Wiring board with a built-in component and method for manufacturing the same

• US 8,737,085 B2
• Filed: 05/24/2006
• Issued: 05/27/2014
• Est. Priority Date: 05/24/2006
• Status: Active Grant

• Current Assignee: Dai Nippon Printing Company Limited
• Original Assignee: Dai Nippon Printing Company Limited
• Inventors: Sasaoka, Kenji
• Primary Examiner(s): Bui, Hung S
• Assistant Examiner(s): Wu, James
• Application Number:
  US12/299,861
• Publication Number:
  US 20090107715A1
• Time in Patent Office: 2,925 Days
• Field of Search: 174250-268, 361761-764, 361749-751
• US Class Current: 361/761
• CPC Class Codes: H05K 1/0366 reinforced, e.g. by fibres, fabrics H05K1/036 takes precedence
• CPC Class Codes: H05K 1/186 manufactured by mounting on or connecting to patterned circuits before or during embedding
• CPC Class Codes: H05K 1/188 manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component
• CPC Class Codes: H05K 2201/0355 Metal foils
• CPC Class Codes: H05K 2201/10636 Leadless chip, e.g. chip capacitor or resistor
• CPC Class Codes: H05K 2203/061 of previously made multilayered subassemblies laminating only or mainly similar single-sided circuit boards H05K3/4617; laminating only or mainly similar double-sided circuit boards H05K3/462
• CPC Class Codes: H05K 2203/063 of preperforated insulating layer
• CPC Class Codes: H05K 2203/1189 Pressing leads, bumps or a die through an insulating layer
• CPC Class Codes: H05K 3/429 Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
• CPC Class Codes: H05K 3/4602 characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
• CPC Class Codes: H05K 3/4611 by laminating two or more circuit boards H05K3/4652 takes precedence
• CPC Class Codes: H05K 3/4614 the electrical connections between the circuit boards being made during lamination
• CPC Class Codes: H05K 3/4632 laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
• CPC Class Codes: H05K 3/4647 by applying an insulating layer around previously made via studs
• CPC Class Codes: H05K 3/4652 Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern H05K3/4647 takes precedence
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

Disclosed is a wiring board with a built-in component and a method for manufacturing the same, the wiring board including: a wiring pattern; an electric/electronic component electrically and mechanically connected with a surface of said wiring pattern; and an insulating layer formed on the same surface of said wiring pattern as said electric/electronic component is connected and configured so as to embed said electric/electronic component, said insulating layer having an insulating resin and a reinforcing material included in the insulating resin, wherein the reinforcing material of said insulating layer exists in the insulating resin without reaching a region of said electric/electronic component in a lateral direction, and wherein the insulating resin of said insulating layer reaches said electric/electronic component so as to adhere to said electric/electronic component.

Claims

1. A wiring board with a built-in component, comprising:

a wiring pattern;

an electric/electronic component electrically and mechanically connected with a surface of said wiring pattern; and

an insulating layer formed on the surface of said wiring pattern and configured so as to embed said component, said insulating layer including;

a first sub-layer having a lower surface in contact with said wiring pattern and a lateral surface in contact with said component; and

a second sub-layer laminated on an upper surface of said first sub-layer, said second sub-layer having an opening formed therethrough, said opening having an edge surrounding and spaced away from said component,

said first sub-layer and said second sub-layer each having an insulating resin and a reinforcing material included in the insulating resin,

said first sub-layer having a thickness such that said upper surface of said first sub-layer is at a level between an upper surface of said component and a lower surface of said component; and

an interlayer connector penetrating through said first sub-layer, said interlayer connector having an axis along a stacking direction of said wiring board and being connected to said component electrically through said wiring pattern,

wherein said reinforcing material of said first sub-layer reaches said interlayer connector without reaching said component; and

wherein said insulating resin of said first sub-layer reaches said interlayer connector and said component, and occupies a space between said edge of said opening of said second sub-layer and said component.

