Electro-optic displays, and materials and methods for production thereof
First Claim
1. A process for the production of an electro-optic display, the process comprising:
- forming a sub-assembly comprising in order, a front sheet;
a layer of electro-optic medium; and
an adhesive layer, the adhesive layer being larger in at least one dimension than the layer of electro-optic medium, thereby leaving an area where the adhesive is not covered by the layer of electro-optic medium;
forming an aperture through the adhesive layer in the area where the adhesive layer is not covered by the layer of electro-optic medium;
bringing the sub-assembly having the aperture formed through the adhesive layer adjacent a backplane comprising at least one electrode and having at least one co-operating member associated therewith, with the aperture engaged with a co-operating member, thereby locating the sub-assembly relative to the backplane.
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Accused Products
Abstract
An electro-optic display is produced using a sub-assembly comprising a front sheet, an electro-optic medium; and an adhesive layer. An aperture is formed through the adhesive layer where the adhesive layer is not covered by the electro-optic medium, and the sub-assembly is adhered to a backplane having a co-operating member with the aperture engaged with a co-operating member, thus locating the sub-assembly relative to the backplane. In another form of electro-optic display, a chip extends through an aperture in the electro-optic medium and adhesive layer. In a third form, the aforementioned sub-assembly is secured to a backplane and then a cut is made through both backplane and sub-assembly to provide an aligned edge.
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Citations
13 Claims
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1. A process for the production of an electro-optic display, the process comprising:
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forming a sub-assembly comprising in order, a front sheet;
a layer of electro-optic medium; and
an adhesive layer, the adhesive layer being larger in at least one dimension than the layer of electro-optic medium, thereby leaving an area where the adhesive is not covered by the layer of electro-optic medium;forming an aperture through the adhesive layer in the area where the adhesive layer is not covered by the layer of electro-optic medium; bringing the sub-assembly having the aperture formed through the adhesive layer adjacent a backplane comprising at least one electrode and having at least one co-operating member associated therewith, with the aperture engaged with a co-operating member, thereby locating the sub-assembly relative to the backplane. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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Specification