Optoelectronic component with multi-part housing body

• US 8,735,930 B2
• Filed: 03/09/2005
• Issued: 05/27/2014
• Est. Priority Date: 03/23/2004
• Status: Active Grant

• Current Assignee: OSRAM OLED GMBH (Ams-Osram AG)
• Original Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Inventors: Brunner, Herbert, Winter, Matthias, Zeiler, Markus, Bogner, Georg, Hfer, Thomas
• Primary Examiner(s): SANDVIK, BENJAMIN P
• Application Number:
  US10/593,794
• Publication Number:
  US 20070253667A1
• Time in Patent Office: 3,366 Days
• Field of Search: 257 98-100
• US Class Current: 257/99
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/02325 the optical elements not being integrated nor being directly associated with the device
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01S 5/02234 Resin-filled housings; the housings being made of resin
• CPC Class Codes: H01S 5/02255 using beam deflecting elements
• CPC Class Codes: H01S 5/0232 Lead-frames

Abstract

An optoelectronic component (1) is proposed that comprises a housing body (2) and at least one semiconductor chip (8) disposed thereon, said housing body having a base part (13) comprising a connector body (16), on which a connecting conductor material (6, 7) is disposed, and said housing body having a reflector part (14) comprising a reflector body (23), on which a reflector material (9) is disposed, wherein said connector body and said reflector body are preformed separately from each other and said reflector body is disposed on said connector body in the form of a reflector top.

Claims

1. An optoelectronic component comprising:

a housing body having a cavity in which at least one semiconductor chip is disposed, said housing body;

having a base part comprising a connector body, on which a connecting conductor material is disposed,

having a reflector part comprising a reflector body, on which a reflector material is disposed, wherein said reflector body comprises a ceramic, and having an adhesion promoting part comprising a ceramic, the adhesion promoting part provided with a recess that is part of the cavity of said housing body, the adhesion promoting part disposed such that that the reflector part is between the adhesion promoting part and the base part;

wherein said connector body and said reflector body are preformed separately from each other and said reflector body is disposed on said connector body in the form of a reflector top.

2. The optoelectronic component as in claim 1, wherein said base part and said reflector part are preformed separately from each other.

3. The optoelectronic component as in claim 1, wherein said housing body contains aluminum nitride or aluminum oxide.

4. The optoelectronic component as in claim 1, wherein said connecting conductor material is different from said reflector material.

5. The optoelectronic component as in claim 1, wherein said connecting conductor material contains a metal.

6. The optoelectronic component as in claim 1, wherein said reflector material contains a metal.

7. The optoelectronic component as in claim 1, wherein said connecting conductor material contains Au and said reflector material contains Ag.

8. The optoelectronic component as in claim 1, wherein said reflector body is provided with a recess, said recess is part of the cavity of the housing body and said reflector material is disposed on a wall of said recess.

9. The optoelectronic component as in claim 1, wherein said reflector material is electrically insulated from said connecting conductor material.

10. The optoelectronic component as in claim 1, wherein an insulation part is disposed between said base part and said reflector part.

11. The optoelectronic component as in claim 10, wherein said insulation part is preformed separately from said base part and said reflector part.

12. The optoelectronic component as in claim 1, wherein disposed in the cavity of said housing body is an envelope that at least partially envelops said semiconductor chip.

13. The optoelectronic component as in claim 12, wherein said envelope is arranged at said adhesion promoting part and said envelope adheres better to said adhesion promoting part than it does to said reflector material.

14. The optoelectronic component as in claim 1, wherein said base part includes a heat sink or wherein the optoelectronic component comprises a thermal contact.

15. The optoelectronic component as in claim 14, wherein said heat sink is electrically insulated from said semiconductor chip.

16. The optoelectronic component as in claim 10, wherein the insulation part comprises a ceramic.

17. The optoelectronic component as in claim 10, wherein the insulation part is adhesively attached to said base part and said reflector part.

18. The optoelectronic component as in claim 10, wherein the insulation part is connected to said base part and said reflector part by a sinter bond.

19. The optoelectronic component as in claim 1, wherein the reflector body is coated with the reflector material.