2. The wiring board as set forth in claim 1, further comprising:

a second insulating layer laminated on an upper surface of said second sub-layer; and

a second wiring pattern sandwiched by said second sub-layer and said second insulating layer.

3. The wiring board as set forth in claim 1, further comprising:

a second insulating layer formed on a different surface of said wiring pattern from the surface with which said component is connected.

4. The wiring board as set forth in claim 3, further comprising:

a second wiring pattern formed on an opposite surface of said second insulating layer to a surface thereof adjacent to said wiring pattern.

5. The wiring board as set forth in claim 4, further comprising:

a second interlayer connector made of conductive composition, sandwiched between said wiring pattern and said second wiring pattern by penetrating through said second insulating layer, and configured such that said second interlayer connector has an axis along a stacking direction of said wiring board and a diameter of said second interlayer connector is varied along said axis.

6. The wiring board as set forth in claim 4, further comprising:

a second interlayer connector made of conductive composition, sandwiched between said wiring pattern and said second wiring pattern by penetrating through said second insulating layer, and configured such that said second interlayer connector has an axis along a stacking direction of said wiring board and a diameter of said second interlayer connector is not varied along said axis.

7. The wiring board as set forth in claim 4, further comprising:

a second interlayer connector made of metallic material, sandwiched between said wiring pattern and said second wiring pattern by penetrating through said second insulating layer, and configured such that said second interlayer connector has an axis along a stacking direction of said wiring board and a diameter of said second interlayer connector is varied along said axis.

8. The wiring board as set forth in claim 4, further comprising:

a second interlayer connector made of metallic material, sandwiched between said wiring pattern and said second wiring pattern by penetrating through said second insulating layer, and configured such that said second interlayer connector has an axis along a stacking direction of said wiring board and a diameter of said second interlayer connector is not varied along said axis.

9. The wiring board as set forth in claim 4, further comprising:

a conductor formed on an inner wall of a through hole formed in said second insulating layer so as to electrically connect said wiring pattern and said second wiring pattern.

10. The wiring board as set forth in claim 2, further comprising:

a third wiring pattern formed on a surface of said second insulating layer, said surface of said second insulating layer being at a first side opposite to a second side of said second insulating layer where said second wiring pattern is placed; and

a second interlayer connector sandwiched between said second wiring pattern and said third wiring pattern by penetrating through said second insulating layer.

11. The wiring board as set forth in claim 10,

wherein said second interlayer connector is made of conductive composition and configured so as to have an axis along a stacking direction of said wiring board;

and

wherein a diameter of said second interlayer connector is varied along said axis.

12. The wiring board as set forth in claim 10,

wherein said second interlayer connector is made of conductive composition and configured so as to have an axis along a stacking direction of said wiring board;

and

wherein a diameter of said second interlayer connector is not varied along said axis.

13. The wiring board as set forth in claim 10,

wherein said second interlayer connector is made of metallic material and configured so as to have an axis along a stacking direction of said wiring board;

and

wherein a diameter of said second interlayer connector is varied along said axis.

14. The wiring board as set forth in claim 10,

wherein said second interlayer connector is made of metallic material and configured so as to have an axis along a stacking direction of said wiring board;

and

wherein a diameter of said second interlayer connector is not varied along said axis.

15. The wiring board as set forth in claim 2, further comprising:

a third wiring pattern sandwiched between said first sub-layer and said second sub-layer,

wherein said interlayer connector is sandwiched between said wiring pattern and said third wiring pattern.

16. The wiring board as set forth in claim 15,

wherein said interlayer connector is made of conductive composition;

and

wherein a diameter of said interlayer connector is varied along said axis.

17. The wiring board as set forth in claim 15,

wherein said interlayer connector is made of conductive composition;

and

wherein a diameter of said interlayer connector is not varied along said axis.

