Method and system for packaging MEMS devices with glass seal
First Claim
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1. A method of sealing an electromechanical systems device package, comprising:
- positioning a substrate and a backplane in proximity to each other, the substrate supporting an electromechanical systems device formed thereon;
laser welding the backplane to the substrate to form a seal proximate to a perimeter of the electromechanical systems device, the seal formed only of at least one of substrate material and backplane material fused via the laser welding, the substrate and the backplane encapsulating the electromechanical systems device in a package, wherein the seal is formed of at least one of spin-on glass and glass frit; and
forming a secondary seal on the exterior of the package.
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Abstract
Methods and systems for packaging MEMS devices such as interferometric modulator arrays are disclosed. One embodiment of a MEMS device package structure includes a seal with a chemically reactant getter. Another embodiment of a MEMS device package comprises a primary seal with a getter, and a secondary seal proximate an outer periphery of the primary seal. Yet another embodiment of a MEMS device package comprises a getter positioned inside the MEMS device package and proximate an inner periphery of the package seal.
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Citations
28 Claims
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1. A method of sealing an electromechanical systems device package, comprising:
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positioning a substrate and a backplane in proximity to each other, the substrate supporting an electromechanical systems device formed thereon; laser welding the backplane to the substrate to form a seal proximate to a perimeter of the electromechanical systems device, the seal formed only of at least one of substrate material and backplane material fused via the laser welding, the substrate and the backplane encapsulating the electromechanical systems device in a package, wherein the seal is formed of at least one of spin-on glass and glass frit; and forming a secondary seal on the exterior of the package. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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2. A system for sealing an electromechanical systems device package, comprising:
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a substrate; an electromechanical systems device formed on the substrate; a backplane; a seal positioned proximate to a perimeter of the electromechanical systems device, the seal formed only of at least one of fused substrate material and backplane material, the electromechanical systems device encapsulated between the substrate and the backplane in a package, and the seal is formed of at least one of spin-on glass and glass frit; and a secondary seal disposed on an exterior of the package. - View Dependent Claims (3, 4, 5, 6, 7, 8, 9, 10)
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25. A system for sealing an electromechanical systems device package, comprising:
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a substrate including an electromechanical systems device formed thereon; a backplane including at least one of liquid spin-on glass and glass frit; a seal positioned proximate to a perimeter of the electromechanical systems device, the seal formed only of at least one of fused substrate material and backplane material, and wherein the electromechanical systems device encapsulated between the substrate and the backplane in a package; and a secondary seal disposed on an exterior surface of the package. - View Dependent Claims (26, 27, 28)
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Specification