Light-emitting-element mounting package, light emitting device, backlight, and liquid crystal display device

• US 8,740,409 B2
• Filed: 02/23/2010
• Issued: 06/03/2014
• Est. Priority Date: 03/11/2009
• Status: Expired due to Fees

• Current Assignee: Sony Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Nakata, Hidehiko, Kawasumi, Takayuki, Memezawa, Akihiko
• Primary Examiner(s): Lee, Jong-Suk (James)
• Assistant Examiner(s): Gyllstrom, Bryon T
• Application Number:
  US12/710,689
• Publication Number:
  US 20100231824A1
• Time in Patent Office: 1,561 Days
• Field of Search: 362/612, 362/613, 362/249.02, 362/311.02, 362/97.3
• US Class Current: 362/249.02
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A small and thin, light-emitting-element mounting package is provided, in which light emitting elements may by independently controlled despite a side view type package, and a light emitting device using the package is provided. The light-emitting-element mounting package includes a lead frame. The lead frame has at least one set of a structure including a lower conductor layer, an insulating layer and an upper conductor layer in this order, and a mounting area exposed on a surface of the lower conductor layer.

Claims

1. A light-emitting-element mounting package comprising:

a plurality of lead frames arranged horizontally side by side, the plurality of lead frames extending into a cavity of a mold portion that contains a phosphor-mixed resin or a transparent resin, each of the lead frames including at least one set of a structure including a lower conductor layer, an insulating layer and an upper conductor layer stacked in a direction of stacking in this order, the lower conductor layer and the upper conductor layer in a first one of the lead frames forming two stacked terminals that are electrically independent of terminals formed by the lower conductor layer and the upper conductor layer in a second one of the lead frames, and the lower conductor layer and the upper conductor layer in each of the plurality of lead frames are configured to be electrically connected to a mounting board so that a side of the plurality of lead frames in the direction of stacking faces a mounting surface of the mounting board that the light-emitting-element mounting package is configured to be mounted on,

in at least one set, an inner end of the insulating layer and an inner end of the upper conductive layer is aligned at an edge and a portion of the lower conductor layer extends further inward from the edge, and

in at least one set, a mounting area is exposed on a surface of the portion of the lower conductor layer that extends further inward from the edge.

2. The light-emitting-element mounting package according to claim 1,

wherein the plurality of lead frames are integrated with a light emitting element by the mold portion.

3. The light-emitting-element mounting package according to claim 2,

wherein bottom layers of the lower conductor layers are common to one another so that the plurality of lead frames are integrated.

4. The light-emitting-element mounting package according to claim 1,

wherein in at least one set, the layers all extend parallel to one another in a direction perpendicular to the direction of stacking.

5. The light-emitting-element mounting package according to claim 1, wherein a thickness of the light-emitting-element mounting package is 0.8 mm or less.

6. The light-emitting-element mounting package according to claim 1, wherein the lower conductor layer in at least the first one of the lead frames includes a double layer structure, and the double layer structure includes an upper layer that is a light reflector and a lower layer that is a heat conductor.

7. The light-emitting-element mounting package according to claim 6, wherein the light reflector includes a reflectance in a wavelength range of red to blue light.

8. A light emitting device, comprising:

a plurality of lead frames arranged horizontally side by side, the plurality of lead frames extending into a cavity of a mold portion that contains a phosphor-mixed resin or a transparent resin, each of the lead frames including at least one set of a structure including a lower conductor layer, an insulating layer and an upper conductor layer stacked in a direction of stacking in this order, the lower conductor layer and the upper conductor layer in a first one of the lead frames forming two stacked terminals that are electrically independent of terminals formed by the lower conductor layer and the upper conductor layer in a second one of the lead frames, and the lower conductor layer and the upper conductor layer in each of the plurality of lead frames are configured to be electrically connected to a mounting board so that a side of the plurality of lead frames in the direction of stacking faces a mounting surface of the mounting board that the light emitting device is configured to be mounted on, in at least one set, an inner end of the insulating layer and an inner end of the upper conductive layer is aligned at an edge and a portion of the lower conductor layer extends further inward from the edge, and in at least one set, a mounting area is exposed on a surface of the portion of the lower conductor layer that extends further inward from the edge; and

a light emitting element including a pair of electrodes while being mounted in the mounting area of the lead frame, the pair of electrodes being electrically connected to the lower conductor layer and the upper conductor layer, respectively.

9. The light emitting device according to claim 8,

wherein both the lower conductor layer and the upper conductor layer are formed of a metal material having high reflectance.

