Embossed heat spreader

• US 8,730,670 B1
• Filed: 10/21/2011
• Issued: 05/20/2014
• Est. Priority Date: 12/18/2007
• Status: Active Grant

• Current Assignee: Google LLC (Alphabet Inc.)
• Original Assignee: Google Inc. (Alphabet Inc.)
• Inventors: Zohni, Wael O., Smith, Michael J. S., Plunkett, Jeremy Matthew, Schmidt, William
• Primary Examiner(s): THOMPSON, GREGORY D
• Application Number:
  US13/279,068
• Time in Patent Office: 942 Days
• Field of Search: 361/721
• US Class Current: 361/690
• CPC Class Codes: H01L 23/367 Cooling facilitated by shape of device H01L23/38, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence
• CPC Class Codes: H01L 23/4093 Snap-on arrangements, e.g. clips
• CPC Class Codes: H01L 23/42 Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20509 Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures

Abstract

One embodiment of the present invention sets forth a heat spreader module for dissipating thermal heat generated by electronic components. The assembly comprises a printed circuit board (PCB), electronic components disposed on the PCB, a thermal interface material (TIM) thermally coupled to the electronic components, and a heat spreader plate thermally coupled to the TIM. The heat spreader plate includes an embossed pattern. Consequently, surface area available for heat conduction between the heat spreader plate and surrounding medium may be increased relative to the prior art designs.

Claims

1. An apparatus comprising:

a motherboard;

a plurality of sockets electrically connected to the motherboard;

a plurality of memory modules mounted in the plurality of sockets; and

a duct encompassing the plurality of memory modules,

wherein each of the plurality of memory modules comprises;

a first printed circuit board (PCB) having a first side and a second side,

a first set of electronic components disposed on the first side of the first PCB,

a first thermal interface material (TIM) thermally coupled to the first set of electronic components,

a first heat spreader plate thermally coupled to the first TIM and adapted to dissipate thermal heat generated by the first set of electronic components,

a second set of electronic components disposed on the second side of the first PCB,

a second TIM thermally coupled to the second set of electronic components, and

a second heat spreader plate thermally coupled to the second TIM and adapted to dissipate thermal heat generated by the second set of electronic components.

2. The apparatus of claim 1, further comprising a third TIM thermally coupled to the plurality of memory modules.

3. The apparatus of claim 2, further comprising a heat sink assembly thermally coupled to the third TIM.

4. The apparatus of claim 2, wherein the third TIM is disposed between the plurality of memory modules and the duct, and further comprising a heat sink assembly thermally coupled to the duct.

5. The apparatus of claim 2, further comprising a housing thermally coupled to the third TIM and encompassing the motherboard, the plurality of memory modules, and the duct.

6. The apparatus of claim 5, wherein the housing comprises a computer chassis.

7. The apparatus of claim 1, further comprising a processor electrically connected to the motherboard.

8. The apparatus of claim 7, further comprising a heat sink thermally coupled to the processor and adapted to dissipate thermal heat generated by the processor.

9. The apparatus of claim 1, wherein the plurality of memory modules include dual in-line memory modules (DIMMs).

10. The apparatus of claim 1, wherein the first and second set of electronic components include dynamic random access memory chips.

11. The apparatus of claim 1, wherein the first and second heat spreader plates include an embossed pattern.

12. The apparatus of claim 11, wherein the embossed pattern comprises one or more long embossed segments that run substantially an entire length of longitudinal edges of the first and second heat spreader plates.

13. The apparatus of claim 11, wherein the embossed pattern comprises two or more short embossed segments such that, cumulatively, the two or more short embossed segments run substantially an entire length of longitudinal edges of the first and second heat spreader plates.

14. The apparatus of claim 11, wherein the embossed pattern comprises a patterned cylindrical pin array.

15. The apparatus of claim 11, wherein the embossed pattern comprises fins protruding out of the heat spreader plate.

16. The apparatus of claim 1, wherein the first heat spreader plate comprises a second PCB and the second heat spreader plate comprises a third PCB.

17. The apparatus of claim 16, wherein the second and third PCBs include an embossed pattern.

18. The apparatus of claim 17, wherein the embossed pattern comprises fins protruding out of the second and third PCBs.