Microbolometer contact systems and methods

• US 8,729,474 B1
• Filed: 10/09/2009
• Issued: 05/20/2014
• Est. Priority Date: 10/09/2009
• Status: Active Grant

• Current Assignee: Teledyne FLIR LLC (Teledyne Technologies Incorporated)
• Original Assignee: FLIR Systems, Inc. (Teledyne Technologies Incorporated)
• Inventors: Kurth, Eric A., Franklin, Patrick
• Primary Examiner(s): Porta, David
• Assistant Examiner(s): LEE, SHUN K
• Application Number:
  US12/576,971
• Time in Patent Office: 1,684 Days
• Field of Search: 250/338.4
• US Class Current: 250/338.4
• CPC Class Codes: G01J 5/023 Particular leg structure or construction or shape; Nanotubes
• CPC Class Codes: G01J 5/024 Special manufacturing steps or sacrificial layers or layer structures
• CPC Class Codes: G01J 5/20 using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
• CPC Class Codes: H01L 27/14607 Geometry of the photosensitive area
• CPC Class Codes: H01L 27/1462 Coatings
• CPC Class Codes: H01L 27/14636 Interconnect structures
• CPC Class Codes: H01L 27/14669 Infrared imagers
• CPC Class Codes: H01L 27/14683 Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof not peculiar thereto H01L21/00

Abstract

Systems and methods are directed to contacts for an infrared detector. For example, an infrared imaging device includes a substrate having a first metal layer and an infrared detector array coupled to the substrate via a plurality of contacts. Each contact includes for an embodiment a second metal layer formed on the first metal layer; a third metal layer formed on the second metal layer, wherein the third metal layer at least partially fills an inner portion of the contact; and a first passivation layer formed on the third metal layer.

Claims

1. An infrared imaging device comprising:

a substrate having a first metal layer disposed at least partially on a surface of the substrate;

an infrared detector array coupled to the substrate via a plurality of contacts, wherein each contact comprises;

a second metal layer;

a metal stud having a first end and a second end and disposed between the first metal layer and the second metal layer, wherein the first end is disposed on a portion of the first metal layer that is at least partially on the surface of the substrate;

wherein the second metal layer forms part of a leg metal layer to couple with an infrared detector within the infrared detector array and wherein the second metal layer covers a surface of the second end and wraps around an outer edge of the surface of the second end of the metal stud;

wherein a portion of the second metal layer that wraps around the outer edge of the second end forms a depression in the second metal layer;

a third metal layer formed on the second metal layer, wherein the third metal layer at least partially fills the depression in the second metal layer; and

a first passivation layer formed on the third metal layer.

2. The infrared imaging device of claim 1, wherein a readout integrated circuit is formed within the substrate, and wherein the third metal layer completely fills the depression in the second metal layer.

3. The infrared imaging device of claim 1, wherein the infrared detector array comprises a plurality of microbolometers, and wherein the leg metal layer couples with a corresponding leg of the microbolometer.

4. The infrared imaging device of claim 1, wherein the contact further comprises:

a second passivation layer formed on the second metal layer on a side opposite of where the third metal layer is formed, wherein the second passivation layer is disposed at a top portion of the contact distant from the first metal layer.

5. The infrared imaging device of claim 4, wherein the first passivation layer is made of silicon dioxide, wherein the second passivation layer is made of silicon nitride, and wherein the metal stud is formed by deposition.

6. The infrared imaging device of claim 5, wherein the second metal layer is formed directly on the first metal layer via the metal stud with no intervening liner layer between the second metal layer and the first metal layer, wherein the first metal layer forms part of the readout integrated circuit within the substrate, wherein the infrared detector array comprises a plurality of microbolometers, and wherein the second metal layer forms part of the leg metal layer to couple with a corresponding leg of the microbolometer.

7. The infrared imaging device of claim 1, wherein the infrared detector array comprises a plurality of microbolometers, and wherein each microbolometer comprises:

a resistive material forming a bridge; and

legs coupling the resistive material to the second metal layer, wherein the first metal layer forms part of a readout integrated circuit within the substrate.

8. A method of forming the contact of claim 1 on the substrate for the infrared detector array, the method comprising:

applying a polyimide coating on the substrate;

applying a passivation layer on the polyimide coating;

applying a photoresist pattern on the passivation layer;

etching to expose the first metal layer on the substrate;

forming the first end of the metal stud on the first metal layer;

depositing the second metal layer on the second end of the metal stud so that the second metal layer covers the surface of the second end and wraps around the outer edge of the surface of the second end of the metal stud, wherein the second end is disposed opposite the first end of the metal stud;

applying a photoresist pattern on the second metal layer;

depositing the third metal layer on the second metal layer to at least partially fill the depression in the second metal layer;

applying the first passivation layer on the third metal layer and a portion of the second metal layer; and

etching to release and provide the contact.

9. The method of claim 8, comprising:

applying a photoresist pattern to the substrate;

depositing the first metal layer on the substrate, wherein the first metal layer is coupled to a readout integrated circuit formed within the substrate;

wherein the second metal layer is deposited directly on the metal stud and there is no intervening liner layer between the metal stud and the first metal layer; and

wherein the passivation layer is disposed at a top portion of the contact distant from the first metal layer.