10. The light emitting device according to claim 8,

wherein light emitting elements are mounted on the plurality of lead frames, respectively, and

the plurality of lead frames are integrated with the light emitting elements by the mold portion.

11. The light emitting device according to claim 10,

wherein two lead frames are provided,

a blue light emitting diode is mounted on one of the lead frames, and a red light emitting diode is mounted on the other thereof,

the blue light emitting diode and the red light emitting diode are disposed within the cavity of the mold portion, and

the cavity is filled with resin containing a green phosphor.

12. The light emitting device according to claim 10,

wherein two lead frames are provided, and

a blue light emitting diode, a red light emitting diode, and a green light emitting diode are mounted on the lead frames.

13. The light emitting device according to claim 8,

wherein a bottom layer of the lower conductor layer is formed thick compared with a conductor layer above the bottom layer, and thus acts even as a heat release section, and

heat generated by the light emitting element is released from the lower conductor layer.

14. The light emitting device according to claim 13,

wherein the lower conductor layer acting even as the heat release section includes a second layer having high reflectance formed on a first layer having high heat conductivity.

15. The light emitting device according to claim 14,

wherein a red light emitting element is mounted on the lower conductor layer having heat release capability.

16. The light emitting device according to claim 8, wherein the lower conductor layer in at least the first one of the lead frames includes a double layer structure, and the double layer structure includes an upper layer that is a light reflector and a lower layer that is a heat conductor.

17. A backlight comprising:

a light emitting device emitting white light; and

a light guide plate guiding light emitted from the light emitting device in a planar direction;

wherein the light emitting device includes

a plurality of lead frames arranged horizontally side by side, the plurality of lead frames extending into a cavity of a mold portion that contains a phosphor-mixed resin or a transparent resin, each of the lead frames including at least one set of a structure including a lower conductor layer, an insulating layer and an upper conductor layer stacked in a direction of stacking in this order, the lower conductor layer and the upper conductor layer in a first one of the lead frames forming two stacked terminals that are electrically independent of terminals formed by the lower conductor layer and the upper conductor layer in a second one of the lead frames, and the lower conductor layer and the upper conductor layer in each of the plurality of lead frames are configured to be electrically connected to a mounting board so that a side of the plurality of lead frames in the direction of stacking faces a mounting surface of the mounting board that the light emitting device is configured to be mounted on, in at least one set, an inner end of the insulating layer and an inner end of the upper conductive layer is aligned at an edge and a portion of the lower conductor layer extends further inward from the edge, and in at least one set, a mounting area is exposed on a surface of the portion of the lower conductor layer that extends further inward from the edge, and

a light emitting element including a pair of electrodes while being mounted in the mounting area of the lead frame, the pair of electrodes being electrically connected to the lower conductor layer and the upper conductor layer, respectively.

18. The backlight according to claim 17, wherein the lower conductor layer in at least the first one of the lead frames includes a double layer structure, and the double layer structure includes an upper layer that is a light reflector and a lower layer that is a heat conductor.

19. A liquid crystal display device comprising:

a backlight including a light emitting device emitting white light, and a light guide plate guiding light emitted from the light emitting device in a planar direction; and

a liquid crystal display panel polarizing light emitted from the backlight,

wherein the light emitting device includes

a plurality of lead frames arranged horizontally side by side, the plurality of lead frames extending into a cavity of a mold portion that contains a phosphor-mixed resin or a transparent resin, each of the lead frames including at least one set of a structure including a lower conductor layer as a first electrode terminal, an insulating layer, and an upper conductor layer as a second electrode terminal stacked in a direction of stacking in this order, the lower conductor layer and the upper conductor layer in a first one of the lead frames forming two stacked terminals that are electrically independent of terminals formed by the lower conductor layer and the upper conductor layer in a second one of the lead frames, and the lower conductor layer and the upper conductor layer in each of the plurality of lead frames are configured to be electrically connected to a mounting board so that a side of the plurality of lead frames in the direction of stacking faces a mounting surface of the mounting board that the light emitting device is configured to be mounted on, in at least one set, an inner end of the insulating layer and an inner end of the upper conductive layer is aligned at an edge and a portion of the lower conductor layer extends further inward from the edge, and in at least one set, a mounting area is exposed on a surface of the portion of the lower conductor layer that extends further inward from the edge, and

a light emitting element including a pair of electrodes while being mounted in the mounting area of the lead frame, the pair of electrodes being electrically connected to the lower conductor layer and the upper conductor layer, respectively.

20. The liquid crystal display device according to claim 19, wherein the lower conductor layer in at least the first one of the lead frames includes a double layer structure, and the double layer structure includes an upper layer that is a light reflector and a lower layer that is a heat conductor.