Lightweight audio system for automotive applications and method

• US 8,731,862 B2
• Filed: 08/12/2011
• Issued: 05/20/2014
• Est. Priority Date: 08/18/2006
• Status: Active Grant

• Current Assignee: Aptiv Technologies AG
• Original Assignee: Delphi Technologies, Inc. (BorgWarner Incorporated)
• Inventors: Gupta, Vineet, Huntzinger, Joseph K., Coady, Michael G., Carman, Dan D., Reed, William R.
• Primary Examiner(s): Raymond, Edward
• Application Number:
  US13/208,714
• Publication Number:
  US 20110301906A1
• Time in Patent Office: 1,012 Days
• Field of Search: 702117-119, 702182-185, 702/188
• US Class Current: 702/119
• CPC Class Codes: B29C 59/16 by wave energy or particle radiation , e.g. infrared heating B29C59/007 takes precedence
• CPC Class Codes: B60R 11/02 for radio sets, television sets, telephones, or the like; Arrangement of controls thereof
• CPC Class Codes: G06F 11/00 Error detection; Error correction; Monitoring error detection, correction or monitoring in information storage based on relative movement between record carrier and transducer G11B20/18; monitoring, i.e. supervising the progress of recording or reproducing G11B27/36; in static stores G11C29/00
• CPC Class Codes: H04B 1/082 to be used in vehicles H04B1/086 takes precedence; holding or mounting accessories B60R11/02
• CPC Class Codes: H04R 1/02 Casings; Cabinets ; Supports therefor; Mountings therein H04R1/28 takes precedence ; attachments for microphones H04R1/08; mounting of transducers in earpieces H04R1/1075
• CPC Class Codes: H05K 1/0215 Grounding of printed circuits by connection to external grounding means
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 13/00 Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
• CPC Class Codes: H05K 2201/09081 Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
• CPC Class Codes: H05K 2201/10386 Clip leads; Terminals gripping the edge of a substrate
• CPC Class Codes: H05K 2201/10446 Mounted on an edge soldering edge mounted components H05K3/3405; edge terminals H05K2201/1034
• CPC Class Codes: H05K 5/0217 Mechanical details of casings covers, lids, hoods or members for covering apertures H05K5/03
• CPC Class Codes: H05K 5/0221 Locks; Latches
• CPC Class Codes: H05K 5/0226 Hinges
• CPC Class Codes: H05K 7/20409 Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
• CPC Class Codes: H05K 7/20418 the radiating structures being additional and fastened onto the housing
• CPC Class Codes: H05K 7/20436 Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
• CPC Class Codes: H05K 9/0007 Casings standardised racks H05K9/0062
• CPC Class Codes: H05K 9/0047 being rigid plastic containers having conductive particles, fibres or mesh embedded therein
• CPC Class Codes: H05K 9/0079 Electrostatic discharge protection, e.g. ESD treated surface for rapid dissipation of charges
• CPC Class Codes: H05K 9/0081 : Electromagnetic shielding materials, e.g. EMI, RFI shielding H05K9/0003 takes precedence
• CPC Class Codes: Y10T 29/49002 : Electrical device making
• CPC Class Codes: Y10T 29/49124 : On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49169 : Assembling electrical component directly to terminal or elongated conductor
• CPC Class Codes: Y10T 29/49172 : by molding of insulating material
• CPC Class Codes: Y10T 29/4957 : Sound device making
• CPC Class Codes: Y10T 29/49826 : Assembling or joining
• CPC Class Codes: Y10T 29/49861 : Sizing mating parts during final positional association
• CPC Class Codes: Y10T 29/5313 : Means to assemble electrical device
• CPC Class Codes: Y10T 403/70 : Interfitted members
• CPC Class Codes: Y10T 428/24289 : Embedded or interlocked
• CPC Class Codes: Y10T 74/20396 : Hand operated

Abstract

A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration. The major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The radio architecture includes improved push buttons employing 4-bar living hinge linkage and front loaded decorative trim buttons.

Claims

1. A method of self-testing an automotive audio system apparatus including a microprocessor, a memory device and a plurality of integrated circuits as part of an assembly process, said method comprising the steps of:

programming the microprocessor with predetermined test codes for autonomously confirming the operability of each integrated circuit within said apparatus;

confirming the presence of said apparatus at a test station of an assembly line;

remotely powering said microprocessor and initiating said test codes;

storing any detected fault codes in said memory device; and

remotely reading said memory device and recording any detected fault codes associated with said audio system apparatus.

2. The method of claim 1, further comprising the step of serially remotely powering microprocessors in one or more successive audio system apparatus in said assembly process prior to remotely reading the memory device of said first stated audio system apparatus.

3. The method of claim 1, further comprising the step of generating a flag in response to recording any fault codes.