Light emitting diode package and fabrication method thereof

• US 8,735,931 B2
• Filed: 10/19/2010
• Issued: 05/27/2014
• Est. Priority Date: 04/17/2006
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Han, Kyung Taeg, Yeo, In Tae, Hahm, Hun Joo, Song, Chang Ho, Han, Seong Yeon, Na, Yoon Sung, Kim, Dae Yeon, Ahn, Ho Sik, Park, Young Sam
• Primary Examiner(s): Lam, Cathy N
• Application Number:
  US12/907,348
• Publication Number:
  US 20110031526A1
• Time in Patent Office: 1,316 Days
• Field of Search: 257/99, 257/100, 257/E23.066, 257/E21.502, 438/26
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.

Claims

1. A light emitting diode package comprising:

first and second lead frames spaced apart from each other and formed of a heat and electric conductor;

a package body fixing the first and second lead frames while exposing an underside surface of at least one of the first and second lead frames;

a light emitting diode chip disposed on an upper surface of the first lead frame or the second lead frame; and

a transparent encapsulant for encapsulating the light emitting diode chip,

wherein each of the first and second lead frames comprises a planar base and a pair of extensions,

wherein the extensions of the first lead frame extend in opposite directions and an upward direction from opposed ends of the planar base of the first lead frame, and the extensions of the second lead frame extend in opposite directions and an upward direction from opposed ends of the planar base of the second lead frame, and

wherein the planar base and extensions of the first lead frame extend, in a lengthwise direction of the first lead frame, substantially in parallel with those of the second lead frame.

2. The light emitting diode package according to claim 1, wherein the package body has a recess formed around the light emitting diode chip and a protrusion is formed in a predetermined width on an upper end of the recess.

3. The light emitting diode package according to claim 2, wherein a portion of the transparent encapsulant fills the recess and another portion of the transparent encapsulant protrudes over the protrusion in a predetermined curvature.

4. The light emitting diode package according to claim 1, wherein the underside surfaces of the bases of the first and second lead frames are coplanar with an underside surface of the package body.

5. The light emitting diode package according to claim 1, wherein ends of the extensions are positioned at side portions of the package body.

6. The light emitting diode package according to claim 1, wherein at least one of the extensions of the first lead frame extends out of the package body to form a terminal.

7. The light emitting diode package according to claim 1, wherein the second lead frame has a smaller width than the first lead frame.

8. The light emitting diode package according to claim 1, wherein the distal ends of each of the pair of extensions extend to the outside of the package body.

9. The light emitting diode package according to claim 1, wherein the at least one of the first and second lead frames is partially removed from the exposed underside surface thereof or another surface thereof parallel to the exposed underside surface.

10. The light emitting diode package according to claim 1, wherein distal ends of each pair of extensions of the first and second lead frames extend from side portions of the package body.