Polyimide precursor composition, use of the of the same, and production method of the same

• US 8,729,402 B2
• Filed: 05/14/2009
• Issued: 05/20/2014
• Est. Priority Date: 05/20/2008
• Status: Active Grant

• Current Assignee: Kaneka Corporation
• Original Assignee: Kaneka Corporation
• Inventors: Sekito, Yoshihide
• Primary Examiner(s): Gulakowski, Randy
• Assistant Examiner(s): WASHVILLE, JEFFREY D
• Application Number:
  US12/992,450
• Publication Number:
  US 20110061914A1
• Time in Patent Office: 1,832 Days
• Field of Search: None
• US Class Current: 174/258
• CPC Class Codes: C08G 18/341 Dicarboxylic acids, esters of polycarboxylic acids containing two carboxylic acid groups
• CPC Class Codes: C08G 18/346 having four carboxylic acid groups
• CPC Class Codes: C08G 18/758 containing two or more cycloaliphatic rings
• CPC Class Codes: C08G 18/7621 being toluene diisocyanate including isomer mixtures
• CPC Class Codes: C08G 73/10 Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• CPC Class Codes: C08G 73/1046 Polyimides containing oxygen in the form of ether bonds in the main chain
• CPC Class Codes: C08G 73/106 containing silicon
• CPC Class Codes: C09D 179/08 Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• CPC Class Codes: G03F 7/037 the binders being polyamides or polyimides
• CPC Class Codes: H05K 1/0346 containing N
• CPC Class Codes: H05K 3/287 Photosensitive compositions

Abstract

An object of the present invention is to provide (i) a polyimide precursor composition which is curable at a low temperature (not more than 250° C.) and which has a low viscosity despite having a high concentration, and a production method thereof, (ii) a polyimide coating film obtained from the polyimide precursor composition and having good properties, and a production method thereof, (iii) a photosensitive resin composition prepared by use of the polyimide precursor composition, and a production method thereof. The object of the present invention can be attained by a polyimide precursor composition containing an imidized tetracarboxylic acid having a specific structure and an isocyanate compound having a specific structure, or optionally a diamine.

Claims

1. A polyimide precursor composition containing at least an isocyanate compound and an imidized tetracarboxylic acid represented by General Formula (1):

2. The polyimide precursor composition as set forth in claim 1, further containing a diamine represented by General Formula (2):

[Chem. 2]

H₂N—

R″

—

NH₂ 

 

(2)

wherein R″

represents a divalent organic group.

3. The polyimide precursor composition as set forth in claim 1, wherein R in General Formula (1) is a tetravalent organic group selected from General Formula Group (1):

4. The polyimide precursor composition as set forth in claim 1, wherein R′

in General Formula (1) has at least a divalent organic group selected from General Formula Group (2);

5. The polyimide precursor composition as set forth in claim 2, wherein R″

in General Formula (2) is a divalent organic group selected from General Formula Group (3);

6. A polyimide precursor composition solution obtained by dissolving a polyimide precursor composition as set forth in claim 1 so that the polyimide precursor composition solution has a solute concentration of 40 to 90% by weight.

7. A polyimide coating film obtained from either a polyimide precursor composition as set forth in claim 1.