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Temperature-compensated micro-electromechanical device, and method of temperature compensation in a micro-electromechanical device

  • US 8,733,170 B2
  • Filed: 01/07/2010
  • Issued: 05/27/2014
  • Est. Priority Date: 10/08/2004
  • Status: Active Grant
First Claim
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1. A method, comprising:

  • subjecting a sensor to an acceleration, the sensor having a first microstructure and a second microstructure on a semiconductor substrate, the first microstructure having a first electrode that is moveable relative to the substrate, and the second microstructure having a second electrode that is rigidly fixed to the substrate, the first and second electrodes being substantially symmetrical to each other;

    detecting, from the first microstructure, a first signal that includes an acceleration component and a temperature variation component;

    detecting, from the second microstructure, a second signal that includes a temperature variation component; and

    using the first and second signals to determine a temperature-corrected acceleration signal that corresponds to the acceleration of the sensor.

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