18. The wiring board as set forth in claim 1,

wherein said component is a 0402 component with a size of 0.4 mm×

0.2 mm, and

wherein when said opening of said second sub-layer is viewed in plane, said opening is shaped circularly so that a diameter of said opening is set with a range of 0.45 mm to 1.0 mm or shaped rectangularly so that a size of said region is set within a range of 0.41 mm×

0.21 mm to 0.7 mm×

0.5 mm.

19. The wiring board as set forth in claim 1,

wherein said component is a 0603 component with a size of 0.6 mm×

0.3 mm, and

wherein when said opening of said second sub-layer is viewed in plane, said opening is shaped circularly so that a diameter of said opening is set with a range of 0.68 mm to 1.5 mm or shaped rectangularly so that a size of said opening is set within a range of 0.61 mm×

0.31 mm to 1.2 mm×

0.9 mm.

20. The wiring board as set forth in claim 1,

wherein said component is a 1005 component with a size of 1.0 mm×

0.5 mm, and

wherein when said opening of said second sub-layer is viewed in plane, said opening is shaped circularly so that a diameter of said opening is set with a range of 1.15 mm to 2.5 mm or shaped rectangularly so that a size of said opening is set within a range of 1.01 mm×

0.51 mm to 1.6 mm×

1.1 mm.

21. A method for manufacturing a wiring board with a built-in component, comprising:

electrically and mechanically connecting an electric/electronic component with a metallic foil;

disposing, on said metallic foil, a first insulating layer having an opening larger than said component for accommodating said component, said opening having an edge, said first insulating layer having a first sub-layer whose lower surface faces said metallic foil and a second sub-layer laminated on an upper surface of said first sub-layer, said first sub-layer and said second sub-layer each having an insulating resin and a reinforcing material included in said insulating resin, said first sub-layer having a thickness such that said upper surface of said first sub-layer is at a level between an upper surface of said component and a lower surface of said component;

disposing a second insulating layer on said first insulating layer;

pressing, heating, and laminating said metallic foil, said first insulating layer, and said second insulating layer into an integrated structure while said insulating resin of said first sub-layer is rendered fluid so as to occupy a space between said edge of said opening in said second sub-layer and said component, and then, hardening said structure in a state in which said first sub-layer has a lateral surface in contact with said component, and said reinforcing material of said first sub-layer does not reach said component in a lateral direction; and

forming an interlayer connector penetrating through said first sub-layer, said interlayer connector having an axis along a stacking direction of said wiring board, being connected to said component electrically through said metallic foil, and being in contact with said reinforcing material of said first sub-layer.

22. A method for manufacturing a wiring board with a built-in component, comprising:

electrically and mechanically connecting an electric/electronic component with a metallic wiring pattern formed on a first insulating layer;

disposing, on said metallic wiring pattern, a second insulating layer having an opening larger than said component for accommodating said component, said opening having an edge, said second insulating layer having a first sub-layer whose lower surface faces said metallic wiring pattern and a second sub-layer laminated on an upper surface of said first sub-layer, said first sub-layer and said second sub-layer each having an insulating resin and a reinforcing material included in said insulating resin, said first sub-layer having a thickness such that said upper surface of said first sub-layer is at a level between an upper surface of said component and a lower surface of said component;

disposing a third insulating layer on said second insulating layer;

pressing, heating, and laminating said first insulating layer, said metallic wiring pattern, said second insulating layer, and third insulating layer into an integrated structure while said insulating resin of said first sub-layer is rendered fluid so as to occupy a space between said edge of said opening in said second sub-layer and said component, and then, hardening said structure in a state in which said first sub-layer has a lateral surface in contact with said component, and said reinforcing material of said first sub-layer does not reach said component in a lateral direction; and

forming an interlayer connector penetrating through said first sub-layer, said interlayer connector having an axis along a stacking direction of said wiring board, being connected to said component electrically through said metallic wiring pattern, and being in contact with said reinforcing material of said first sub-layer.