Composite component and method for producing a composite component

• US 8,730,676 B2
• Filed: 01/25/2010
• Issued: 05/20/2014
• Est. Priority Date: 01/30/2009
• Status: Active Grant

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Hirsch, Michele, Guenther, Michael
• Primary Examiner(s): Datskovskiy, Michail V
• Application Number:
  US13/146,599
• Publication Number:
  US 20120002372A1
• Time in Patent Office: 1,576 Days
• Field of Search: 36167946-67954, 361690-697, 361702-712, 361715-724, 361/736, 361/743, 361/748, 361/750, 361760-767, 361792-795, 174/15.1, 174/16.3, 174250-267, 298/900.3, 298/900.32, 29825-852, 165/80.3, 165/104.33, 165/185, 257706-727, 257/40, 257/190, 257/691, 257/183, 257/18, 257/184, 257/20, 438/465, 438/406, 438106-122, 438/457, 438/458, 428/166, 428/457, 428/172, 428/411.1, 428/701, 428/446, 428/698, 428/113, 428/343, 428/137, 428/209, 428/212
• US Class Current: 361/716
• CPC Class Codes: H01L 2224/2612 Auxiliary members for layer connectors, e.g. spacers
• CPC Class Codes: H01L 2224/32 of an individual layer connector
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 2924/07811 Extrinsic, i.e. with electrical conductive fillers
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 428/24058 including grain, strips, or filamentary elements in respective layers or components in angular relation
• CPC Class Codes: Y10T 428/24562 Interlaminar spaces
• CPC Class Codes: Y10T 428/24612 Composite web or sheet
• CPC Class Codes: Y10T 428/24942 including components having same physical characteristic in differing degree
• CPC Class Codes: Y10T 428/31504 Composite [nonstructural laminate]
• CPC Class Codes: Y10T 428/31663 As siloxane, silicone or silane
• CPC Class Codes: Y10T 428/31678 Of metal

Abstract

A composite component includes a first joining partner, at least one second joining partner and a first joining layer situated between the first joining partner and the second joining partner. In addition to the first joining layer, at least one second joining layer is provided between the first and the second joining partner; and at least one intermediate layer is situated between the first and the second joining layer.

Claims

1. A composite component, comprising:

a first joining partner;

at least one second joining partner;

a first joining layer arranged between the first joining partner and the second joining partner;

at least one second joining layer arranged between the first joining partner and the second joining partner; and

at least one intermediate layer arranged between the first joining layer and the second joining layer,

wherein at least one of a sensor, and an actuator is provided in at least one of (a) the first joining layer, (b) the second joining layer, and (c) the intermediate layer and is electrically conductively connected via through-hole plating to at least one of the first joining partner and the at least one second joining partner.

2. The composite component according to claim 1, wherein a thermal coefficient of expansion of the intermediate layer is at least approximately equal to a thermal coefficient of expansion of at least one of (a) the first joining partner and (b) the second joining partner.

3. The composite component according to claim 1, wherein the first joining layer connects the first joining partner directly to the intermediate layer, and the second joining layer connects the second joining partner directly to the intermediate layer.

4. The composite component according to claim 1, wherein at least one of (a) the first joining layer, (b) the second joining layer, and (c) the intermediate layer is patterned laterally.

5. The composite component according to claim 4, wherein at least one of (a) a fluid channel and (b) a fluid channel network is arranged laterally between patterned sections of at least one of (a) the first joining layer, (b) the second joining layer, and (c) the intermediate layer to guide through a cooling fluid.

6. The composite component according to claim 5, further comprising a device adapted to apply at least one of (a) a fluid, (b) a cooling gas, and (c) a cooling fluid to the at least one of (a) the fluid channel and (b) the fluid channel network.

7. The composite component according to claim 1, wherein at least one of (a) the first joining layer and (b) the second joining layer includes at least one of (a) a sinter layer, (b) an adhesive layer, (c) a soldering metal layer, and (d) an elastomer sealing material.

8. The composite component according to claim 1, wherein at least one of (a) the first joining layer, (b) the second joining layer, and (c) the intermediate layer is at least one of (a) micro-patterned and (b) nano-patterned.

9. The composite component according to claim 1, wherein the sensor is plated through at least one of (a) the first joining layer and (b) the second joining layer.

10. The composite component according to claim 1, wherein the first joining partner includes at least one of (a) an electronic component, (b) a semiconductor element, (c) a power semiconductor element, (d) a circuit substrate, and (e) a circuit substrate that is fitted with components.

11. The composite component according to claim 1, wherein the second joining partner includes at least one of (a) a circuit substrate, (b) a heat sink, (c) a base plate, (d) a cooling body, (e) a housing, (f) an additional module, and (g) a logic module.

13. The method according to claim 12, wherein the composite component is the composite component as recited in claim 1.

14. The composite component according to claim 1, wherein the composite component is produced according to the method recited in claim 12.

12. A method for producing a composite component, comprising:

joining a first joining partner together with at least one second joining partner via at least one first joining layer;

wherein for the joining of the joining partners, in addition at least one second joining layer and an intermediate layer to be situated between the joining layers are provided,

wherein at least one of a sensor, and an actuator is provided in at least one of (a) the first joining layer, (b) the second joining layer, and (c) the intermediate layer and is electrically conductively connected via through-hole plating to at least one of the first joining partner and the at least one second joining partner.