Self-aligned multi-dielectric-layer lift off process for laser diode stripes

• US 8,728,842 B2
• Filed: 03/20/2012
• Issued: 05/20/2014
• Est. Priority Date: 07/14/2008
• Status: Active Grant

• Current Assignee: Kyocera SLD Laser Incorporated (Kyocera Corporation)
• Original Assignee: Soraa Laser Diode, Inc. (Kyocera Corporation)
• Inventors: Raring, James W., Feezell, Daniel F., Pfister, Nick
• Primary Examiner(s): Swanson, Walter H
• Application Number:
  US13/425,354
• Publication Number:
  US 20120178198A1
• Time in Patent Office: 791 Days
• US Class Current: 438/46
• CPC Class Codes: B82Y 20/00 Nanooptics, e.g. quantum optics or photonic crystals
• CPC Class Codes: H01S 2301/176 Specific passivation layers on surfaces other than the emission facet
• CPC Class Codes: H01S 2304/04 MOCVD or MOVPE
• CPC Class Codes: H01S 5/2086 lateral etch control, e.g. mask induced
• CPC Class Codes: H01S 5/34333 with a well layer based on Ga(In)N or Ga(In)P, e.g. blue laser
• CPC Class Codes: Y10S 438/951 Lift-off
• CPC Class Codes: Y10S 438/981 Utilizing varying dielectric thickness

Abstract

A method for forming a laser diode structure. The method includes providing a laser diode material having a surface region. A multilayer dielectric mask structure comprising alternating first and second dielectric layers is formed overlying the surface region. The method forms a laser diode structure using the multilayer dielectric mask structure as a mask. The method selectively removes a portion of the first dielectric layer to form one or more undercut regions between the second dielectric layers. A passivation layer overlies the multilayer dielectric mask structure and the undercut region remained intact. The dielectric mask structure is selectively removed, exposing a top surface region of the laser diode structure. A contact structure is formed overlying at least the exposed top surface region.

Claims

1. A method for forming a laser diode, comprising:

providing a laser diode structure, comprising an under clad layer, an upper clad layer and an active layer sandwiched between the under clad layer and the upper clad layer;

depositing a multilayer dielectric stack overlying the upper clad layer, the multilayer dielectric stack comprising alternating layers of at least a first dielectric layer and at least a second dielectric layer, wherein the at least first dielectric layer and the at least second dielectric layer are characterized by opposite strain polarities;

selectively removing a portion of the multilayer dielectric stack to form a dielectric mask structure using a pattern and etching process;

removing a portion of the upper clad layer using the dielectric mask structure as a mask to form the laser diode structure, the laser diode structure having an exposed sidewall region and a first exposed region, wherein the portion of the upper clad layer is removed while maintaining the dielectric mask structure substantially intact;

selectively removing a portion of the at least first dielectric layer relative to the at least second dielectric layer to form an undercut region;

depositing at least one passivation layer overlying the first exposed region, the exposed sidewall region, and the dielectric mask structure while maintaining the undercut region;

removing the dielectric mask structure using a selective etch process to expose a top region of the laser diode structure, the undercut region allowing the selective etch process to occur in a lateral direction;

and

forming a contact structure overlying at least the top region of the laser diode structure.

2. The method of claim 1 wherein the upper clad layer comprises a first gallium nitride material.

3. The method of claim 1 wherein the active layer comprises a doped gallium nitride material (InGaN, AlGaN).

4. The method of claim 1 wherein the under clad layer comprises a second gallium nitride material.

5. The method of claim 1 wherein the first dielectric layer overlies the upper clad layer.

6. The method of claim 1 wherein the upper clad layer, the active layer, and the under clad layer are each formed using MOCVD or a molecular beam epitaxial method.

7. The method of claim 1 wherein the at least first dielectric layer includes a silicon oxide material.

8. The method of claim 1 wherein the at least second dielectric layer includes a silicon nitride material.

9. The method of claim 1 wherein selectively removing a portion of the at least first dielectric layer comprises a wet etch process.

10. The method of claim 7 wherein the step of selectively removing the portion of the at least first dielectric layer to form the undercut region comprises a wet etch process that uses at least a buffered HF as an etchant.

11. The method of claim 1 wherein the pattern and etching process includes a patterning step and a dry etch step.

12. The method of claim 1 wherein the undercut region is a void region.

13. The method of claim 1 wherein the at least one passivation layer is selected from ZrO₂, Ta₂O₅, amorphous silicon or a combination thereof and conformally covers the first exposed region.

14. The method of claim 1 wherein the contact structure has a p-type characteristics.

15. The method of claim 1 wherein the contact structure comprises a metal.

16. A method for forming a laser diode, comprising:

providing a laser diode structure comprising an upper layer;

depositing a multilayer dielectric stack overlying the upper layer, the multilayer dielectric stack comprising alternating layers of at least one first dielectric layer and at least one second dielectric layer, wherein the at least one first dielectric layer and the at least one second dielectric layer are characterized by opposite strain polarities;

selectively removing a portion of the multilayer dielectric stack to form a dielectric mask structure using a pattern and etching process;

removing a portion of the upper layer using the dielectric mask structure as a mask to form the laser diode structure, the laser diode structure having an exposed sidewall region and a first exposed region, wherein the portion of the upper layer is removed while maintaining the dielectric mask structure substantially intact;

selectively removing a portion of each of the at least one first dielectric layer to form an undercut region between each of the at least one second dielectric layer;

depositing at least one passivation layer overlying the first exposed region, the exposed sidewall region, and the dielectric mask structure while maintaining the undercut region;

removing the dielectric mask structure using a selective etch process, wherein the selective etch process occurs in a lateral direction within the undercut region; and

exposing a top region of the laser diode structure.