; a plurality of circuit components attached to the top surface of the printed circuit board such that the plurality of circuit components are in direct electrical contact with the top surface of the printed circuit board; a bottom overlay directly and uniformly attached to the bottom surface of the printed circuit board over their entire common surfaces; a top overlay positioned above the top surface of the printed circuit board; and a core layer comprised of thermosetting polymeric material positioned between the top surface of the printed circuit board and the top overlay, which thermosetting polymeric material is in physical contact with the plurality of circuit components. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method for manufacturing an embedded electronic device, comprising:
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providing a printed circuit board having a top surface and a bottom surface; affixing a plurality of circuit components onto the top surface of the printed circuit board such that the plurality of circuit components are in direct electrical contact with the top surface of the printed circuit board; affixing the bottom surface of the printed circuit board to a bottom overlay using pressure sensitive adhesive tape or a spray-on adhesive so that the bottom surface of the printed circuit board is directly and uniformly attached to the bottom overlay over their entire common surfaces; loading the printed circuit board and bottom overlay into an injection molding apparatus; loading a top overlay positioned above a top surface of the printed circuit board into the injection molding apparatus; and injecting the thermosetting polymeric material between the top surface of the printed circuit board, the plurality of circuit components, and the top overlay, which thermosetting polymeric material is in physical contact with the plurality of circuit components. - View Dependent Claims (15, 16, 17, 18, 19)
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Specification