10. The method of claim 9, wherein the infrared detector array comprises a plurality of microbolometers, wherein the second metal layer forms part of a leg metal layer to couple with a corresponding leg of the microbolometer, and wherein the metal stud is formed by deposition.

11. The method of claim 8, comprising:

applying a photoresist pattern on the passivation layer before depositing the second metal layer;

wherein the depositing the third metal layer comprises lifting-off a portion of the third metal layer and removing the photoresist; and

wherein the etching to release comprises;

applying a photoresist pattern over the third metal layer;

performing ion milling; and

removing the photoresist pattern remaining.

12. An infrared imaging device comprising:

a substrate having a first metal layer disposed at least partially on a surface of the substrate;

an infrared detector array coupled to the substrate via a plurality of contacts, wherein each contact comprises;

a metal stud having a first end and a second end, wherein the first end is formed on the first metal layer on at least a portion disposed on the surface of the substrate;

a second metal layer covering a surface of the second end and wrapping around an outer edge of the surface of the second end of the metal stud;

wherein a portion of the second metal layer that wraps around the outer edge of the second end forms a depression in the second metal layer and

a third metal layer formed on the second metal layer, wherein the third metal layer at least partially fills the depression in the second metal layer.

13. The infrared imaging device of claim 12, wherein a readout integrated circuit is formed within the substrate, wherein the third metal layer completely fills the depression in the second metal layer, and wherein each contact further comprises:

a first passivation layer formed on the third metal layer.

14. The infrared imaging device of claim 13, further comprising a second passivation layer formed on the second metal layer on a side opposite of where the third metal layer is formed, wherein the second passivation layer is disposed at a top portion of the contact distant from the metal stud.

15. The infrared imaging device of claim 14, wherein the first passivation layer is made of silicon dioxide, wherein the second passivation layer is made of silicon nitride, and wherein the contact comprises an etch-stop layer disposed between the metal stud and the second metal layer, with the metal stud formed by deposition.

16. The infrared imaging device of claim 12, wherein the infrared detector array comprises a plurality of microbolometers, and wherein the second metal layer forms part of a leg metal layer to couple with a corresponding leg of the microbolometer.

17. The infrared imaging device of claim 12, wherein the second metal layer is formed directly on the metal stud, and wherein the contact comprises a plating base layer disposed between the metal stud and the first metal layer.

18. The infrared imaging device of claim 12, wherein the infrared detector array comprises a plurality of microbolometers, and wherein each microbolometer comprises:

a resistive material forming a bridge; and

legs coupling the resistive material to the second metal layer, wherein the first metal layer forms part of a readout integrated circuit within the substrate.

19. A method of forming the contact of claim 12 on the substrate for the infrared detector array, the method comprising:

applying a polyimide coating on the substrate;

applying a photoresist pattern on the polyimide coating;

etching the polyimide coating to expose the first metal layer on the substrate;

forming the metal stud on the first metal layer;

planarizing a surface of the polyimide coating and the metal stud;

applying a passivation layer on the polyimide coating and the metal stud;

applying a photoresist pattern on the passivation layer;

etching to expose the metal stud; and

depositing the second metal layer on the second end of the metal stud so that the second metal layer covers the surface of the second end and wraps around the outer edge of surface of the second end of the metal stud.

20. The method of claim 19, comprising:

applying a photoresist pattern to a substrate;

depositing the first metal layer on the substrate, wherein the first metal layer is coupled to a readout integrated circuit formed within the substrate;

depositing the third metal layer on the second metal layer;

applying a first passivation layer on the third metal layer and a portion of the second metal layer;

etching to release and provide the contact;

wherein the first passivation layer is disposed at a top portion of the contact distant from the metal stud; and

wherein the etching the polyimide coating and the etching to expose the metal stud comprises subsequently removing the photoresist pattern remaining.

21. The method of claim 19, wherein the infrared detector array comprises a plurality of microbolometers, and wherein the second metal layer forms part of a leg metal layer to couple with a corresponding leg of the microbolometer.

22. The method of claim 21, wherein the infrared detector array comprises a plurality of microbolometers, and wherein the passivation layer, the first passivation layer, and the second metal layer portions released from the contact form part of a bridge of at least one of the microbolometers.

23. The method of claim 19, wherein the forming the metal stud comprises depositing a metal to form the metal stud.

24. The method of claim 19, wherein the forming the metal stud comprises:

depositing a plating base on the polyimide coating and the first metal layer;

performing an electroplating process to form the metal stud over the first metal layer, wherein the plating base is disposed between the metal stud and the first metal layer;

etching the plating base; and

reapplying the polyimide coating and applying a lap-stop material on the polyimide coating prior to the planarizing of the surface which removes the lap-stop material.

25. The method of claim 24, comprising:

applying a lap-stop material on the metal stud prior to the etching of the plating base; and

depositing an etch-stop layer on the metal stud prior to depositing the second metal layer.